High-frequency adaptations

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/66High-frequency adaptations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,682
- Issue date May 13, 2025
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package with via structure and method of formation thereof
- Patent number 12,300,874
- Issue date May 13, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and preparation method thereof
- Patent number 12,302,622
- Issue date May 13, 2025
- Dynax Semiconductor, Inc.
- Shufeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 12,301,179
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Yoshinobu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
High ruggedness heterojunction bipolar transistor (HBT)
- Patent number 12,295,152
- Issue date May 6, 2025
- Visual Photonics Epitaxy Co., Ltd.
- Chao-Hsing Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement comprising an integrated circuit package and a heatsink...
- Patent number 12,288,757
- Issue date Apr 29, 2025
- SIVERS WIRELESS AB
- Erik Öjefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for insertion loss reduction in signal trans...
- Patent number 12,283,488
- Issue date Apr 22, 2025
- Yuan Ze University
- Cheng En Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D inductor design using bundle substrate vias
- Patent number 12,283,607
- Issue date Apr 22, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terahertz element and semiconductor device
- Patent number 12,278,423
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Toshikazu Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with antenna and front end integrated circuit
- Patent number 12,279,353
- Issue date Apr 15, 2025
- Skyworks Solutions, Inc.
- George Khoury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier semiconductor device
- Patent number 12,278,601
- Issue date Apr 15, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Akihiko Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on wiring board having reference potential pla...
- Patent number 12,278,198
- Issue date Apr 15, 2025
- Renesas Electronics Corporation
- Yoshikazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Main-auxiliary field-effect transistor configurations
- Patent number 12,273,100
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,272,655
- Issue date Apr 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide interconnects for semiconductor packages and related methods
- Patent number 12,266,840
- Issue date Apr 1, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device to reduce signal loss in a transmission line
- Patent number 12,266,603
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Pablo Jesús Gardella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN-on-silicon devices
- Patent number 12,266,523
- Issue date Apr 1, 2025
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 12,266,614
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...
- Publication number 20250159787
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...
- Publication number 20250159987
- Publication date May 15, 2025
- Hangzhou Geo-chip Technology Co., Ltd.
- Ruili WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...
- Publication number 20250155489
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Akio MATSUSHITA
- G01 - MEASURING TESTING
Information Patent Application
FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE
- Publication number 20250159788
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20250158269
- Publication date May 15, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...
- Publication number 20250157953
- Publication date May 15, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...
- Publication number 20250157954
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LIMITED
- Robert James MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT, CRYSTAL, AND SYS...
- Publication number 20250159786
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20250150113
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile Resonator Radiator for Phased Array Applications
- Publication number 20250149794
- Publication date May 8, 2025
- International Business Machines Corporation
- Duixian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS
- Publication number 20250151340
- Publication date May 8, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet DEDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20250151392
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Stabilized SOI FETs
- Publication number 20250149470
- Publication date May 8, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT COMPONENT
- Publication number 20250149472
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Hisatoshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT CAVITY STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250151374
- Publication date May 8, 2025
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES
- Publication number 20250149473
- Publication date May 8, 2025
- Qorvo US, Inc.
- Soack-Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING METAL-OXIDE SEMICONDUCTOR TRANS...
- Publication number 20250142947
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jinhyeok SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250140679
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SangHoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Power Converter Assembly
- Publication number 20250140621
- Publication date May 1, 2025
- Lotus Microsystems APS
- Ahmed Morsi Ammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPLINE MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) INTERCONNE...
- Publication number 20250140717
- Publication date May 1, 2025
- Board of Trustees of the University of Arkansas
- Samir El-Ghazaly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVERSION APPARATUS FROM CHIP PACKAGE TO WAVEGUIDE, RADIO FREQUENC...
- Publication number 20250132483
- Publication date Apr 24, 2025
- CALTERAH SEMICONDUCTOR TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhefan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132272
- Publication date Apr 24, 2025
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...
- Publication number 20250132273
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED IMPLANTABLE MEDICAL DEVICES AND ASSOCIATED FABRICATION...
- Publication number 20250133814
- Publication date Apr 24, 2025
- University of Florida Research Foundation, Incoprated
- Adam Khalifa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125289
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- KaiChong CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE
- Publication number 20250118688
- Publication date Apr 10, 2025
- Chengdu Sicore Semiconductor Corp. Ltd.
- Cemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE
- Publication number 20250118708
- Publication date Apr 10, 2025
- RICHWAVE TECHNOLOGY CORP.
- Kuang-Lieh Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS
- Publication number 20250119102
- Publication date Apr 10, 2025
- NXP USA, Inc.
- Vikas SHILIMKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESH INDUCTORS AND ANTENNAS OF ELECTRONIC ASSEMBLIES
- Publication number 20250105143
- Publication date Mar 27, 2025
- Super Micro Computer, Inc.
- Manhtien V. PHAN
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus

Method of forming an electronic device structure having an electron...

Semiconductor package

Antenna package with via structure and method of formation thereof

Electronic component module

Semiconductor device and preparation method thereof

High frequency amplifier

Package comprising discrete antenna device

Electronic circuit comprising a RF switches having reduced parasiti...

High ruggedness heterojunction bipolar transistor (HBT)

Arrangement comprising an integrated circuit package and a heatsink...

Interconnect structure for insertion loss reduction in signal trans...

Semiconductor packages

3D inductor design using bundle substrate vias

Terahertz element and semiconductor device

Packaged module with antenna and front end integrated circuit

Power amplifier semiconductor device

Semiconductor device on wiring board having reference potential pla...

Integrated fan-out package with 3D magnetic core inductor

Method of making electrostatic discharge protection cell and antenn...

Main-auxiliary field-effect transistor configurations

Semiconductor devices and methods of manufacturing semiconductor de...

Antenna apparatus and fabrication method

Waveguide interconnects for semiconductor packages and related methods

Semiconductor device to reduce signal loss in a transmission line

Integrated devices in semiconductor packages and methods of forming...

Parasitic capacitance reduction in GaN-on-silicon devices

Semiconductor packages and manufacturing methods thereof

Semiconductor device and method of manufacturing the same

Molded laser package with electromagnetic interference shield and m...

Patents Applicationslast 30 patents

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...

RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...

METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...

FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE

ANTENNA MODULES AND COMMUNICATION DEVICES

VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...

METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT, CRYSTAL, AND SYS...

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

Versatile Resonator Radiator for Phased Array Applications

POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

Transient Stabilized SOI FETs

HIGH-FREQUENCY CIRCUIT COMPONENT

ELECTRICAL CONTACT CAVITY STRUCTURE AND METHODS OF FORMING THE SAME

RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES

INTEGRATED CIRCUIT DEVICE INCLUDING METAL-OXIDE SEMICONDUCTOR TRANS...

ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

Stacked Power Converter Assembly

STRIPLINE MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) INTERCONNE...

CONVERSION APPARATUS FROM CHIP PACKAGE TO WAVEGUIDE, RADIO FREQUENC...

ELECTRONIC DEVICE

ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...

MINIATURIZED IMPLANTABLE MEDICAL DEVICES AND ASSOCIATED FABRICATION...

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

CHIP PACKAGING STRUCTURE

FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE

POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS

MESH INDUCTORS AND ANTENNAS OF ELECTRONIC ASSEMBLIES