The present disclosure generally relates to cooled enclosure apparatus in a data center environment. More specifically, the present disclosure relates to a wall arrangement for cooled enclosure apparatus and managing the temperature of coolant provided to cooled enclosures to maximize cooling efficiency.
Data centers are a prominent feature of modern life and the cooling of computer systems such as computer servers and network apparatus are a central part of a data centers operation.
The majority of contemporary data centers use air as their primary means of removing heat from computer servers and other equipment. Whilst convenient, air is an inefficient means of transporting heat, and managing air flow and temperatures within a contemporary data center is becoming increasingly complex and challenging.
The cooling technology described in Patent Cooperation Treaty application published as WO 2014/030046 and in the Patent Applications entitled “Computer System with Improved Thermal Rail” comprise a cooled enclosure apparatus, which in cooperation with compatible computer servers and other electronic equipment, can remove heat efficiently and cost effectively without relying on air as the primary means of cooling.
Improvements in any technology is desirable and the present disclosure is directed to cooled enclosure apparatus, and efficiently cooling cooled enclosure apparatus in a data center environment.
The present disclosure is directed to a cooled enclosure wall which can be used to cool apparatus of the type described in the Patent Cooperation Treaty application published as WO 2014/030046 and the Patent Application entitled “Computer System with Improved Thermal Rail”. The present disclosure is also directed to efficiently integrating cooled enclosure apparatus into a data center environment and discloses a method of managing the temperature of coolant provided to cooled enclosures to maximize cooling efficiency.
One described cooled enclosure wall comprises a face component comprising a plurality of channels configured to receive a rail of installed equipment. Each channel having a corresponding coolant guide, in the form of an extrusion, arranged on a surface of the face component in such a way that coolant flowing through the coolant guide can effectively cool a surface, the coolable surface, of the channel. In order to improve the effectiveness of the coolant the coolant guide guides the coolant over a plurality of thermally conductive features, in the form of fins, which are in thermal contact with the coolable surface of the channel.
Alternative coolant guides for the described enclosure wall are described including a coolant guide which when used with a suitable coolant distribution system can provide redundant cooling capability to the cooled enclosure wall. Enabling a cooled enclosure wall to be fed by two independent coolant feed and return lines and being capable of adequately cooling installed equipment if coolant flow through either fails.
Structural support is provided to the described enclosure wall by a plurality of supports which, in cooperation with the coolant guides, provide support for each channel. The face component, supports and coolant guides described may be joined together in a single operation within a brazing furnace, however other manufacturing alternatives may be used.
Coolant is delivered to each coolant guide through a coolant distribution system in the form of a network of tubing which is configured to deliver a similar rate of coolant flow to each coolant guide. The coolant distribution system is further configured to enable unwanted air within the system to be bled away from the coolant distribution system via an air bleed line. Described is the use of an optional automatic air vent which enables the air bleed line to be positioned below installed equipment, thus moving a potential point of failure to a safer location.
The described enclosure wall further comprises a lid which when fixed to the face component contains the coolant guides, structural supports, optional automatic air vent and coolant distribution system. The lid protects against leakage from any of the coolant guides, the coolant distribution system, the automatic air vent or other coolant carrying components by providing a secondary wall between installed equipment and any leaks.
Externally connectable fittings provide connections for coolant inlet and return lines, an air bleed line and optional fitting to access the internal space. These fittings can be positioned to be below any installed equipment when in operation.
When the lid is fixed to the face component, via a suitable joining process such as brazing or welding, the enclosure wall may be partially evacuated or pressurized via the optional internal access fitting. This allows for the installation of a pressure switch which if configured to change state when the pressure changes can be used to detect a leak or other breach within the enclosure wall and thus indicate to a monitoring system that the enclosure wall may have developed a problem before it would otherwise become apparent. A further benefit is that the enclosure wall, when fabricated with appropriate materials and joins, may be evacuated to a partial vacuum providing thermal insulation and reducing the heat loss or gain through parts of the enclosure wall where such heat loss or gain is unintended.
Also described is a method for manufacturing the described cooling enclosure wall, the method comprising: preparing the coolant guides for connection to a coolant distribution system; manufacturing a face component comprising a plurality of channels; positioning the coolant guides on the face component in such a way that coolant flowing through a coolant guide can cool a surface of one of the channels; fixing the cooling guides to the face component; manufacturing the coolant distribution system; connecting the coolant distribution system to the coolant guides; manufacturing a lid that will contain the coolant guides and coolant distribution system, and; fixing the lid to the face component.
A further aspect of the present disclosure is a method and apparatus for managing the temperature of coolant flowing through cooled enclosure apparatus to prevent condensation forming on the cooled enclosure or installed apparatus and to minimize the amount of heat lost from coolant to the surrounding air.
