The present invention relates to programmable integrated circuit structures, and more particularly, to routing structures incorporating composite materials having an electrically programmable resistivity.
Programmable semiconductor devices include programmable read only memories (“PROMs”), programmable logic devices (“PLDs”), and programmable gate arrays. Programmable elements suitable for one or more of these device types include so-called “fuses” and “antifuses”.
A “fuse” is a structure which electrically couples a first terminal to a second terminal, but which, when programmed by passage of sufficient current between its terminals, electrically decouples the first terminal from the second terminal. A fuse typically consists of a conductive material which has a geometry that causes portions of the conductive fuse material to physically separate from each other to produce an open circuit when the fuse is heated to a given extent.
An “antifuse” is a structure, which when un-programmed, does not electrically couple its first and second terminals, but which, when programmed by applying sufficient voltage between the first and second terminals, permanently electrically connects the first and second terminals. One type of antifuse includes a highly resistive material between two terminals of conductive material, which when heated by an electric current, heats the materials and causes portions of the conductive material to extend into the resistive material and form a permanent conductive path. Another type of antifuse can be made of amorphous silicon which forms conductive polysilicon when heated. Fuses and antifuses have in common that their respective conductive state, once changed, cannot be reversed to again assume the initial state.
It would therefore be desirable to provide a connection between terminals, for example, of an integrated circuit, that can be programmed to switch between different conductive states in a reversible manner, i.e., that can operate reversibly both as fuses and as antifuses.
These and other needs are met by embodiments of the present invention which provide a semiconductor device comprising a first electrical contact, a second electrical contact, and an interconnect between the first and second electrical contacts. The interconnect has a reversibly programmable resistance. In certain embodiments of the invention, the interconnect consists of a molecular matrix, and in further embodiments, ionic complexes are distributed through the molecular matrix. These ionic complexes are dissociable in the molecular matrix under the influence of an applied electrical field.
The use of an interconnect with a reversibly programmable resistance allows an integrated circuit to be programmed in a fully reversible manner. Thus, fuses and anti-fuses can be replaced by the reversible interconnect of the present invention within integrated circuits.
In other aspects of the invention, the earlier stated needs are also met by providing a programmable interconnect structure comprising first and second electrical contacts, and an interconnect between the first and second electrical contacts. The interconnect comprises a material that has reversibly programmable resistivity, the material comprising molecular matrix, and in certain embodiments, ionic complexes are distributed through the molecular matrix.
The earlier stated needs are also met by a method of electrically connecting and disconnecting electrical contacts in a circuit by programming of an electrical interconnect between electrical contacts, in accordance with the embodiments of the present invention. The steps include selectively applying a first electrical field or a first current to the electrical interconnect to program the electrical interconnect to assume a first state of conductivity to electrically connect the electrical contacts through the electrical interconnect. The steps also include selectively applying a second electrical field or second current to the electrical interconnect to program the electrical interconnect to assume a second state of conductivity to electrically isolate the electrical contacts through the electrical interconnect. The electrical interconnect comprises a material that has a reversibly programmable conductivity. The material comprises a molecular matrix. In certain embodiments, ionic complexes are distributed through the molecular matrix.
The foregoing and other features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
a–3d provide a schematic depiction of a molecular composite interconnect structure in various operational states, in accordance with embodiments of the present invention.
The present invention addresses and solves problems related to the programming of integrated circuit structures, which have in the past been limited to fuses and anti-fuses that may be programmed only in a single direction. The present invention overcomes these problems in part, by the provision of an electrical interconnect between electrical contacts, with the interconnect having a reversibly programmable resistance. By programming the resistance, an electrical connection may be made between the electrical contacts, or the contacts may be electrically isolated from each other. The programmable resistance is provided by the interconnect which is made of a molecular matrix with ionic complexes distributed through the molecular matrix. These ionic complexes are dissociable in the molecular matrix under the influence of an applied electrical field.
