High-frequency adaptations

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/66High-frequency adaptations

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Patents Grantslast 30 patents

Information Patent Grant
Integrated tunable filter architecture
- Patent number 12,230,592
- Issue date Feb 18, 2025
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, front-end module, and communication apparatus
- Patent number 12,230,591
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Hiroshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave antenna chip and terminal device
- Patent number 12,224,254
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Weixi Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna effect protection and electrostatic discharge protection fo...
- Patent number 12,224,482
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including metal-oxide semiconductor trans...
- Patent number 12,224,282
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Jinhyeok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-stage Doherty power amplifiers implemented with multiple s...
- Patent number 12,224,713
- Issue date Feb 11, 2025
- NXP USA, INC.
- Mark Pieter van der Heijden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package including antenna horn and semicondu...
- Patent number 12,224,480
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,224,481
- Issue date Feb 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 12,218,408
- Issue date Feb 4, 2025
- Intel Corporation
- Trang Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer coaxial transition
- Patent number 12,218,067
- Issue date Feb 4, 2025
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,211,765
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single die design for different polarizations
- Patent number 12,212,074
- Issue date Jan 28, 2025
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming discrete antenna modules
- Patent number 12,211,808
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-level interposer with RF sloped via and...
- Patent number 12,205,880
- Issue date Jan 21, 2025
- Eagle Technology, LLC
- Matt Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on sapphire substrate for edge computer
- Patent number 12,205,936
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Devendra K. Sadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,206,048
- Issue date Jan 21, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier device and semiconductor die
- Patent number 12,206,371
- Issue date Jan 21, 2025
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van Der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication device
- Patent number 12,199,052
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Hiromichi Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid Doherty power amplifier module
- Patent number 12,199,571
- Issue date Jan 14, 2025
- Ampleon Netherlands B.V.
- Zhi Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices based on wave localization and methods for their use
- Patent number 12,199,050
- Issue date Jan 14, 2025
- SOFTWARE DEFINED TECHNOLOGIES, INC.
- Manichandra Morampudi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RADIO-FREQUENCY AMPLIFIER HAVING REDUCED GAIN VARIATION
- Publication number 20250062735
- Publication date Feb 20, 2025
- Skyworks Solutions, Inc.
- Philip John Lehtola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures for Dual-Thickness Active Area SOI FETS
- Publication number 20250063822
- Publication date Feb 20, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250062209
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SWITCH DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062253
- Publication date Feb 20, 2025
- DB HiTek Co., Ltd.
- Ja Geon KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES
- Publication number 20250056927
- Publication date Feb 13, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250055175
- Publication date Feb 13, 2025
- PanelSemi Corporation
- Ching-Kuang Clive TZUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20250056880
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING AIR GAP
- Publication number 20250046701
- Publication date Feb 6, 2025
- RF MATERIALS CO., LTD.
- Ki Woo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH
- Publication number 20250046736
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Woojin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20250046737
- Publication date Feb 6, 2025
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20250038127
- Publication date Jan 30, 2025
- Lodestar Licensing Group, LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250029940
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20250022817
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Tetsurou ASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022818
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshiki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...
- Publication number 20250022816
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Takaya NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS
- Publication number 20250022775
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Shishir RAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF MODULE
- Publication number 20250022815
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR PROGRAMMING A FUSE
- Publication number 20250022674
- Publication date Jan 16, 2025
- Skyworks Solutions, Inc.
- Bo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- Publication number 20250015020
- Publication date Jan 9, 2025
- MURATA MANUFACTURING CO., LTD.
- Atsushi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SEMICONDUCTOR DEVICE
- Publication number 20250015768
- Publication date Jan 9, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Akihiko NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHES WITH VOLTAGE LEVEL SHIFTERS IN RADIO FREQUENCY APPLICATIONS
- Publication number 20250007499
- Publication date Jan 2, 2025
- Skyworks Solutions, Inc.
- Florinel G. Balteanu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...
- Publication number 20250006667
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios PANAGOPOULOS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION
- Publication number 20250006626
- Publication date Jan 2, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier BELOT
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated tunable filter architecture

Integrated circuit, front-end module, and communication apparatus

Millimeter-wave antenna chip and terminal device

Electronic package including lead frame having multiple conductive...

Antenna effect protection and electrostatic discharge protection fo...

Integrated circuit device including metal-oxide semiconductor trans...

Multiple-stage Doherty power amplifiers implemented with multiple s...

Microelectronic device package including antenna horn and semicondu...

Semiconductor device package and method of manufacturing the same

Antenna boards and communication devices

Through-wafer coaxial transition

Semiconductor device

Substrate, electronic device, and method for manufacturing substrate

Semiconductor device package

Semiconductor device with partial EMI shielding removal using laser...

Single die design for different polarizations

Semiconductor device and method of forming semiconductor package wi...

Semiconductor device and method of forming discrete antenna modules

Electronic device and multi-level interposer with RF sloped via and...

Silicon on sapphire substrate for edge computer

Epitaxial oxide materials, structures, and devices

Die to die high-speed communication without discrete amplifiers bet...

Radio-frequency switching devices having improved voltage handling...

Power amplifier device and semiconductor die

Radio-frequency module and communication device

Hybrid Doherty power amplifier module

Extended via semiconductor structure and device

Devices based on wave localization and methods for their use

Electronic device and semiconductor device

Methods of forming microelectronic device assemblies and packages

Patents Applicationslast 30 patents

RADIO-FREQUENCY AMPLIFIER HAVING REDUCED GAIN VARIATION

Contact Structures for Dual-Thickness Active Area SOI FETS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

RF SWITCH DEVICE AND MANUFACTURING METHOD THEREOF

EPITAXIAL OXIDE MATERIALS, STRUCTURES, AND DEVICES

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

ANTENNA DEVICE

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

PACKAGE STRUCTURE HAVING AIR GAP

WAFFLE-SHAPED RADIO FREQUENCY (RF) SWITCH

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

DEVICE PACKAGE

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

HIGH-FREQUENCY MODULE

SEMICONDUCTOR MODULE

RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...

3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS

RF MODULE

DEVICES AND METHODS FOR PROGRAMMING A FUSE

IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE

POWER AMPLIFIER SEMICONDUCTOR DEVICE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

SWITCHES WITH VOLTAGE LEVEL SHIFTERS IN RADIO FREQUENCY APPLICATIONS

AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...

INTEGRATED CIRCUIT WITH SUPERIMPOSED CHIPS AND CAPACITIVE CONNECTION