SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Abstract

A semiconductor device includes a substrate, a gate, a second dielectric layer, and a field plate. The substrate has a first dielectric layer, and a thickness of the first dielectric layer in a first area is greater than a thickness of the first dielectric layer in a second area outside the first area. The gate is located on the substrate and in the first area, the gate includes a first gate structure and a second gate structure, and the second gate structure is formed on a side of the first dielectric layer that is away from the substrate and covers a part of the first dielectric layer. The second dielectric layer covers the gate and the first dielectric layer. The field plate is located on the second dielectric layer and is disposed in both the first area and the second area.

Description

TECHNICAL FIELD

This disclosure relates to the field of semiconductor manufacturing technologies, and in particular, to a semiconductor device and a manufacturing method thereof.

BACKGROUND

For some applications, radio frequency devices are required to have good gain characteristics at high frequencies. For example, third-generation compound semiconductor materials represented by gallium nitride (GaN) and silicon carbide (SiC) have attracted wide attention due to excellent material characteristics, and gallium nitride-based devices are widely used in the field of radio frequency devices due to their advantages such as high mobility, strong breakdown resistance, and good heat dissipation. However, gallium nitride-based radio frequency devices have high index requirements for high-frequency gain characteristics.

The gain characteristic of radio frequency devices at higher frequencies mainly depends on whether a parasitic capacitance of a radio frequency device can perform efficient and fast charging and discharging actions based on a high-frequency signal. Therefore, the gain characteristic of the radio frequency device at higher frequencies may be effectively improved by reducing a capacitance value of the parasitic capacitance without changing other design structures of the device. Currently, the parasitic capacitance of radio frequency devices may be adjusted by changing a thickness or a dielectric constant of a dielectric layer therein. However, this type of adjustment can easily cause other negative effects such as electrostatic breakdown.

SUMMARY

In view of this, embodiments of this disclosure provide a semiconductor device and a manufacturing method thereof. Parasitic capacitance of a radio frequency device is reduced by adjusting a structure of the semiconductor device, so that a gain characteristic of the radio frequency device at higher frequencies is improved.

According to a first aspect, an embodiment of this disclosure provides a semiconductor device including a substrate, a gate, a first dielectric layer, a second dielectric layer, and a field plate. A thickness of the first dielectric layer in a first area is greater than a thickness of the first dielectric layer in a second area outside the first area. The gate is located on the substrate within the first area. The gate includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate. The first gate structure penetrates the first dielectric layer in the direction perpendicular to the surface of the substrate, and the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer. The second dielectric layer covers the gate and the first dielectric layer. The field plate is located on the second dielectric layer and is disposed in both the first area and the second area. In this way, by comparison with the capacitance in a semiconductor device with a first dielectric layer having a uniform thickness, in the present semiconductor device, the capacitance between the second gate structure and a drain is reduced due to a large thickness of the first dielectric layer in the first area, and the capacitance between the field plate and a channel is increased due to a small thickness of the first dielectric layer in the second area. Accordingly, the parasitic capacitance of the semiconductor device is reduced, and a gain characteristic of the semiconductor device at higher frequencies is improved. In addition, this design may further re-adjust electric field stresses inside the device. Because the thickness of the first dielectric layer in the first area is large, an electric field peak at the second gate structure is reduced, improving the overall robustness of the device.

In some possible implementations, the semiconductor device further includes a source and a drain located in the substrate, where the gate is located between the source and the drain. The field plate faces, in a direction perpendicular to the surface of the substrate, a part of the gate that faces the drain, and extends to the drain, and a part of the field plate that is located in the second area is electrically connected to the source.

In this embodiment of this disclosure, the semiconductor device may further include the source and the drain. The field plate may be connected to the source and extend to the drain, to modulate the electric field and capacitance distributions between the source and the drain, thereby implementing a specific indicator of the high-frequency gain.

In some possible implementations, the first dielectric layer includes a first sub-film layer and a second sub-film layer.

The first sub-film layer covers the substrate, and the second sub-film layer is located in the first area on the first sub-film layer; or the first sub-film layer is located on the substrate and located in the first area, and the second sub-film layer covers the first sub-film layer and the substrate in the second area that is outside the first sub-film layer.

In this embodiment of this disclosure, the first dielectric layer may include a multi-layer structure, and the multi-layer structure is thick in the first area, so that a thickness of the first dielectric layer in the first area is greater than a thickness of the first dielectric layer in the second area. In this way, parasitic capacitance of the semiconductor device is reduced, and a gain characteristic of the semiconductor device at higher frequencies is improved.

In some possible implementations, a material of at least one of the first sub-film layer and the second sub-film layer is at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

In this embodiment of this disclosure, materials of the first sub-film layer and the second sub-film layer may be set, to better control a dielectric constant of the first dielectric layer.

In some possible implementations, the substrate includes a base and an epitaxial layer, the epitaxial layer is disposed facing the gate, a material of the base is one or more of gallium nitride, aluminum nitride, silicon, silicon carbide, and sapphire, and the epitaxial layer includes one or more of gallium nitride, aluminum gallium nitride, indium aluminum nitride, aluminum nitride, and scandium aluminum nitride.

In this embodiment of this disclosure, the substrate may include the base and the epitaxial layer, and the epitaxial layer may be used as a functional layer, so that the semiconductor device has a specialized function.

In some possible implementations, a material of the gate and/or the field plate is at least one of nickel, titanium, aluminum, palladium, platinum, gold, titanium nitride, tantalum nitride, and copper.

In this embodiment of this disclosure, materials of the gate and the field plate may be set, to implement better conductivity of the gate and the field plate.

In some possible implementations, a material of the second dielectric layer is at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

In this embodiment of this disclosure, a material of the second dielectric layer may be set, to implement better insulation of the second dielectric layer.

According to a second aspect, an embodiment of this disclosure provides a semiconductor device manufacturing method, including:

• • providing a substrate;
  • forming a first dielectric layer and a gate on the substrate, where the gate is located on the substrate within a first area; a thickness of the first dielectric layer in the first area is greater than a thickness of the first dielectric layer in a second area outside the first area. The gate includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate, the first gate structure penetrates the first dielectric layer in the direction perpendicular to the surface of the substrate, and the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer;
  • forming a second dielectric layer covering the gate and the first dielectric layer; and
  • forming a field plate on the second dielectric layer, where the field plate is disposed in both the first area and the second area.

In some possible implementations, a source and a drain are further formed in the substrate; and the gate is located between the source and the drain. The field plate faces, in a direction perpendicular to the surface of the substrate, a part of the gate that faces the drain, and extends to the drain, and a part of the field plate that is located in the second area is electrically connected to the source.

In some possible implementations, the first dielectric layer includes a first sub-film layer and a second sub-film layer, and forming a first dielectric layer and a gate on the substrate includes:

• • forming the first sub-film layer and a second sub-material layer sequentially on the substrate;
  • etching the second sub-material layer and the first sub-film layer in the first area to obtain a first via;
  • forming the first gate structure located inside the first via and the second gate structure that is connected to the first gate structure and that covers the part of the first dielectric layer; and
  • etching and removing the second sub-material layer outside the second gate structure by using the second gate structure as a mask, where the second sub-material layer located in the first area is used as the second sub-film layer.

