The strong growth in demand for portable consumer electronics is driving the need for high-capacity storage devices. Non-volatile semiconductor memory devices, such as flash memory storage cards, are widely used to meet the ever-growing demands on digital information storage and exchange. Their portability, versatility and rugged design, along with their high reliability and large capacity, have made such memory devices ideal for use in a wide variety of electronic devices, including for example digital cameras, digital music players, video game consoles, PDAs, cellular telephones and solid-state drives.
Semiconductor memory may be provided within a semiconductor package, which protects the semiconductor memory and enables communication between the memory and a host device. Examples of semiconductor packages include system-in-a-package (SiP) or multichip modules (MCM), where a plurality of dies are mounted and interconnected on a small footprint substrate. Given the demand for greater storage capacities in the same or smaller form factor semiconductor dies, die features are being fabricated to ever smaller dimensions. These features include for example logic gates, conductive lines and spacing therebetween, spacing and diameters of contact holes and surface geometries such as the corners and edges of various integrated circuit features.
Process control during semiconductor die fabrication refers to the monitoring of processes such as the formation die features. As die features get smaller and smaller, it becomes ever more important to implement strict process control over the sizes of die features. One popular method for process control involved measuring die features using a scanning electron microscope (SEM). A SEM is an electron microscope used to produce images by rastering a focused electron beam across the surface of a sample. However, die features have reached the size where they are too small to be measured by conventional SEM.
Transmission electron microscopes (TEMs) allow observers to see extremely small features, on the order of nanometers. In contrast to SEMs, which only image the surface of a material, TEM allows analysis of the internal structure of a sample. Using a TEM, semiconductor device features are imaged from the interaction of the electrons with the sample as the beam is transmitted through the specimen. The image is then magnified and focused onto an imaging device.
In order to prepare a sample of a semiconductor die for imaging by a TEM, the sample is milled to very thin dimensions, often using a focused ion beam (FIB). FIB systems use a finely focused beam of ions (usually gallium) that can be operated at high beam currents for site specific sputtering or milling of samples. Dual beam systems are known, using a FIB to mill the sample and a TEM to image it.
One problem with milling by FIB systems is curtaining. Semiconductor die samples typically have a heterogeneous structure, including for example both metal along with silicon and silicon dioxide. The ion beam in a FIB system will mill some of these features more quickly than others. The result is a rippled sample surface that causes shadowing or curtaining that impairs the quality of the image obtained by the TEM.
The present technology will now be described with reference to the figures, which in embodiments, relate to a rotatable TEM grid holder. In embodiments, a TEM grid having a sample may be affixed to a clamp, which in turn is received in a rotatable clamp holder. The clamp holder has first and second legs orthogonally positioned on the clamp holder with respect to each other. Each clamp holder leg is configured to be received within a hole in a main stage supporting the rotatable TEM grid holder.
When the first leg of the clamp holder is affixed within the main stage, the sample has a first orientation with respect to the FIB, and when second leg of the clamp holder is affixed within the main stage, the sample has a second orientation with respect to the FIB, rotated 90° relative to the first orientation. When for example milling of the sample at the first orientation by the FIB creates curtaining effects, the sample may be rotated 90° to the second orientation to effectively remove the curtaining effects upon continued milling. The sample may be rotated back and forth between the first and second orientations multiple times as needed to produce a sample which may be clearly imaged by the TEM system, substantially free of curtaining effects.
It is understood that the present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the invention to those skilled in the art. Indeed, the invention is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be clear to those of ordinary skill in the art that the present invention may be practiced without such specific details.
The terms “top” and “bottom,” “upper” and “lower” and “vertical” and “horizontal,” and forms thereof, as may be used herein are by way of example and illustrative purposes only, and are not meant to limit the description of the technology inasmuch as the referenced item can be exchanged in position and orientation. Also, as used herein, the terms “substantially” and/or “about” mean that the specified dimension or parameter may be varied within an acceptable manufacturing tolerance for a given application. In one embodiment, the acceptable manufacturing tolerance is 0.15 mm, or alternatively ±2.5% of a given dimension.
For purposes of this disclosure, a connection may be a direct connection or an indirect connection (e.g., via one or more other parts). In some cases, when a first element is referred to as being connected, affixed, mounted or coupled to a second element, the first and second elements may be directly connected, affixed, mounted or coupled to each other or indirectly connected, affixed, mounted or coupled to each other. When a first element is referred to as being directly connected, affixed, mounted or coupled to a second element, then there are no intervening elements between the first and second elements (other than possibly an adhesive or melted metal used to connect, affix, mount or couple the first and second elements).
An embodiment of the present technology will now be explained with reference to the exploded perspective view of
The clamp front portion 106 includes a first screw hole 126 for receiving a set screw as explained below. In one embodiment, the first hole 126 may have a diameter of 0.2 to 0.4 cm. However, the diameter and thread pitch of the first hole 126 may vary in different embodiments of the present technology. The clamp front portion 106 may further include a second hole 128 for receiving a boss as explained below. In one embodiment, the second hole 128 may have a diameter of 0.1 to 0.3 cm, but the diameter of the second hole 128 may vary in different embodiments of the present technology. The second hole 128 may be smaller or larger than the first hole 126 in different embodiments. The embodiment shown further includes a slot 130 for receiving a grid perch as explained below. The slot 130 may have a length of 0.1 to 0.5 cm, though it may be longer or shorter than that in further embodiments.