Referring now to
Referring now to
The FET 20 has source and drain regions 24, 26 and a gate 28 insulated by a gate oxide 31. The conductive channel of the FET 20 is indicated by the reference numeral 21. As seen from
A molecular composite material having a programmable electrical resistance is applied to the top surface of insulating layer 33 by conventional deposition techniques, such as spin coating, or evaporation, for example. The molecular composite material has the property of preferably adhering to the exposed conductive metal pads 30a, 30b, but not to the surface of the insulating SiO2 or Si3N4 layer 33. The molecular composite material hence can form respective two-terminal resistance elements 35a, 35b whose linear dimensions are defined by the size of the conductive pads 30a, 30b, with the thickness of the two-terminal elements 35a, 35b being controlled by the deposition condition (e.g., the spinning speed or evaporation rate) of the molecular composite material.
An exemplary suitable molecular composite material will be described below. The molecular composite material can be deposited at a low temperature which can be considerably lower than temperatures employed in traditional Si processing. Metal or semiconductor layers 38a, 38b (e.g., Al or poly-Si) can then be selectively applied to the top surface of the two-terminal elements 35a, 35b to provide an electrical connection to another component or device of the device structure 20.
The reversibly programmable two-terminal elements 35a, 35b have the advantage over conventional fuses and antifuses in that their resistance can be reversibly changed back and forth between a high-resistance state (“off”) and a low-resistance state (“on”).
An exemplary molecular composite material that can be used for fabricating the two-terminal elements 35a, 35b is shown in
There are two predominant types of structural organization of such systems. First, there are strands of linear conjugated polymers, which are weakly bonded to each other and whose mutual arrangement is generally poorly organized. Second, there are crystal structures, where the individual molecules form one-dimensional columns and interact with each other much more actively than molecules from different columns do.
Polyconjugated systems primarily involve polyvinylenes, i.e., polymers with an acyclic conjugation system, in which the one-dimensional character of structure is dictated by the mechanism of conjugation in linear macromolecules. Polyacetylene is a classical representative of this class of polymers. Its electronic structure is a prototype for many other conjugated polymers.
Another wide class of molecular compounds are formed from aromatic and heterocyclic molecules which possess high electric conductivity due to π-bonds between molecules. Such molecular systems are called π-complexes or charge transfer complexes, with those systems whose structure involves isolated one-dimensional columns or strands possessing pronounced electro-physical properties of interest for switching and memory applications. Molecular charge transfer complexes are donor-acceptor systems formed from two molecules: one possessing donor and another acceptor properties. Among the well-defined complexes with a one-dimensional structure, tetra-cyano-quino-dimethane (TCNQ) are planar molecules with unsaturated bonds, arranged in a crystal as parallel stacks forming a quasi-one-dimensional system.
In another class of one-dimensional systems, the cations are dynamically disordered. It involves molecular compounds having the general formula (TMTSF)2X. Transition metal salts of K2 Pt(CN)4 Br0.3×3H2O (KCP) type are also the typical representatives of mixed-valence quasi-one-dimensional complexes, as are phthalocyanines and porphyrins. Moreover, pure inorganic compounds, such as NbSe3, are also interesting examples of compounds with quasi-one-dimensional structure.
The molecular composite includes a quasi-one-dimensional—or at least structurally and electrically anisotropic—molecular matrix, wherein ionic complexes are distributed in the matrix. Polyconjugated compounds, such as the exemplary quasi-one-dimensional systems described above, for example, polyphenylacetylene, can be used as the anisotropic molecular matrix. The ionic complex can be a salt, such as sodium chloride (NaCl), or any other material that can dissociate in an applied electric field. The exemplary anisotropic molecular matrix is depicted in
While not being bound by theory, the following is currently believed by the inventors to describe the mechanism for the conductivity change of the molecular composite material. Electric switching in the molecular thin films depicted in
Two modes of the two-terminal device operation can be identified: a metastable mode (
a illustrates the “off” state, where the electrical conductivity is essentially zero, assuming that the anisotropic molecular matrix itself is a good electrical insulator. When an external electric field E is applied, as indicated in
Referring now to
The present invention thus provides interconnect structure and integrated circuit devices that employ a molecular composite material that has a reversibly programmable resistance. This creates interconnects that can be programmed and re-programmed between conductive and non-conductive, overcoming limitations of fuses and anti-fuses and increasing flexibility for circuit designers.