In this embodiment of this disclosure, the second sub-material layer may be etched by using the first sub-film layer as an etching stop layer and using the second gate structure as a hard self-aligning mask, without adding a sequential photo-lithography process. This can reduce costs.

In some possible implementations, forming a first dielectric layer and a gate on the substrate includes:

• • forming a first dielectric material layer on the substrate;
  • etching the first dielectric material layer in the first area to obtain a second via;
  • forming the first gate structure located inside the second via and the second gate structure that is connected to the first gate structure and that covers the part of the first dielectric layer; and
  • thinning the first dielectric material layer in the second area outside the first area to form the first dielectric layer.

In this embodiment of this disclosure, the second sub-material layer may be etched by using the second gate structure as a hard self-aligning mask, without adding a sequential photo-lithography process. This can reduce costs.

In some possible implementations, the first dielectric layer includes a first sub-film layer and a second sub-film layer, and forming a first dielectric layer and a gate on the substrate includes:

• • forming a first sub-material layer on the substrate;
  • removing the first sub-material layer in the second area outside the first area, and using the first sub-material layer located in the first area as the first sub-film layer;
  • forming the second sub-film layer covering the first sub-film layer and the substrate;
  • etching the second sub-film layer and the first sub-film layer in the first area to obtain a third via; and
  • forming the first gate structure located inside the third via and the second gate structure that is connected to the first gate structure and that covers the part of the first dielectric layer.

In this embodiment of this disclosure, the first sub-film layer in the first area may be formed first, and then the second sub-film layer is covered, so that a flat second sub-film layer is obtained.

In some possible implementations, the first dielectric layer includes a first sub-film layer and a second sub-film layer, and forming a first dielectric layer and a gate on the substrate includes:

• • forming the first sub-film layer in the first area on the substrate by using a double-layer photoresist patterning process;
  • forming the second sub-film layer covering the first sub-film layer and the substrate;
  • etching the second sub-film layer and the first sub-film layer in the first area to obtain a third via; and
  • forming the first gate structure located inside the third via and the second gate structure that is connected to the first gate structure and that covers the part of the first dielectric layer.

In this embodiment of this disclosure, the first sub-film layer may be formed first, and then the second sub-film layer that is located in the first area and that is on the first sub-film layer is formed, to help obtain the second sub-film layer accurately located under the second gate structure.

In some possible implementations, a material of the first sub-film layer and/or the second sub-film layer is at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

In some possible implementations, the substrate includes a base and an epitaxial layer, a material of the base is one or more of gallium nitride, aluminum nitride, silicon, silicon carbide, and sapphire, and the epitaxial layer includes one or more of gallium nitride, aluminum gallium nitride, indium aluminum nitride, aluminum nitride, and scandium aluminum nitride.

In some possible implementations, a material of the gate and/or the field plate is at least one of nickel, titanium, aluminum, palladium, platinum, gold, titanium nitride, tantalum nitride, and copper.

In some possible implementations, a material of the second dielectric layer is at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

According to a third aspect, an embodiment of this disclosure provides an electronic device, including a circuit board and the semiconductor device that is connected to the circuit board and that is provided in the first aspect of this disclosure.

It can be learned from the foregoing technical solutions that embodiments of this disclosure have the following advantages:

Embodiments of this disclosure provide a semiconductor device and a manufacturing method thereof. The semiconductor device may include a substrate, a gate, a second dielectric layer, and a field plate. The substrate has a first dielectric layer, and a thickness of the first dielectric layer in a first area is greater than a thickness of the first dielectric layer in a second area outside the first area. The gate is located on the substrate within the first area, and the gate includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate. the first gate structure penetrates the first dielectric layer in the direction perpendicular to the surface of the substrate, and the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer. The second dielectric layer covers the gate and the first dielectric layer. The field plate is located on the second dielectric layer and is disposed in both the first area and the second area. In this way, by comparison with the capacitance in a semiconductor device with a first dielectric layer having a uniform thickness, in the present semiconductor device, the capacitance between the second gate structure and a drain is reduced due to a large thickness of the first dielectric layer in the first area, and the capacitance between the field plate and a channel is increased due to a small thickness of the first dielectric layer in the second area. Accordingly, the parasitic capacitance of the semiconductor device is reduced, and a gain characteristic of the semiconductor device at higher frequencies is improved. In addition, this design may further re-adjust electric field stresses inside the device. Because the thickness of the first dielectric layer in the first area is large, an electric field peak at the second gate structure is reduced, improving the overall robustness of the device.

BRIEF DESCRIPTION OF DRAWINGS

To clearly understand specific implementations of this disclosure, the following briefly describes the accompanying drawings that illustrate the specific implementations of this disclosure. It is clear that the accompanying drawings show merely some embodiments of this disclosure.

FIG. 1 is a schematic diagram of a structure of a radio frequency device according to an embodiment of this disclosure;

FIG. 2 is a schematic diagram of transverse electric field stress distribution according to an embodiment of this disclosure;

FIG. 3A, FIG. 3B, and FIG. 3C are schematic diagrams of structures of semiconductor devices according to embodiments of this disclosure;

FIG. 4 is a schematic diagram of another transverse electric field stress distribution according to an embodiment of this disclosure;

FIG. 5 is a flowchart of a semiconductor device manufacturing method according to an embodiment of this disclosure; and

FIG. 6 to FIG. 23 are schematic diagrams of device structures in manufacturing processes of semiconductor devices according to embodiments of this disclosure.

DESCRIPTION OF EMBODIMENTS

Embodiments of this disclosure provide a semiconductor device and a manufacturing method thereof. Parasitic capacitance in a radio frequency device is reduced by adjusting a structure of the semiconductor device, so that a gain characteristic of the radio frequency device at higher frequencies is improved.

In the specification, claims, and accompanying drawings of this disclosure, the terms “first”, “second”, “third”, “fourth”, and so on (if existent) are intended to distinguish between similar objects but do not necessarily indicate a specific order or sequence. It should be understood that data termed in such a way is interchangeable in proper circumstances, so that embodiments described herein can be implemented in other orders than the order illustrated or described herein. Moreover, the terms “include”, “contain”, and any other variants mean to cover a non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to the expressly listed steps or units, but may include other steps or units not expressly listed or inherent to such a process, method, product, or device.

This disclosure is described in detail with reference to the schematic diagrams. For ease of description, when embodiments of this disclosure are described, a sectional view of a device structure is not partially enlarged according to a general proportion. The schematic diagrams are merely examples, and should not limit a scope of protection of this disclosure. In addition, three-dimensional space of a length, a width, and a depth should be included during actual production.

Currently, in some scenarios, radio frequency devices are required to have good gain characteristics at higher frequencies. The gain characteristic of a radio frequency device at higher frequencies mainly depends on whether a parasitic capacitance of the radio frequency device can perform efficient and fast charging and discharging actions based on a high-frequency signal. Therefore, the gain characteristic of the radio frequency device at higher frequencies may be effectively improved by reducing a capacitance value of the parasitic capacitance without changing other design structures of the radio frequency device.

