High-frequency adaptations

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/66High-frequency adaptations

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Patents Grantslast 30 patents

Information Patent Grant
Integrated millimeter-wave dual-mode matching network
- Patent number 12,368,118
- Issue date Jul 22, 2025
- NXP B.V.
- Harish Nandagopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit fabrication method that includes reconfiguration of via con...
- Patent number 12,369,257
- Issue date Jul 22, 2025
- Innovium, Inc.
- Vittal Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
- Patent number 12,368,111
- Issue date Jul 22, 2025
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with antennas
- Patent number 12,362,297
- Issue date Jul 15, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a handling substrate for a composite structure i...
- Patent number 12,362,226
- Issue date Jul 15, 2025
- Soitec
- Young-Pil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for fabrication of MMIC and RF devices on engineered substr...
- Patent number 12,362,296
- Issue date Jul 15, 2025
- QROMIS, Inc.
- Ozgur Aktas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency device
- Patent number 12,354,979
- Issue date Jul 8, 2025
- Sumitomo Electric Industries, Ltd.
- Noriyoshi Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact cavity structure and methods of forming the same
- Patent number 12,356,705
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,356,550
- Issue date Jul 8, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including two or more stacked semiconductor st...
- Patent number 12,354,984
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Choung Ki Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices related to switch body connections to achieve soft breakdown
- Patent number 12,356,686
- Issue date Jul 8, 2025
- Skyworks Solutions, Inc.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module carrying a plurality of electronic devices
- Patent number 12,349,302
- Issue date Jul 1, 2025
- STMicroelectronics S.r.l.
- Luca Maggi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure having a porous semico...
- Patent number 12,347,673
- Issue date Jul 1, 2025
- Newport Fab, LLC
- Paul D. Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module with transistor dies for multiple amplifier...
- Patent number 12,347,740
- Issue date Jul 1, 2025
- NXP USA, INC.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combiner circuit for Doherty power amplifier and related method of...
- Patent number 12,348,191
- Issue date Jul 1, 2025
- NXP USA, INC.
- Maruf Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 12,341,108
- Issue date Jun 24, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna substrate and electronic device including the same
- Patent number 12,341,252
- Issue date Jun 24, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switches in bulk substrate
- Patent number 12,342,626
- Issue date Jun 24, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,341,109
- Issue date Jun 24, 2025
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,456
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplification device and an RF circuit module
- Patent number 12,334,884
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Mitsunori Samata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 12,334,457
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power amplifier device
- Patent number 12,327,805
- Issue date Jun 10, 2025
- NXP USA, INC.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power amplifier device with air cavity over die
- Patent number 12,328,107
- Issue date Jun 10, 2025
- NXP USA, INC.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor die with primary and ancillary transistor elements
- Patent number 12,327,778
- Issue date Jun 10, 2025
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide interconnect bridges
- Patent number 12,327,795
- Issue date Jun 10, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY
- Publication number 20250239542
- Publication date Jul 24, 2025
- Intel Corporation
- Tae Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250233081
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233089
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ELECTRONIC DEVICE
- Publication number 20250233031
- Publication date Jul 17, 2025
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME
- Publication number 20250232998
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226569
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20250226583
- Publication date Jul 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ SENSORS AND RELATED SYSTEMS AND METHODS
- Publication number 20250224485
- Publication date Jul 10, 2025
- TeraDar, Inc.
- Nicholas Saiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226343
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250218973
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-PATH POWER AMPLIFIER WITH CAPACITOR FOR COMPENSATING FOR A...
- Publication number 20250219587
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Damien Scatamacchia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIER
- Publication number 20250219586
- Publication date Jul 3, 2025
- Mitsubishi Electric Corporation
- Katsuya KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Selective Shielding Usin...
- Publication number 20250218985
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JinHee JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...
- Publication number 20250210550
- Publication date Jun 26, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane MONFRAY
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250210551
- Publication date Jun 26, 2025
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250210854
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Toshikazu MUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-STAGE MULTIPLE-PATH POWER AMPLIFIER WITH IN-PACKAGE AMPLIF...
- Publication number 20250211170
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Lu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250210552
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH ELECTRICAL COMPONENT FORMED OVER A CAVITY AND METHOD TH...
- Publication number 20250210409
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Philippe RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT ARCHITECTURE FOR THREE-DIMENSIONAL HETEROGENEOUS...
- Publication number 20250210441
- Publication date Jun 26, 2025
- HRL LABORATORIES, LLC
- Christopher Roper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20250201730
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20250201728
- Publication date Jun 19, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF COMPONENT WITH INTEGRATED EMI SHIELDING
- Publication number 20250192067
- Publication date Jun 12, 2025
- APPLIED OPTOELECTRONICS, INC.
- William G. MAHONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250192079
- Publication date Jun 12, 2025
- AUO Corporation
- Yi-Cheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE AND DOHERTY AMPLIFIER
- Publication number 20250192726
- Publication date Jun 12, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kohei MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOT-CONFIGURATION DIE-TO-PACKAGE BALUN COUPLER
- Publication number 20250192078
- Publication date Jun 12, 2025
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated millimeter-wave dual-mode matching network

Circuit fabrication method that includes reconfiguration of via con...

Hybrid integrated circuit packages

Semiconductor apparatuses with radio-frequency line elements, and a...

Semiconductor packages with antennas

Method for forming a handling substrate for a composite structure i...

Systems for fabrication of MMIC and RF devices on engineered substr...

High frequency device

Electrical contact cavity structure and methods of forming the same

Sandwich structure power supply module

Semiconductor device including two or more stacked semiconductor st...

Reconstituted substrate structure and fabrication methods for heter...

Devices related to switch body connections to achieve soft breakdown

Electronic module carrying a plurality of electronic devices

Method for forming a semiconductor structure having a porous semico...

Power amplifier module with transistor dies for multiple amplifier...

Combiner circuit for Doherty power amplifier and related method of...

Package structure

Shielded semiconductor package with open terminal and methods of ma...

Antenna substrate and electronic device including the same

Switches in bulk substrate

Chip package and manufacturing method thereof

Electronic package and manufacturing method thereof

Power amplification device and an RF circuit module

Integrated fan-out package

Packaged power amplifier device

Packaged power amplifier device with air cavity over die

3D system integration

Transistor die with primary and ancillary transistor elements

Waveguide interconnect bridges

Patents Applicationslast 30 patents

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE FOR ELECTRONIC DEVICE

WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

TERAHERTZ SENSORS AND RELATED SYSTEMS AND METHODS

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

MULTIPLE-PATH POWER AMPLIFIER WITH CAPACITOR FOR COMPENSATING FOR A...

DOHERTY AMPLIFIER

Semiconductor Device and Method of Forming Selective Shielding Usin...

ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...

ELECTRONIC DEVICE

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE

MULTIPLE-STAGE MULTIPLE-PATH POWER AMPLIFIER WITH IN-PACKAGE AMPLIF...

SEMICONDUCTOR DEVICE PACKAGE

DEVICE WITH ELECTRICAL COMPONENT FORMED OVER A CAVITY AND METHOD TH...

THERMAL MANAGEMENT ARCHITECTURE FOR THREE-DIMENSIONAL HETEROGENEOUS...

Molded Laser Package with Electromagnetic Interference Shield and M...

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

RF COMPONENT WITH INTEGRATED EMI SHIELDING

ANTENNA DEVICE

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

CIRCUIT DEVICE AND DOHERTY AMPLIFIER

SLOT-CONFIGURATION DIE-TO-PACKAGE BALUN COUPLER