Although the present invention has been described and illustrated in detail, it is to be clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the scope of the present invention being limited only by the terms of the appended claims.
This application is a divisional application of U.S. patent application Ser. No. 10/139,381, entitled “REVERSIBLE FIELD-PROGRAMMABLE ELECTRIC INTERCONNECTS”, filed on May 7, 2002 now U.S. Pat. No. 6,844,608, which claims benefit under 35 U.S.C. 119(e), of application Ser. No. 60/289,061, entitled “REVERSIBLY FIELD-PROGRAMMABLE ELECTRIC INTERCONNECTS”, filed on May 7, 2001. The entireties of the above-noted applications are incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
3719933 | Wakabayahi et al. | Mar 1973 | A |
3810127 | Hoff, Jr. | May 1974 | A |
4267558 | Guterman | May 1981 | A |
4267583 | Suzuki | May 1981 | A |
4371883 | Potember et al. | Feb 1983 | A |
4616340 | Hayashi et al. | Oct 1986 | A |
4631562 | Avery | Dec 1986 | A |
4652894 | Potember et al. | Mar 1987 | A |
4677742 | Johnson | Jul 1987 | A |
4733375 | Terashima | Mar 1988 | A |
4834911 | Carew | May 1989 | A |
4839700 | Ramesham et al. | Jun 1989 | A |
4860254 | Pott et al. | Aug 1989 | A |
5012445 | Kazuaki et al. | Apr 1991 | A |
5034192 | Wrighton et al. | Jul 1991 | A |
5130380 | Carew | Jul 1992 | A |
5136212 | Eguchi et al. | Aug 1992 | A |
5153681 | Kishimoto et al. | Oct 1992 | A |
5196912 | Matsumoto et al. | Mar 1993 | A |
5206525 | Yamamoto et al. | Apr 1993 | A |
5245543 | Smayling et al. | Sep 1993 | A |
5296716 | Ovshinsky et al. | Mar 1994 | A |
5315131 | Kishimoto et al. | May 1994 | A |
5319564 | Smayling et al. | Jun 1994 | A |
5355235 | Nishizawa et al. | Oct 1994 | A |
5392236 | Hashimoto | Feb 1995 | A |
5412614 | Bird | May 1995 | A |
RE34974 | Terashima | Jun 1995 | E |
5431883 | Barraud | Jul 1995 | A |
5440518 | Hazani | Aug 1995 | A |
5451811 | Whitten et al. | Sep 1995 | A |
5563081 | Ozawa | Oct 1996 | A |
5572472 | Kearney et al. | Nov 1996 | A |
5579199 | Kawamura et al. | Nov 1996 | A |
5670818 | Forouhi et al. | Sep 1997 | A |
5691935 | Douglass | Nov 1997 | A |
5698874 | Hayashi | Dec 1997 | A |
5734605 | Zhu et al. | Mar 1998 | A |
5761115 | Kozicki et al. | Jun 1998 | A |
5770885 | McCollum et al. | Jun 1998 | A |
5818749 | Harshfield | Oct 1998 | A |
5849403 | Aoki et al. | Dec 1998 | A |
5869882 | Chen et al. | Feb 1999 | A |
5896312 | Kozicki et al. | Apr 1999 | A |
5900662 | Frisina et al. | May 1999 | A |
5914893 | Kozicki et al. | Jun 1999 | A |
6055180 | Gudesen et al. | Apr 2000 | A |