FIG. 1 is a schematic diagram of a structure of a radio frequency device according to an embodiment of this disclosure. The radio frequency device includes a substrate 100, a first dielectric layer 210 on the substrate 100, a gate 220 that penetrates the first dielectric layer 210 and covers a part of the first dielectric layer 210, a second dielectric layer 230 that covers the gate 220 and the first dielectric layer 210, and a field plate 240 located on the second dielectric layer 230. The substrate 100 includes a source 101 and a drain 102, the field plate 240 is located on a side of the gate 220 that faces the drain 102 and extends above the gate 220, and the field plate 240 is connected to the source 101. Factors that determine parasitic capacitance of the radio frequency device include the parasitic capacitance C1 between a bottom of the gate 220 and the drain 102, the parasitic capacitance C2 between a part of the gate 220 that is located on the first dielectric layer 210 and the drain 102, and the parasitic capacitance C3 between the field plate 204 and a channel below the gate 220. To reduce overall parasitic capacitance of the radio frequency device, C1 and C2 need to be reduced, while C3 needs to be increased. The parasitic capacitances C1, C2, and C3 may be adjusted by changing a thickness or a dielectric constant of the dielectric layer. However, it has been found that these adjustments readily cause other negative effects, for example, they cause electrostatic breakdown.

In an embodiment, increasing a thickness of the first dielectric layer 210 and reducing a dielectric constant of the first dielectric layer 210 may reduce the parasitic capacitance C2 between the part of the gate 220 that is located on the first dielectric layer 210 and the drain 102, and may also reduce the parasitic capacitance C3 between the field plate 240 and the channel, but cannot reduce the overall parasitic capacitance of the device. However, reducing a thickness of the second dielectric layer 230 and increasing a dielectric constant of the second dielectric layer 230 can increase the parasitic capacitance C3 between the field plate 240 and the channel, and also reduce the ability to withstand a voltage between the gate 220 and the field plate 240.

FIG. 2 is a schematic diagram of transverse electric field stress distribution according to an embodiment of this disclosure. A horizontal coordinate is a position in a direction along a surface of the substrate, and a vertical coordinate is an electric field stress at each position in a high-voltage reverse-biased stress state. A first electric field peak may correspond to an end that is at the bottom of the gate and that is close to the drain 102, a second electric field peak may correspond to an end that is at a top of the first dielectric layer 210 and that is close to the drain 102, and a third electric field peak may correspond to an end of the field plate 140 that is close to the drain 102. As can be seen from the figure, the second electric field peak is the highest. Therefore, under continuous high electric field stress, if the thickness of the first dielectric layer 210 is small, the first dielectric layer 110 under the gate and is at a position corresponding to the electric field peak is prone to time dependent dielectric breakdown (TDDB), and has a high reliability risk. Therefore, C2 needs to be reduced to improve reliability of the device.

Based on the foregoing technical problems, embodiments of this disclosure provide a semiconductor device and a manufacturing method thereof. The semiconductor device may include a substrate, a gate, a second dielectric layer, and a field plate. The substrate has a first dielectric layer, and a thickness of the first dielectric layer in a first area is greater than a thickness of the first dielectric layer in a second area outside the first area. The gate is located on the substrate within the first area, and the gate includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate. The first gate structure penetrates the first dielectric layer in the direction perpendicular to the surface of the substrate, and the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer. The second dielectric layer covers the gate and the first dielectric layer. The field plate is located on the second dielectric layer and is disposed in both the first area and the second area. In this way, by comparison with the capacitance in a semiconductor device with a first dielectric layer having a uniform thickness, in the present semiconductor device, the capacitance between the second gate structure and a drain is reduced due to a large thickness of the first dielectric layer in the first area, and the capacitance between the field plate and a channel is increased due to a small thickness of the first dielectric layer in the second area. Accordingly, the parasitic capacitance of the semiconductor device is reduced, and a gain characteristic of the semiconductor device at higher frequencies is improved. In addition, this design may further re-adjust electric field stresses inside the device. Because the thickness of the first dielectric layer in the first area is large, an electric field peak at the second gate structure is reduced, improving the overall robustness of the device.

To make the foregoing objectives, features, and advantages of this disclosure clearer and easier to understand, the following describes specific implementations of this disclosure in detail with reference to the accompanying drawings.

FIG. 3A, FIG. 3B, and FIG. 3C are schematic diagrams of structures of semiconductor devices according to embodiments of this disclosure. The semiconductor structure includes a substrate 100, a gate 120, a first dielectric layer 110, a second dielectric layer 130, and a field plate 140.

In this embodiment of this disclosure, the substrate 100 may be designed based on different device requirements. In an embodiment, the substrate 100 may include a base and an epitaxial layer. The epitaxial layer is formed on a surface of the base and is disposed towards the gate 120. The base may be a semiconductor base, for example, one or more of gallium nitride (GaN), aluminum nitride (AlN), silicon (Si), silicon carbide (SiC), and sapphire. The base may provide a support function for the semiconductor device, or constitute a part of a functional layer of the semiconductor device. The epitaxial layer may be a film layer obtained through epitaxial growth on the base, and is usually a functional layer constituting the semiconductor device, for example, may be one or more of gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium aluminum nitride (InAlN), aluminum nitride (AlN), and scandium aluminum nitride (ScAlN). The materials of the base and the epitaxial layer may be the same, or may be different. The silicon carbide substrate may comprise a single crystal structure, and may have a plurality of structure types, for example, 4H-silicon carbide, 6H-silicon carbide, and 3C-silicon carbide.

For example, when the semiconductor device is a high electron mobility transistor (HEMT) device based on gallium nitride, the base may comprise a silicon carbide material, the epitaxial layer may include gallium nitride and aluminum gallium nitride, and the gallium nitride and the aluminum gallium nitride form a heterostructure to generate a two-dimensional electron gas, and the formed semiconductor device may work by using the two-dimensional electron gas generated by the heterostructure. Certainly, the semiconductor device in this embodiment of this disclosure may alternatively be another radio frequency device, and the base and the epitaxial layer may also be correspondingly designed.

The substrate 100 has a first dielectric layer 110, and a thickness of the first dielectric layer 110 in a first area is greater than a thickness of the first dielectric layer 110 in a second area outside the first area. The first area is an area on the substrate, and includes a space defined by a surface of the substrate and numerous straight lines perpendicular to the surface of the substrate. The first area is an area used to form a gate, and may be a central to an area in which a source and a drain are located. The first area may be greater than an area in which the gate is located, or may be equal to the area in which the gate is located. Refer to FIG. 3A, FIG. 3B, and FIG. 3C. A dashed-line box in the middle represents a first area 1001, and dashed-line boxes on two sides of the first area 1001 represent a second area 1002. Because FIG. 3A, FIG. 3B, and FIG. 3C are sectional views, the second area 1002 may actually be located on two sides of the first area 1001, or may form a ring area, for example, a circular ring area or a polygon ring area, surrounding the first area 1001.