The described method comprises managing the temperature of the coolant flowing through cooled enclosure apparatus to be above the dew point but below the dry bulb temperature of air surrounding the cooled enclosure. This ensures that condensation will not form whilst simultaneously ensuring that the coolant does not heat the air, reducing the amount of work that air management equipment has to do.
Another aspect of the present disclosure is an exemplary data center coolant distribution configuration, the configuration comprising: facility coolant supply and return; a variable mixing valve; a pump; humidity, air temperature and coolant temperature instrumentation, and; a computerized controller. The computerized controller configured to read sensor information from the humidity, air temperature and coolant temperature sensors and to use that information to control the variable mixing valve to keep coolant temperature above the dew point and below the dry bulb temperature.
The configurations described can be applied to create zones within a larger data center environment with each zone independently controlled to supply coolant at the correct temperature for that particular zones environmental conditions. This concept can be applied to both container-based data centers, large data centers or smaller data centers with only one or two cooled enclosures.
The features of the present invention which are believed to be novel are set forth with particularity in the appended claims.
These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
It is intended that the following description and claims should be interpreted in accordance with Webster's Third New International Dictionary, Unabridged unless otherwise indicated.
In the following specification and claims, a “heat transmitting means” or “heat transmitting device” is intended to encompass heatpipes, vapor chambers, thermosyphons, thermal interface materials and thermally conductive materials, composites, manufactures and apparatus such as: thermally conductive metals, examples of which include copper, aluminium, beryllium, silver, gold, nickel and alloys thereof; thermally conductive non-metallic materials, examples of which include diamond, carbon fiber, carbon nanotubes, graphene, graphite and combinations thereof; composite materials and manufactures, examples of which include graphite fiber/copper matrix composites and encapsulated graphite systems; thermally conductive filled plastics, examples of which include metal filled plastics, graphite filled plastics, carbon nanotube filled plastics, graphene filled plastics and carbon fiber filled plastics; and apparatuses such as liquid circulation, heat pumps and heat exchangers. A “heat transmitting means” or “heat transmitting device” is further intended to encompass any means presently existing or that is discovered in the future which transmits heat from one place to another.
Previous work by this inventor disclosed in patent cooperation treaty application published under no. WO 2014/030046 describes a rack enclosure into which rack mounted equipment can be installed, the content of which is incorporated herein by reference in its entirety. The rack mounted equipment being of a type which can be cooled by installation into a cooled rack enclosure and comprising a rail comprising a thermally conductive surface. The rack enclosure comprising a channel adapted to receive the rail of the rack mounted equipment when the equipment is installed into the enclosure and further comprising a coolable surface disposed on a surface of the channel in such a way that the coolable surface is adjacently located to the thermally conductive surface when the equipment is installed into the enclosure.
The enclosure wall shown in
The face component 300 illustrated comprises a rim or periphery 303 which runs around the perimeter of the part, the rim 303 will be discussed further below and comprises apertures 304 to permit access to the completed enclosure wall 100 from the outside, the use of the apertures 304 will also be discussed further below. For the purposes of this disclosure the front 305 of the face component 300 is defined as being the surface of the face component 300 which will face installed equipment and the rear 306 of the face component 300 is defined as being the opposing side. The face component 300 illustrated in
The wall enclosure 100 comprises a plurality of coolant guides which are disposed on the rear surface 306 of the face component 300, each coolant guide being positioned on and fixed to the face component 300 in such a way that coolant flowing through the coolant guide can cool the coolable surface 312 of at least one of the plurality of channels 310.
The coolant guide 400 shown is an extruded aluminium component, however one skilled in the art shall understand that the component may be made using any alternative process or any alternative material being thermally conductive such as, but not limited to, copper or steel or a thermally conductive plastic. Coolant guides fabricated as an aluminium extrusion have both good thermal conductivity and can be efficiently manufactured. Aluminium extrusions similar to those shown in
Each end of coolant guide 400 is prepared to be fitted to the coolant distribution system 1000.
The optional lips 421 may comprise of an additional component, however if the apertures 420 are produced by a piercing process it may be possible to create both aperture 420 and the optional lips 421 without requiring an additional component. The lips 421 may be useful for securing a connection to the coolant distribution network. Alternatively the ends of the coolant guide 400 can be used as the inlet and outlet of the extrusion with no additional apertures being necessary, either end of the coolant guide 400 being connected to a coolant distribution system via a component configured to be fitted into either end, such an arrangement is illustrated in
In another embodiment, the coolant guide 400 may be augmented further by introducing a heat transmitting means, in this case in the form of a heatpipe which improves thermal communication between the coolable surface 312 of the face enclosure 300 and coolant being guided through the coolant guide 400.
