This application claims the benefit of U.S. provisional application Ser. No. 60/000,515, filed Jun. 26, 1995 (pending) which is incorporated herein by reference.
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4222792 | Lever et al. | Sep 1980 | |
4789648 | Chow et al. | Dec 1988 | |
4944836 | Beyer et al. | Jul 1990 | |
5302233 | Kim et al. | Apr 1994 | |
5312512 | Allman et al. | May 1994 | |
5397741 | O'Connor et al. | Mar 1995 | |
5447874 | Grivna et al. | Sep 1995 | |
5449314 | Meikle et al. | Sep 1995 | |
5516729 | Dawson et al. | May 1996 | |
5525191 | Maniar et al. | Jun 1996 | |
5612254 | Mu et al. | Mar 1997 |
Entry |
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Research Disclosure No. 328, August 1991, p. 583 Preimidization Chemical Mechanical Polishing of Polyimide Coatings. |
Sivaram et al., Solid State Technology, vol. 35, No. 5, May 1992, pp. 87-91, "Planarizing Interlevel Dielectrics by Chemical-Mechanical Polishing". |
Homma et al., Feb. 22-23, 1996 CMP-MIC Conference, pp. 67-73, "Selective CMP of Organic SOG for Low Parasitic Capacitance Quarter-Micron, Multilevel Interconnections". |