In this embodiment of this disclosure, the first dielectric layer 110 may be a plurality of stacked film layers, or may be an integrated structure of one layer of film. One layer of film may include a plurality of materials, or may include one material.

In an embodiment, the first dielectric layer 110 may be an integrated structure, and the first dielectric layer 110 in the second area outside the first area is thinned, such as through etching, so that the first dielectric layer 110 has a small thickness. Refer to FIG. 3A. In a thinning process, a side wall at a boundary between the first area and the second area may not be strictly vertical, and the side wall may be located in the first area. The first area may be equal to an area in which the gate 120 is located, or may be slightly greater than the area in which the gate 120 is located. A thickness range of the first dielectric layer 110 in the first area may be 40 nm to 1000 nm, and a thickness range of the first dielectric layer 110 in the second area outside the first area may be 20 nm to 500 nm. A material of the first dielectric layer 110 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

In an embodiment, the first dielectric layer 110 may include a first sub-film layer 112 and a second sub-film layer 113. Refer to FIG. 3B, the first sub-film layer 112 is located in a first area on the substrate 100, and the second sub-film layer 113 covers the first sub-film layer 112 and the substrate 100 in the second area outside the first sub-film layer 112. In this way, a difference between a thickness of the first dielectric layer 110 in the first area and a thickness of the first dielectric layer 110 in the second area outside the first area is a thickness of the first sub-film layer 112. In an embodiment, a part of the second sub-film layer 113 that covers the side wall of the first sub-film layer 112 may be located in the first area, to define a large thickness of the first area. In this case, a dimension of the first sub-film layer 112 in a direction along the surface of the substrate is less than a dimension of the first area in the direction along the surface of the substrate. In this case, the first area may be greater than the area in which the gate is located, a thickness range of the first sub-film layer 112 may be 20 nm to 500 nm, and a material of the first sub-film layer 112 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. A thickness range of the second sub-film layer 113 may be 20 nm to 500 nm, and a material of the second sub-film layer 113 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

In an embodiment, the first dielectric layer 110 may include the first sub-film layer 112 and the second sub-film layer 113. Refer to FIG. 3C. The first sub-film layer 112 covers the substrate 100, and the second sub-film layer 113 is located in the first area on the first sub-film layer 112. In this way, a difference between a thickness of the first dielectric layer 110 in the first area and a thickness of the first dielectric layer 110 in the second area outside the first area is a thickness of the second sub-film layer 113, and the second sub-film layer 113 may have a side wall that is not strictly vertical enough. In this case, the side wall may be located in the first area. A thickness range of the first sub-film layer 112 may be 20 nm to 500 nm, and a material of the first sub-film layer 112 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. A thickness range of the second sub-film layer 113 may be 20 nm to 500 nm, and a material of the second sub-film layer 113 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

The gate 120 is formed in the first area, the gate 120 includes a first gate structure and a second gate structure that are connected in a direction perpendicular to the surface of the substrate, and the first gate structure penetrates the first dielectric layer 110 on the substrate 100. Because the gate 120 is located in the first area, the first gate structure penetrates a thicker part of the first dielectric layer 110. The second gate structure is formed on the first dielectric layer 110 (in an upward direction in FIG. 3A, FIG. 3B, and FIG. 3C). To be specific, the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer. In this case, a dimension of the second gate structure in a direction parallel to the surface of the substrate is greater than a dimension of the first gate structure in the direction parallel to the surface of the substrate. In other words, the first gate structure and the second gate structure may form a T-shaped structure. The first gate structure is connected to the substrate 100, and the second gate structure helps balance an electric field and capacitance inside the device. In addition, a gate dielectric layer may be further formed below the gate 120, and the gate dielectric layer is formed between the epitaxial layer and the first gate structure.

The substrate 100 may further include a source 101 and a drain 102. The source 101 and the drain 102 are respectively located on two sides of the gate 120, a channel area is included between the source 101 and the drain 102, the channel area is used to form a conductive channel when the device is in use, the first area is located above the channel area, and the gate 120 is also located above the channel area. The gate 120 may have good conductivity, and a material of the gate 120 may be at least one of nickel (Ni), titanium (Ti), aluminum (Al), palladium (Pd), platinum (Pt), gold (Au), titanium nitride (TiN), tantalum nitride (TaN), and copper (Cu). There is a parasitic capacitance C1 between the first gate structure in the gate 120 and the drain 102, and the parasitic capacitance C1 is related to a size of the first gate structure. There is a parasitic capacitance C2 between the second gate structure in the gate 120 and the drain 102, and the parasitic capacitance C2 is related to a thickness and a dielectric constant of the first dielectric layer 110 below the second gate structure.

The second dielectric layer 130 may cover the gate 120 and the first dielectric layer 110. The second dielectric layer 130 may protect the gate 120, or may be used as an isolation layer. A material of the second dielectric layer 130 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide, and a thickness range of the second dielectric layer 130 may be 20 nm to 500 nm.

The field plate 140 is located on the second dielectric layer 130. The field plate 140 may face a part of the gate 120 that faces the drain 102 in a direction perpendicular to the surface of the substrate 100, and extend to the drain 102. In other words, the field plate 140 may be located on a side of the second gate structure that faces the drain 102, and extend above the second gate structure (in an upward direction in FIG. 3A, FIG. 3B, and FIG. 3C). A part of the field plate 140 that is located in the second area is electrically connected to the source 101 (refer to the field plate 140 on the source 101 in FIG. 3A, FIG. 3B, and FIG. 3C, where the field plate 140 on the source 101 is in an integrated structure with the field plate 140 at the top of the gate 120), and is configured to modulate the electric field and capacitance distributions between the source 101 and the drain 102, to implement a specific indicator of a high-frequency gain. A material of the field plate 140 is at least one of Ni, Ti, Al, Pd, Pt, Au, TiN, TaN, and Cu. The material of the field plate 140 and the material of the gate 120 may be the same or different. A thickness range of the field plate 140 is 20 nm to 1500 nm. When the device operates, there is a parasitic capacitance C3 between the field plate 140 and a conductive channel below the field plate 140. The parasitic capacitance affects an overall parasitic capacitance of the device, and is related to a thickness and a dielectric constant of the first dielectric layer 110 below the field plate 140, and a thickness and a dielectric constant of the second dielectric layer 130 below the field plate 140.

In this embodiment of this disclosure, the first dielectric layer 110 is thicker in the first area, and is thinner in the second area outside the first area. To be specific, the thickness of the first dielectric layer 110 in the first area is greater than the thickness of the first dielectric layer 110 in the second area outside the first area. In this way, the capacitance C2 between the second gate structure and the drain 102 can be reduced without affecting the parasitic capacitance C3 between the field plate 140 and the conductive channel. Therefore, the overall parasitic capacitance of the device can be effectively reduced. In addition, because the thickness of the first dielectric layer 110 in the first area is large, the electric potential and electric field distribution at an end of the gate 120 that is close to the drain 102 may be adjusted, to effectively reduce the electric field stress at a position in which a TDDB failure is likely to occur, to improve the overall robustness of the device.