Now referring to
Referring again to
Now referring to
The method of fixing coolant guide 400 to face component 300 is dependent upon the materials used for each component, the fixing method however should: enable adequate thermal communication between the coolable surface 312 and thermally conductive features 410, and; provide a seal adequate to contain coolant within the coolant guide 400 if that is desired. In some cases this may be adequately achieved using a thermal adhesive or by soldering, brazing or welding if the materials permit. If both face component 300 and coolant guide 400 are made of aluminium the components may be brazed or soldered together. An adequate brazed or solder joint shall provide good thermal communication between components and may also be performed in a single process using a furnace, thus potentially reducing assembly costs.
Now referring to
The supports 902, 904, 905 and 906 also provide convenient points for attachment when the cooled enclosure 100 is fully assembled, such supports may comprise threaded holes or other points where fittings and other fasteners may be attached or fastened. Supports may also comprise additional features to provide access apertures for hoses or support for internal apparatus such as optional automatic air valve 1020. As illustrated in
Supports may be manufactured from steel or aluminium or another material capable of bearing the required loads. However material selection for the supports is led by the structural requirements of the loads that the cooled enclosure wall 100 will be expected to endure during operation. In embodiments where the face component 300, coolant guides 400 and supports 902, 904, 905 and 906 are all made of aluminum, the joining of these components can be simplified by joining in a single operation within a brazing furnace.
Hoses 1024 connect the coolant feed and return lines to tubing networks 1002 via the optional fittings 1026, the hoses may be flexible however it is not required. Depending on the joining methods that are used in the construction of the wall enclosure 100 it may be beneficial to fabricate hoses 1026 from a heat resistant material.
The optional automatic air vent 1020 provides a mechanism whereby air can be automatically vented from tubing networks 1002 through air vent line 1021. Whilst automatic air vent 1020 is shown as being an internal feature of wall enclosure 100, which will be further described below, it is not required and air may instead be vented via an automatic air vent or manual bleed valve which is externally located and connected to the coolant distribution system 1000 via a tube or any other hose arrangement. Alternatively there may be no air venting apparatus, with the system operating in an orientation where air can be vented via the coolant feed or return lines.
The tubing networks 1002 are connected to the inlet and outlet apertures of each coolant guide 400 and are configured to deliver an approximately similar rate of flow to each coolant guide 400. Now referring to
One skilled in the art shall understand that the presence one or more bifurcations 1004 within the tubing network 1002 is optional as alternative tubing configurations or embodiments may be used to balance flow by restricting the coolant flow in an alternative manner. For example, in a further embodiment the tubing network may comprise a manifold with multiple channels or tubes exiting a single chamber, each channel or tube having a restriction which may be tuned or configured to deliver a balanced flow to each coolant guide.
In an alternative embodiment tubing network 1002 may be replaced by a simpler manifold arrangement connected to the coolant feed and coolant return lines, this approach may not deliver a similar rate of flow to each connected coolant guide, however adequate flow to each coolant guide may be achievable in this manner. An alternative embodiment comprising a tubing network 1002 connected to the coolant feed and a simpler manifold arrangement connected to the coolant return line may also be used to achieve a balanced flow when tuned or configured as described previously.
Referring back to
Embodiments of the tubing network 1002 may be manufactured from plastic and manufactured in two halves using a molding or casting process followed by a joining process. In other embodiments, the tubing network 1002 may be manufactured in two halves from a sheet metal, such as aluminium or steel, using a stamping process followed by a joining process such as brazing or welding. In a further embodiment, the tubing network 1002 may be manufactured as a single part, if that is desired, using any process of blow molding. In embodiments manufactured from aluminium, the tubing networks 1002 may also be joined to the coolant guides 400 and possibly other parts in a single joining process using a furnace.
Now referring to
The lid 1100 as shown in
A potential benefit of face component 300 and lid component 1100 as described is that if rims 1103 and 303 are joined to create an air-tight seal and the various internal components such as the coolant guides 400 and coolant distribution system 1000 are also air-tight then the volume enclosed by the face component 300 and lid component 1100 can be pressurized or evacuated to create a higher or lower pressure environment, the pressure being modified through a fitting possibly being installed in bottom horizontal frame support 905. Leaks may then be detected by installing a pressure sensitive switch which is configured to change state when the pressure within the volume changes, such a switch could be installed in a similar manner as the fittings 1026 installed in the bottom horizontal frame support 905.
Another potential benefit of being able to evacuate the volume enclosed by face component 300 and lid component 1100 is that if a partial vacuum is introduced into that volume then, with the vacuum acting as heat insulation, heat lost or gained through parts of the enclosure that are not intended to be thermally active can be reduced.