6060338 | Tanaka et al. | May 2000 | A |
6064589 | Walker | May 2000 | A |
6088319 | Gudesen | Jul 2000 | A |
6118684 | Yihong et al. | Sep 2000 | A |
6128214 | Kuekes et al. | Oct 2000 | A |
6150705 | Chen | Nov 2000 | A |
6288697 | Eto et al. | Sep 2001 | B1 |
6292396 | Tailliet | Sep 2001 | B1 |
6326936 | Inganas et al. | Dec 2001 | B1 |
6349054 | Hidaka | Feb 2002 | B1 |
6353559 | Hasegawa et al. | Mar 2002 | B2 |
6384427 | Yamazaki et al. | May 2002 | B1 |
6403396 | Gudesen et al. | Jun 2002 | B1 |
6403397 | Katz | Jun 2002 | B1 |
6407953 | Cleeves | Jun 2002 | B1 |
6418049 | Kozicki et al. | Jul 2002 | B1 |
6424553 | Berggren et al. | Jul 2002 | B2 |
6426891 | Katori | Jul 2002 | B1 |
6429457 | Berggren et al. | Aug 2002 | B1 |
6432739 | Gudesen et al. | Aug 2002 | B1 |
6449184 | Kato et al. | Sep 2002 | B2 |
6459095 | Heath et al. | Oct 2002 | B1 |
6461916 | Adachi et al. | Oct 2002 | B1 |
6473351 | Tomanek et al. | Oct 2002 | B2 |
6487106 | Kozicki et al. | Nov 2002 | B1 |
6621740 | Hosogane et al. | Sep 2003 | B2 |
6627944 | Mandell et al. | Sep 2003 | B2 |
6635914 | Kozicki et al. | Oct 2003 | B2 |
6670637 | Yamazaki et al. | Dec 2003 | B2 |
6781868 | Bulovic et al. | Aug 2004 | B2 |
20010054709 | Heath et al. | Dec 2001 | A1 |
20010055384 | Yamazaki et al. | Dec 2001 | A1 |
20020104889 | Forrest et al. | Aug 2002 | A1 |
20020125504 | Perlov et al. | Sep 2002 | A1 |
20020163057 | Bulovic et al. | Nov 2002 | A1 |
20020163828 | Krieger et al. | Nov 2002 | A1 |
20020163829 | Bulovic et al. | Nov 2002 | A1 |
20020163831 | Krieger et al. | Nov 2002 | A1 |
Number | Date | Country |
---|---|---|
196 40 239 | Apr 1998 | DE |
199 59 904 | Jun 2001 | DE |
0 268 370 | May 1988 | EP |
268370 | May 1988 | EP |
0 385 688 | Sep 1990 | EP |
0 727 822 | Aug 1996 | EP |
7-106440 | Apr 1995 | JP |
2071126 | Dec 1996 | RU |
WO 9304506 | Mar 1993 | WO |
WO 9904440 | Jan 1999 | WO |
WO 9908325 | Feb 1999 | WO |
WO 9914762 | Mar 1999 | WO |
WO 9919900 | Apr 1999 | WO |
WO 0026918 | May 2000 | WO |
WO 0048196 | Aug 2000 | WO |
WO 0235580 | May 2002 | WO |
WO 0237500 | May 2002 | WO |
WO 0243071 | May 2002 | WO |
WO 02078003 | Oct 2002 | WO |
WO 02091384 | Nov 2002 | WO |
WO 02091385 | Nov 2002 | WO |
WO 02091476 | Nov 2002 | WO |
WO 02091494 | Nov 2002 | WO |
WO 02091495 | Nov 2002 | WO |
WO 02091496 | Nov 2002 | WO |
WO 03017282 | Feb 2003 | WO |
Number | Date | Country | |
---|---|---|---|
60289061 | May 2001 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10139381 | May 2002 | US |
Child | 11026105 | US |