FIG. 4 is a schematic diagram of another transverse electric field stress distribution according to an embodiment of this disclosure. A horizontal coordinate is a position in a direction along a surface of the substrate 100, and a vertical coordinate is an electric field stress at each position in a high-voltage reverse-biased stress state. A first electric field peak may correspond to an end of the first gate structure that is close to the drain 102, a second electric field peak may correspond to an end of the second gate structure that is close to the drain 102, a third electric field peak may correspond to an end of a bottom layer of the field plate 140 that is close to the gate 120, and a fourth electric field peak may correspond to an end of the bottom layer of the field plate 140 that is close to the drain 102. It can be learned from the figure that the second electric field peak is reduced, so that a risk of TDDB failure is reduced.

An embodiment of this disclosure provides a semiconductor device, including a substrate, a gate, a second dielectric layer, and a field plate. The substrate has a first dielectric layer, and a thickness of the first dielectric layer in a first area is greater than a thickness of the first dielectric layer in a second area outside the first area. The gate is located on the substrate within the first area, and the gate includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate. The first gate structure penetrates the first dielectric layer in the direction perpendicular to the surface of the substrate, and the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer. The second dielectric layer covers the gate and the first dielectric layer. The field plate is located on the second dielectric layer and is disposed in both the first area and the second area. In this way, by comparison with the capacitance in a semiconductor device with a first dielectric layer having a uniform thickness, in the present semiconductor device, the capacitance between the second gate structure and a drain is reduced due to a large thickness of the first dielectric layer in the first area, and the capacitance between the field plate and a channel is increased due to a small thickness of the first dielectric layer in the second area. Accordingly, the parasitic capacitance of the semiconductor device is reduced, and a gain characteristic of the semiconductor device at higher frequencies is improved. In addition, this design may further re-adjust electric field stresses inside the device. Because the thickness of the first dielectric layer in the first area is large, an electric field peak at the second gate structure is reduced, improving the overall robustness of the device.

Based on the semiconductor device provided in embodiments of this disclosure, an embodiment of this disclosure further provides a semiconductor device manufacturing method. FIG. 5 is a flowchart of a semiconductor device manufacturing method according to an embodiment of this disclosure. The method may include the following steps.

S101: Provide a substrate 100. Refer to FIG. 6.

In this embodiment of this disclosure, the substrate 100 may be designed based on different device requirements. In an embodiment, the substrate 100 may include a base and an epitaxial layer. The epitaxial layer is formed on a surface of the base and is disposed towards a gate 120. The base may be a semiconductor base, for example, one or more of GaN, AlN, Si, SiC, and sapphire. The base may provide a support function for the semiconductor device, or constitute a part of a functional layer of the semiconductor device. The epitaxial layer may be a film layer obtained through epitaxial growth on the base, and is usually a functional layer constituting the semiconductor device, for example, may be one or more of GaN, AlGaN, InAlN, AlN, and ScAlN. The materials of the base and the epitaxial layer may be the same, or may be different. The silicon carbide substrate may comprise a single crystal structure, and may have a plurality of structure types, for example, 4H-silicon carbide, 6H-silicon carbide, and 3C-silicon carbide.

In a gate-last process, a source 101 and a drain 102 may be formed before the gate 120, and the substrate 100 may further include the source 101 and the drain 102. A channel area may be included between the source 101 and the drain 102. The channel area is used to form a conductive channel when the device is in use. The source 101 and the drain 102 may be obtained by doping the substrate 100.

S102: Form a first dielectric layer on the substrate 100, and form a gate 120 in a first area on the substrate 100, where a thickness of the first dielectric layer 110 in the first area is greater than a thickness of the first dielectric layer 110 in a second area outside the first area; and the gate 120 includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate. Refer to FIG. 7 to FIG. 10, FIG. 12 to FIG. 15, and FIG. 17 to FIG. 22.

In this embodiment of this disclosure, a first dielectric layer 110 may be formed on the substrate 100, and the thickness of the first dielectric layer 110 in the first area is greater than the thickness of the first dielectric layer 110 in the second area outside the first area. The first area may be an area used to form the gate, and may be a central to an area in which the source and the drain are located. The first area may be greater than an area in which the gate is located, or may be equal to the area in which the gate is located. The first dielectric layer 110 may be formed before the gate 120, or may be formed in a process of forming the gate 120.

In this embodiment of this disclosure, the gate 120 is formed in the first area, the gate 120 includes a first gate structure and a second gate structure that are connected in a direction perpendicular to the surface of the substrate, and the first gate structure penetrates the first dielectric layer 110 on the substrate 100. Because the gate 120 is located in the first area, the first gate structure penetrates a thicker part of the first dielectric layer 110. The second gate structure is formed on the first dielectric layer 110 (in an upward direction in FIG. 3A, FIG. 3B, and FIG. 3C). In this case, a dimension of the second gate structure in a direction parallel to the surface of the substrate is greater than a dimension of the first gate structure in the direction parallel to the surface of the substrate. In other words, the first gate structure and the second gate structure may form a T-shaped structure. A gate dielectric layer may be further formed below the gate 120, and the gate dielectric layer is formed between the epitaxial layer and the first gate structure. The gate 120 may have good conductivity, and a material of the gate 120 may be at least one of Ni, Ti, Al, Pd, Pt, Au, TiN, TaN, and Cu. There is a parasitic capacitance C1 between the first gate structure in the gate 120 and the drain 102, and the parasitic capacitance is related to a size of the first gate structure. There is a parasitic capacitance C2 between the second gate structure in the gate 120 and the drain 102, and the parasitic capacitance C2 is related to a thickness and a dielectric constant of the first dielectric layer 110 below the second gate structure.

In this embodiment of this disclosure, the first dielectric layer 110 is thicker in the first area, and is thinner in the second area outside the first area. To be specific, the thickness of the first dielectric layer 110 in the first area is greater than the thickness of the first dielectric layer 110 in the second area outside the first area. In this way, the capacitance between the second gate structure and the drain 102 can be reduced without affecting the parasitic capacitance of another position. Therefore, the overall parasitic capacitance of the device can be effectively reduced. In addition, because the thickness of the first dielectric layer 110 in the first area is large, electric potential and electric field distribution at an end of the gate 120 that is close to the drain 102 may be adjusted, to effectively reduce the electric field stress at a position in which a TDDB failure is likely to occur, to improve the overall robustness of the device.

In this embodiment of this disclosure, the first dielectric layer 110 may be a plurality of stacked film layers, or may be an integrated structure of one layer of film. One layer of film may include a plurality of materials, or may include one material.

In a possible method of forming the first dielectric layer 110 and the gate 120, the first dielectric layer 110 may include a first sub-film layer 112 and a second sub-film layer 113. In this case, the first sub-film layer 112 and a second sub-material layer 113′ may be first successively deposited on the substrate 100. Refer to FIG. 7. A thickness range of the first sub-film layer 112 may be 20 nm to 500 nm, and a material of the first sub-film layer 112 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. A thickness range of the second sub-material layer 113′ may be 20 nm to 500 nm, and a material of the second sub-material layer 113′ may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. The first sub-film layer 112 and the second sub-material layer 113′ may have different refractive indexes, densities, and degrees of etching resistance. The first sub-film layer 112 and the second sub-material layer 113′ may comprise a same material or different materials. When the first sub-film layer 112 and the second sub-material layer 113′ have a same material layer, the first sub-film layer 112 and the second sub-material layer 113′ may have different deposition temperatures, so that the first sub-film layer 112 and the second sub-material layer 113′ have different refractive indexes, densities, and degrees of etching resistance.