In another embodiment, an alternative enclosure wall configuration may be used. The alternative enclosure wall comprising: face component 300; coolant guides 400, supports 902, 904, 905 and 906 and coolant distribution system 1000. The alternative enclosure wall being without a lid component. Whilst operable, the described alternative enclosure wall lacks some of the described benefits of the enclosure wall 100 such as improved leak-resistance.
The cooling technology described in Patent Cooperation Treaty application published as WO 2014/030046 and in the Patent Applications entitled “Computer System with Improved Thermal Rail” and “Robust Redundant-Capable Leak-Resistant Cooled Enclosure Wall”, can, with suitable compatible computer servers and other electronic equipment, be operated with a coolant temperature that is higher than the global maximum dew point of approximately 33° C. This therefore allows the use of a coolant which may be produced globally, all year round with evaporative cooling and in many locations with dry cooling for the majority of the year.
In order to maintain safe operation of a data center it is desirable to maintain the outer surfaces of cooled enclosures at a temperature above the dew point of the surrounding air, this will prevent formation of condensation and will therefore reduce the possibility of water damaging sensitive electronic equipment. Further, it may also be beneficial to maintain the temperature of the surfaces of the cooled enclosures below the dry bulb temperature of the surrounding air, this will prevent the surrounding air from being heated by the cooled enclosure and will reduce the work that air handling equipment needs to do.
This can be achieved by managing the temperature of the coolant flowing through cooled enclosure apparatus to be above the dew point of the surrounding air whilst also being below the dry bulb temperature of air surrounding the cooled enclosure.
The inner portion further comprising a pump 1226 and connections 1212 and 1214 to the various cooled enclosures 1210, the pump 1226 driving coolant through each enclosure via the supply inlets 1212 and return outlets 1214. The outer portion, comprising coolant supply 1232 and coolant return 1234, represents the facility cooling supply, the facility cooling supply being cooled by cooling apparatus, not shown, such as a cooling tower, chiller unit, heat exchanger or other apparatus.
When the 4-way mixing valve 1220 is fully closed, coolant circulates around the inner portion with no mixing with coolant from the outer portion. When the 4-way mixing valve 1220 is fully open, coolant flows from the outer portion through the inner portion and out into the outer portion with no recirculation. The 4-way mixing valve can also be operated to allow coolant flowing in from the outside portion to mix with coolant circulating within the inner portion. Thus by controlling the 4-way mixer valve 1220, the temperature of coolant being supplied to the cooled enclosures 1210 can be managed by mixing only the necessary amount of coolant from the facility coolant supply 1232.
Systems which use a similar configuration of mixer valve and inner and outer portions are well known by those having ordinary skill in the art of hydronics, a particular example being radiant heating systems for greenhouses. Alternative configurations using 3-way mixer valves and other alternative apparatus to those described are also known to those having ordinary skill in the art of hydronics.
The computerized controller receives the input from the various sensors and determines the dew point, coolant temperature and dry bulb temperatures. A control algorithm, for example a PID algorithm or a trainable machine learning algorithm, uses the input data to operate the mixing valve 1220 in such a way that the coolant temperature entering the cooled enclosures 1210 is above the measured dew point whilst remaining below the measured dry bulb temperature.
Alternatively if additional information is provided to the computerized controller including: flow rates, mixer valve dimensions and specifications, and temperatures of coolant flowing through the return piping 1224 and coolant supply piping 1232, then a control algorithm can be developed to provide optimal mixing and thus control the coolant temperature entering cooled enclosures 1210.
The described method and apparatus can be used by a data center either to manage coolant temperature for the entire facility through a single mixer valve or to split the facility into multiple zones, each of which is managed independently.
Although specific embodiments of the invention have been shown and described herein, it is to be understood that these embodiments are merely illustrative of the many possible specific arrangements that can be devised in application of the principles of the invention. Numerous and varied other arrangements can be devised by those of ordinary skill in the art without departing from the scope and spirit of the invention.
The present application claims the benefits of priority of U.S. Provisional Patent Application No. 62/022,044 entitled “Robust Redundant-Capable Leak-Resistant Cooled Enclosure Wall” filed at the United States Patent and Trademark Office on Jul. 8, 2014, the content of which is incorporated herein by reference in its entirety. The present application also claims the benefits of priority of U.S. Provisional Patent Applications Nos. 62/022,015, 62/022,032, 62/022,056 respectively entitled “Computer System with Improved Thermal Rail”, “Efficiently Cooling Data Centers using Thermal Rail Technology” and “Slide Assembly for Thermal Rail Cooled Systems” filed at the USPTO on Jul. 8, 2014 which are incorporated herein by reference in their entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/CA2015/050631 | 7/8/2015 | WO | 00 |
Number | Date | Country | |
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62022015 | Jul 2014 | US | |
62022032 | Jul 2014 | US | |
62022044 | Jul 2014 | US | |
62022056 | Jul 2014 | US |