The clamp front portion 106 further includes a post 132 configured to be received within a clamp holder as explained below. The post may be circular have a diameter of 0.5 cms. However, the cross-circular shape and the diameter of post 132 may vary in further embodiments.
Referring now to the perspective view of
A first leg 114 is affixed to or otherwise formed on a first of the base planar surfaces, and a second leg 116 is affixed to or otherwise formed on a second of the base planar surfaces adjacent to the first planar surface. Leg 114 is shown shaded in the figures to provide easy distinction from leg 116, but the first and second legs 114, 116 may be identical to each other, having the same diameter and length. The legs 114, 116 may be circular have a diameter of 0.5 cms. However, the cross-circular shape and the diameter of legs 114, 116 may vary in further embodiments.
In embodiments, the first and second legs 114, 116 may be radially offset from each other by an angle of 90° about a central axis of rotation of the clamp holder 112. However, it is conceivable that the first and second legs 114, 116 be radially offset from each other by other angles ranging for example from 60° to 120°. In further embodiments, instead of being located on the adjacent planar surfaces, the legs 114 and 116 may be mounted on opposed surfaces of base 142 so as to be radially offset 180° from each other.
The rotatable clamp holder 112 further includes one or more holes 143, 144 configured to receive the post 132 of the clamp 104 to mount the clamp 104 on the clamp holder 112. Having multiple holes 143, 144 increases the flexibility as to how the clamp 104 may be secured onto the rotatable clamp holder 112. However, there may be a single hole, or more than two holes, for receiving post 132 in further embodiments. Screw holes 146 (one of which is shown in
In embodiments, the post 132 and holes 143, 144 are circular, so that the clamp 104 and TEM grid 102 may be rotated 360° about a central axis through the hole 143, 144 into which the post 132 is received. In further embodiments, the post 132 and holes 143, 144 may have matching, non-circular cross-sections to limit the number of positions the clamp 104 may be mounted on the clamp holder 112.
In embodiments, the legs 114, 116 and hole 150 are circular, so that the clamp holder 112, clamp 104 and TEM grid 102 may be rotated 360° about a central axis through the central hole 150 into which one of the legs 114, 116 is received. In further embodiments, the legs 114, 116 and hole 150 may have matching, non-circular cross-sections to limit the number of positions the clamp holder 112, clamp 104 and TEM grid 102 may be mounted on the main stage 120.
The rotatable clamp holder 112 may be manually positioned with either of legs 114, 116 positioned within main stage 120 to perform the milling and imaging shown in
In a further embodiment shown in
In summary, the present technology relates to a rotatable transmission electron microscope (TEM) sample holder, the sample holder holding a sample for imaging and/or milling, the rotatable TEM sample holder comprising: a clamp configured to releasably secure the TEM sample holder; a clamp holder configured to releasably secure the clamp, the clamp holder having a central axis of rotation, and comprising first and second legs extending radially from the axis of rotation, the first and second legs being radially offset from each other on the clamp holder; and a main stage configured to support the clamp holder and clamp, and configured to position the sample for the imaging and/or the milling; wherein the clamp holder may be placed in a first position on the main stage with the first leg positioned in the main stage for imaging and/or milling the sample while the sample is in a first orientation; wherein the clamp holder may be placed in a second position on the main stage with the second leg positioned in the main stage for imaging and/or milling the sample while the sample is in a second orientation different than the first orientation; and wherein the clamp holder may be manually moved between the first and second positions.
In another example, the present technology relates to a rotatable transmission electron microscope (TEM) sample holder, the sample holder holding a sample for imaging and/or milling, the rotatable TEM sample holder comprising: a clamp configured to releasably secure the TEM sample holder; a clamp holder configured to releasably secure the clamp, the clamp holder having a central axis of rotation, and comprising a plurality of legs extending radially from the axis of rotation, the plurality of legs being radially offset from each other on the clamp holder; and a main stage configured to support the clamp holder and clamp, and configured to position the sample for the imaging and/or the milling; wherein the clamp holder is configured to be rotated between a plurality of positions on the main stage by manually inserting different ones of the plurality of legs in the main stage for imaging and/or milling the sample while the sample is in one of a plurality of positions.
In a further example, the present technology relates to a rotatable transmission electron microscope (TEM) sample holder, the sample holder holding a sample for imaging and/or milling, the rotatable TEM sample holder comprising: a clamp configured to releasably secure the TEM sample holder; a clamp holder configured to releasably secure the clamp, the clamp holder having a central axis of rotation, and comprising a plurality of legs extending radially from the axis of rotation, the plurality of legs being radially offset from each other on the clamp holder; a main stage configured to support the clamp holder and clamp, and configured to position the sample for the imaging and/or the milling; and means for rotating the clamp holder between a plurality of positions on the main stage for imaging and/or milling the sample while the sample is in one of a plurality of positions.
The foregoing detailed description of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen in order to best explain the principles of the invention and its practical application to thereby enable others skilled in the art to best utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims appended hereto.
The present application claims priority from U.S. Provisional Patent Application No. 63/416,849, entitled “ROTATABLE TEM GRID HOLDER FOR IMPROVED FIB THINNING PROCESS,” filed Oct. 17, 2022, which is incorporated by reference herein in its entirety.
Number | Date | Country | |
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63416849 | Oct 2022 | US |