Then, the second sub-material layer 113′ and the first sub-film layer 112 in the first area may be etched, to obtain a first via 119. Refer to FIG. 8. The second sub-material layer 113′ and the first sub-film layer 112 may be etched by using a photo-lithography process. An etching method may be anisotropic dry etching or wet etching. The first via 119 is located in the first area, to expose the substrate 100 in the first area. When a gate dielectric layer is formed on the substrate 100, the first via 119 may expose the gate dielectric layer.

Then, a first gate structure located inside the first via 119 and a second gate structure that is connected to the first gate structure and that covers a part of the first dielectric layer may be formed, to obtain the gate 120. Refer to FIG. 9. The first gate structure and the second gate structure may be formed through deposition and etching. In an embodiment, a conductor material may be deposited, so that the conductor material fills the first via 119 and covers the first via 119. A thickness range of the conductor material may be 20 nm to 1500 nm, and the conductor material may be at least one of Ni, Ti, Al, Pd, Pt, Au, TiN, TaN, and Cu. Then, the conductor material outside the first area may be removed to form the gate 120 located in the conductor area.

Then, the second sub-material layer 113′ outside the second gate structure may be etched and removed by using the second gate structure as a mask, where the second sub-material layer 113′ located in the first area is used as the second sub-film layer 113. Refer to FIG. 10. Because there is a difference in etching resistance between the first sub-film layer 112 and the second sub-material layer, the second sub-material layer 113′ may be etched by using the first sub-film layer 112 as an etching stop layer and using the second gate structure as a hard self-aligning mask, to obtain the second sub-film layer 113. An etched surface stays at a position between the first sub-film layer 112 and the second sub-material layer 113′, an etched thickness is a thickness of the second sub-material layer 113′, and an etching method may be anisotropic dry etching or wet etching. Because the second gate structure may be used as the mask, there is no need to add a sequential photo-lithography process, and reducing costs. It is clear that the etching of the second sub-material layer 113′ may alternatively be performed by using a photo-lithography process before the first gate structure and the second gate structure are formed. Details are not described herein.

In other words, the first dielectric layer 110 may include the first sub-film layer 112 and the second sub-film layer 113. The first sub-film layer 112 covers the substrate 100, and the second sub-film layer 113 is located in the first area on the first sub-film layer 112. In this way, a difference between a thickness of the first dielectric layer 110 in the first area and a thickness of the first dielectric layer 110 in the second area outside the first area is a thickness of the second sub-film layer 113. A material of the first sub-film layer 112 and/or the second sub-film layer 113 is at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

In another possible method of forming the first dielectric layer 110 and the gate 120, a first dielectric material layer 115 may be first deposited on the substrate 100. Refer to FIG. 12. A thickness range of the first dielectric material layer 115 may be 40 nm to 1000 nm, and a material of the first dielectric material layer 115 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide.

Then, the first dielectric material layer 115 in the first area may be etched, to obtain a second via 116. Refer to FIG. 13. The first dielectric material layer 115 may be etched by using a photo-lithography process. An etching method may be anisotropic dry etching or wet etching. The second via 116 is located in the first area, to expose the substrate 100 in the first area. When a gate dielectric layer is formed on the substrate 100, the second via 116 may expose the gate dielectric layer.

Then, a first gate structure located inside the second via 116 and a second gate structure connected to the first gate structure that covers a part of the first dielectric layer may be formed, to form the gate 120. Refer to FIG. 14. The first gate structure and the second gate structure may be formed through deposition and etching. In an embodiment, a conductor material may be deposited, so that the conductor material fills the second via 116 and covers the second via 116. A thickness range of the conductor material may be 20 nm to 1500 nm, and the conductor material may be at least one of Ni, Ti, Al, Pd, Pt, Au, TiN, TaN, and Cu. Then, the conductor material outside the first area may be removed to form the gate 120 located in the conductor area.

Then, the first dielectric material layer 115 outside the first area may be etched, to remove a part with a specific thickness of the first dielectric material layer 115 that is in the second area outside the first area. That is, the first dielectric material layer 115 in the second area is thinned, to form the first dielectric layer 110. Refer to FIG. 15. In an etching process, a second gate structure is used as a hard self-aligning mask, an etched thickness may be controlled by using an etching rate and an etching duration, a thickness range may be 20 nm to 500 nm, and an etching method may be anisotropic dry etching or wet etching. Because the first dielectric layer 110 in the second area outside the first area is thinned through etching, the first dielectric layer 110 in the second area is thin in thickness. In an embodiment, a thickness of the first dielectric layer 110 in the first area is a deposition thickness of the first dielectric material layer 115, a thickness range of the first dielectric layer 110 in the first area may be 40 nm to 1000 nm, and a thickness range of the first dielectric layer 110 in the second area outside the first area may be 20 nm to 500 nm. Because the second gate structure may be used as the mask, there is no need to add a sequential photo-lithography process. This can reduce costs. It is clear that the etching of the first dielectric material layer 115 in the second area outside the first area may alternatively be performed by using a photo-lithography process before the first gate structure and the second gate structure are formed. Details are not described herein.

In still another possible method of forming the first dielectric layer 110 and the gate 120, the first dielectric layer includes a first sub-film layer 112 and a second sub-film layer 113. In this case, a first sub-material layer 111 may be deposited on the substrate 100. Refer to FIG. 17. Then, a first sub-material layer 111 in the second area outside the first area is removed, and the third sub-material layer 111 in the first area is used as the first sub-film layer 112. Refer to FIG. 19. A thickness range of the first sub-material layer 111 may be 20 nm to 500 nm, and a material of the first sub-material layer 111 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. The first sub-material layer 111 may be etched by using a photo-lithography process. An etching manner may be anisotropic dry etching or wet etching.

Then, the second sub-film layer 113 covering the first sub-film layer 112 and the substrate 100 may be formed. Refer to FIG. 20. The second sub-film layer 113 may be formed through deposition, a thickness range of the second sub-film layer 113 may be 20 nm to 500 nm, and a material of the second sub-film layer 113 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. The second sub-film layer 113 may cover an upper surface and a side wall of the first sub-film layer 112, and the substrate 100 outside the first sub-film layer 112.

Then, the second sub-film layer 113 and the first sub-film layer 112 in the first area may be etched, to obtain a third via 114. Refer to FIG. 21. The second sub-film layer 113 and the first sub-film layer 112 may be etched by using a photo-lithography process. An etching method may be anisotropic dry etching or wet etching. The third via 114 may be disposed in the first area, to expose the substrate 100 in the first area. When a gate dielectric layer is formed on the substrate 100, the third via 114 may expose the gate dielectric layer.

Then, a first gate structure located inside the third via 114 and a second gate structure that is connected to the first gate structure and that covers a part of the first dielectric layer may be formed, to form the gate 120. Refer to FIG. 22. The first gate structure and the second gate structure may be formed through deposition and etching. In an embodiment, a conductor material may be deposited, so that the conductor material fills the third via 114 and covers the third via 114. A thickness range of the conductor material may be 20 nm to 1500 nm, and the conductor material may be at least one of Ni, Ti, Al, Pd, Pt, Au, TiN, TaN, and Cu. Then, the conductor material outside the first area may be removed to form the gate 120 located in the conductor area.

In yet another possible method of forming the first dielectric layer 110 and the gate 120, the first dielectric layer includes a first sub-film layer 112 and a second sub-film layer 113, and the first sub-film layer 112 may be formed on the substrate 100 in the first area by using a double-layer photoresist patterning process. A double-layer photoresist pattern includes a first photoresist 103 that has a large opening and that is located at a lower layer and a second photoresist 104 that has a small opening and that is located at an upper layer. In this way, a position of the first sub-film layer 112 is defined by using the openings in the double-layer photoresist. Refer to FIG. 18. Then, the first sub-film layer 112 may be formed in the openings by using a deposition process. It is clear that a dielectric material is also formed on the photoresist layer during deposition. Refer to FIG. 18. A thickness range of the first sub-film layer 112 may be 20 nm to 500 nm, and a material of the first sub-film layer 112 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide. Then, the double-layer photoresist 103/104 and the dielectric material on the double-layer photoresist 103/104 may be removed through dry etching or wet etching. Refer to FIG. 19. Then the first sub-film layer 112 may be cleaned through a dry treatment and/or wet treatment.

Then, the second sub-film layer 113 covering the first sub-film layer 112 and the substrate 100 may be formed. The second sub-film layer 113 and the first sub-film layer 112 in the first area are etched to obtain a third via 114, to form a first gate structure inside the third via 114 and a second gate structure connected to the first gate structure that covers a part of the first dielectric layer. For formation of the second sub-film layer 113, formation of the third via, and formation of the first gate structure and the second gate structure, refer to the foregoing method, and FIG. 20, FIG. 21, and FIG. 22. Details are not described herein again.

In other words, the first dielectric layer 110 may include the first sub-film layer 112 and the second sub-film layer 113. The first sub-film layer 112 is located in the first area on the substrate 100, and the second sub-film layer 113 covers the first sub-film layer 112 and the substrate 100 in the second area outside the first sub-film layer 112. In this way, a thickness difference between the first dielectric layer 110 in the first area and a thickness of the first dielectric layer 110 in the second area outside the first area is a thickness of the first sub-film layer 112.

S103: Form a second dielectric layer 130 covering the gate 120 and the first dielectric layer 110. Refer to FIG. 11, FIG. 16, and FIG. 23.

After the gate 120 is formed, the second dielectric layer 130 covering the gate 120 and the first dielectric layer 110 may be formed. The second dielectric layer 130 may protect the gate 120, or may be used as an isolation layer. The second dielectric layer 130 may be formed through deposition, a material of the second dielectric layer 130 may be at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide, and a thickness range of the second dielectric layer 130 may be 20 nm to 500 nm.

In a gate-first process, after the second dielectric layer 130 is formed, the second dielectric layer 130 and the first dielectric layer 110 may be etched to expose a source and drain area of the substrate 100, to form the source 101 and the drain 102.

S104: Form a field plate 140 on the second dielectric layer 130. Refer to FIG. 1, FIG. 3A to FIG. 3C, and FIG. 4.

After the second dielectric layer 130 is formed, the field plate 140 may be formed on the second dielectric layer 130. The field plate 140 may face a part of the gate that faces the drain in a direction perpendicular to a surface of the substrate, and extend to the drain. In other words, the field plate 140 may be located on a side of the second gate structure that faces the drain 102, and extend above the second gate structure (in an upward direction in FIG. 3A, FIG. 3B, and FIG. 3C). A part of the field plate 140 that is located in the second area is electrically connected to the source 101 (refer to the field plate 140 on the source 101 in FIG. 3A, FIG. 3B, and FIG. 3C, where the field plate 140 on the source 101 is in an integrated structure with the field plate 140 at the top of the gate 120), and is configured to modulate the electric field and capacitance distributions between the source and the drain, to implement a specific indicator of a high-frequency gain. A material of the field plate 140 is at least one of Ni, Ti, Al, Pd, Pt, Au, TiN, TaN, and Cu. The material of the field plate 140 and the material of the gate 120 may be the same or different. A thickness range of the field plate 140 is 20 nm to 1500 nm. When the device operates, there is a parasitic capacitance C3 between the field plate 140 and a conductive channel below the field plate 140. The parasitic capacitance affects an overall parasitic capacitance of the device, and is related to a thickness and a dielectric constant of the first dielectric layer 110 below the field plate 140, and a thickness and a dielectric constant of the second dielectric layer 130 below the field plate 140.

Because a thickness of an area of the first dielectric layer 110 that is under the second gate structure is greater than a thickness of the first dielectric layer 110 in the second area outside the second gate structure, the capacitance between the second gate structure and the drain 102 can be reduced without affecting the parasitic capacitance between the field plate 140 and the channel. Therefore, parasitic capacitance of the entire device can be effectively reduced.

An embodiment of this disclosure provides a semiconductor device manufacturing method. The method includes: providing a substrate; forming a first dielectric layer and a gate on the substrate, where a thickness of the first dielectric layer in a first area is greater than a thickness of the first dielectric layer in a second area outside the first area, the gate is located on the substrate within the first area, and the gate includes a first gate structure and a second gate structure that are connected in a direction perpendicular to a surface of the substrate. The first gate structure penetrates the first dielectric layer in the direction perpendicular to the surface of the substrate, and the second gate structure is formed on a side of the first dielectric layer away from the substrate and covers a part of the first dielectric layer; then forming a second dielectric layer covering the gate and the first dielectric layer; and forming a field plate on the second dielectric layer, where the field plate is disposed in both the first area and the second area. In this way, by comparison with the capacitance in a semiconductor device with a first dielectric layer having a uniform thickness, in the present semiconductor device, the capacitance between the second gate structure and a drain is reduced due to a large thickness of the first dielectric layer in the first area, and the capacitance between the field plate and a channel is increased due to a small thickness of the first dielectric layer in the second area. Accordingly, the parasitic capacitance of the semiconductor device is reduced, and a gain characteristic of the semiconductor device at higher frequencies is improved. In addition, this design may further re-adjust electric field stresses inside the device. Because the thickness of the first dielectric layer in the first area is large, an electric field peak at the second gate structure is reduced, improving the overall robustness of the device.

Based on the semiconductor device provided in embodiments of this disclosure, an embodiment of this disclosure further provides an electronic device. The electronic device includes a circuit board and a semiconductor device connected to the circuit board. The semiconductor device may be any semiconductor device provided in the foregoing specification. The circuit board may be a printed circuit board (PCB). It is clear that the circuit board may alternatively be a flexible circuit board (FPC), and the like. The circuit board is not limited in this embodiment. The electronic device can optionally be different types of user equipment or terminal devices such as a computer, a mobile phone, a tablet computer, a wearable device, and a vehicle-mounted device. The electronic device may alternatively be a network device such as a base station.

Optionally, the electronic device further includes a package substrate. The package substrate is fastened to the printed circuit board PCB by using a solder ball, and the semiconductor device is likewise fastened to the package substrate by using a solder ball.

Another aspect of this disclosure further provides a non-transitory computer-readable storage medium for use with a computer. The computer has software for creating an integrated circuit. The computer-readable storage medium stores one or more computer-readable data structures. The one or more computer-readable data structures have optical mask data for manufacturing the integrated circuit provided in any one of the figures provided in the foregoing specification.

Embodiments in this specification are all described in a progressive manner. For same or similar parts in the embodiments, refer to these embodiments. Each embodiment focuses on a difference from the other embodiments.

The foregoing are specific implementations of this disclosure. It should be understood that, the foregoing embodiments are merely intended for describing the technical solutions of this disclosure, but not for limiting this disclosure. Although this disclosure is described in detail with reference to the foregoing embodiments, persons of ordinary skill in the art should understand that they may still make modifications to the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features thereof, without departing from the scope of the technical solutions of embodiments of this disclosure.

Claims

1. A semiconductor device, comprising: a substrate;a first dielectric layer having a first area and a second area disposed outside of the first area, a first thickness of the first dielectric layer in the first area being greater than a second thickness of the first dielectric layer in the second area;a gate, located on the substrate in the first area, the gate comprising:a first gate structure penetrating the first area of the first dielectric layer in a direction perpendicular to a surface of the substrate; anda second gate structure contacting the first gate structure, wherein the second gate structure covers the first gate structure and covers a part of the first dielectric layer;a second dielectric layer covering the first gate and the first dielectric layer; anda field plate having a part disposed on the second dielectric layer and that is disposed in both the first area and the second area.

2. The semiconductor device according to claim 1, further comprising: a source, located in the substrate; anda drain, located in the substrate, wherein the gate is disposed between the source and the drain;wherein the part of the field plate disposed on the second dielectric layer extends from the first area to the second area in a direction of the drain, and another part of the field plate is located in the second area and is electrically connected to the source.

3. The semiconductor device according to claim 1, wherein the first dielectric layer comprises: a first layer disposed to cover the substrate; anda second layer located in the first area and on the first layer.

4. The semiconductor device according to claim 1, wherein the first dielectric layer comprises: a first layer disposed on the substrate and located in the first area; anda second layer covering the first layer and covering the substrate in the second area.

5. The semiconductor device according to claim 3, wherein a material of at least one of the first layer or the second sub-film layer comprises at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, or titanium oxide.

6. The semiconductor device according to claim 4, wherein a material of at least one of the first layer or the second sub-film layer comprises at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, or titanium oxide.

7. The semiconductor device according to claim 1, wherein the substrate comprises: a base and an epitaxial layer, wherein the epitaxial layer is disposed between the base and the gate;a material of the base comprises one or more of gallium nitride, aluminum nitride, silicon, silicon carbide, or sapphire; anda material of the epitaxial layer comprises one or more of gallium nitride, aluminum gallium nitride, indium aluminum nitride, aluminum nitride, or scandium aluminum nitride.

8. The semiconductor device according to claim 1, wherein a material of the gate or the field plate comprises at least one of nickel, titanium, aluminum, palladium, platinum, gold, titanium nitride, tantalum nitride, or copper.

9. The semiconductor device according to claim 1, wherein a material of the second dielectric layer comprises at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, or titanium oxide.

10. A semiconductor device manufacturing method, comprising: forming, on a substrate, a gate and a first dielectric layer having a first area and a second area disposed outside of the first area, wherein the gate is located in the first area; wherein a first thickness of the first dielectric layer in the first area is greater than a second thickness of the first dielectric layer in the second area; and the gate comprises a first gate structure and a second gate structure that are in contact, the first gate structure penetrating the first area of the first dielectric layer in a direction perpendicular to a surface of the substrate, and the second gate structure covers the first gate structure and covers a part of the first dielectric layer;forming a second dielectric layer covering the gate and the first dielectric layer; andforming a field plate on the second dielectric layer, wherein a part of the field plate is disposed in both the first area and the second area.

11. The method according to claim 10, further comprising: forming a source and a drain in the substrate, wherein the gate is disposed between the source and the drain; andwherein the part of the field plate disposed on the second dielectric layer extends from the first area to the second area in a direction of the drain, and another part of the field plate is located in the second area and is electrically connected to the source.

12. The method according to claim 10, wherein the first dielectric layer comprises a first layer and a second layer, and forming the first dielectric layer and the gate on the substrate comprises: forming the first layer and the second layer sequentially on the substrate;etching the second layer and the first layer in the first area to obtain a via;forming the first gate structure inside the via, and forming the second gate structure across the first gate structure and on the first dielectric layer; andetching the second layer, using the second gate structure as a mask, to remove the second layer except for a portion of the second layer located in the first area and protected by the mask.

13. The method according to claim 10, wherein forming the first dielectric layer and the gate on the substrate comprises: forming the first dielectric material layer on the substrate;etching the first dielectric material layer in the first area to obtain a via;forming the first gate structure the via, and forming the second gate structure across the first gate structure and on the first dielectric layer; andthinning the first dielectric material layer in the second area.

14. The method according to claim 10, wherein the first dielectric layer comprises a first layer and a second layer, and forming the first dielectric layer and the gate on the substrate comprises: forming the first layer on the substrate;removing the first layer in the second area;forming the second layer across the first layer and the substrate;etching the second layer and the first layer in the first area to obtain a via; andforming the first gate structure inside the via and forming the second gate structure across the first gate structure and on the first dielectric layer.

15. The method according to claim 10, wherein the first dielectric layer comprises a first layer and a second layer, and forming the first dielectric layer and the gate on the substrate comprises: forming the first layer in the first area on the substrate by using a double-layer photoresist patterning process;forming the second layer across the first layer and the substrate;etching the second layer and the first layer in the first area to obtain a via; andforming the first gate structure inside the via and forming the second gate structure across the first gate structure and on the first dielectric layer.

16. The method according to claim 12, wherein a material of the first layer or a material of the second layer comprises at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, or titanium oxide.

17. The method according to claim 10, further comprising: forming a base and an epitaxial layer, wherein the epitaxial layer is disposed between the base and the gate;a material of the base comprises one or more of gallium nitride, aluminum nitride, silicon, silicon carbide, or sapphire; anda material of the epitaxial layer comprises one or more of gallium nitride, aluminum gallium nitride, indium aluminum nitride, aluminum nitride, or scandium aluminum nitride.

18. The method according to claim 10, wherein a material of the gate or the field plate comprises at least one of nickel, titanium, aluminum, palladium, platinum, gold, titanium nitride, tantalum nitride, or copper.

19. The method according to claim 10, wherein a material of the second dielectric layer comprises at least one of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, or titanium oxide.