High-frequency adaptations

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/66High-frequency adaptations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including base member with protruding portion...
- Patent number 12,170,255
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Toshiaki Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designing method and semiconductor device
- Patent number 12,165,995
- Issue date Dec 10, 2024
- Renesas Electronics Corporation
- Ryuichi Oikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,165,951
- Issue date Dec 10, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with a power transistor and an electrostatic discha...
- Patent number 12,166,455
- Issue date Dec 10, 2024
- NXP USA, INC.
- David Cobb Burdeaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier, power amplifier circuit, and power amplifier device
- Patent number 12,160,207
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance semiconductor device
- Patent number 12,159,817
- Issue date Dec 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having elongated...
- Patent number 12,154,847
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Mizuho Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier
- Patent number 12,154,872
- Issue date Nov 26, 2024
- Sumitomo Electric Industries, Ltd.
- Koshi Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,154,873
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising antenna and communication m...
- Patent number 12,154,870
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated circuit
- Patent number 12,154,871
- Issue date Nov 26, 2024
- Sumitomo Electric Device Innovations, Inc.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method for manufacturing the same
- Patent number 12,154,863
- Issue date Nov 26, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide materials, structures, and devices
- Patent number 12,155,009
- Issue date Nov 26, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,148,980
- Issue date Nov 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Christophe Zinck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator with forward and return paths
- Patent number 12,149,389
- Issue date Nov 19, 2024
- RENESAS ELECTRONICS AMERICA INC.
- Tetsuo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for freeze-drying
- Patent number 12,146,709
- Issue date Nov 19, 2024
- OPTIMA pharma GmbH
- Stephan Reuter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and associated methods with antennas and EMI...
- Patent number 12,148,711
- Issue date Nov 19, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for enhancing insertion loss performance of an...
- Patent number 12,142,585
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire-based integrated via in anodic aluminum oxide layer for CM...
- Patent number 12,142,805
- Issue date Nov 12, 2024
- Regents of The University of Minnesota
- Rhonda Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier package
- Patent number 12,142,583
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Balun
- Patent number 12,143,088
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Yuri Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wilkinson divider
- Patent number 12,142,808
- Issue date Nov 12, 2024
- Teknologian tutkimuskeskus VTT Oy
- Mikko Varonen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING STRUCTURE
- Publication number 20240421107
- Publication date Dec 19, 2024
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND...
- Publication number 20240421108
- Publication date Dec 19, 2024
- Huawei Technologies Co., Ltd
- Shuiming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT
- Publication number 20240413799
- Publication date Dec 12, 2024
- Mitsubishi Electric Corporation
- Eigo Kuwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HA...
- Publication number 20240413103
- Publication date Dec 12, 2024
- PseudolithIC, Inc.
- James BUCKWALTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Interconnect Bridge wi...
- Publication number 20240404956
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- YongTaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral escape using triangular structure of transceivers
- Publication number 20240405795
- Publication date Dec 5, 2024
- Marvell Asia Pte Ltd.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METACONDUCTOR BASED COAXIAL TYPE RF DEVICES
- Publication number 20240404933
- Publication date Dec 5, 2024
- University of Florida Research Foundation, Inc.
- Yong Kyu Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240404967
- Publication date Dec 5, 2024
- ENKRIS SEMICONDUCTOR (WUXI), LTD.
- Guoqiao TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS
- Publication number 20240397610
- Publication date Nov 28, 2024
- Intel Corporation
- Aik Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiband QAM Interface for Slab Waveguide
- Publication number 20240395738
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMANCE OF AN...
- Publication number 20240395740
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240395737
- Publication date Nov 28, 2024
- NXP B.V.
- Ralph Matthijs van Schelven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER AMPLIFIER WITH GAN-ON-SI AND GAN-ON-SIC CIRCUITS
- Publication number 20240396500
- Publication date Nov 28, 2024
- MACOM Technology Solutions Holdings, Inc.
- Prity Kirit Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20240395739
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387416
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Koji TSUKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387979
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240387414
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Masakazu SHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
- Publication number 20240379592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-SIZE DIE, RELATED DEVICES AND METHODS
- Publication number 20240371807
- Publication date Nov 7, 2024
- Skyworks Solutions, Inc.
- Junhyung LEE
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including base member with protruding portion...

Designing method and semiconductor device

Component carrier with embedded interposer laterally between electr...

RF amplifier devices including top side contacts and methods of man...

RF devices with enhanced performance and methods of forming the same

Power amplifier with a power transistor and an electrostatic discha...

Radio frequency antennas and waveguides for communication between i...

Power amplifier, power amplifier circuit, and power amplifier device

High performance semiconductor device

Transistor with integrated passive components

Microelectronic devices designed with mold patterning to create pac...

Semiconductor device including semiconductor chip having elongated...

Semiconductor device and power amplifier

Semiconductor package including antenna

Semiconductor device package comprising antenna and communication m...

Microwave integrated circuit

Fan-out semiconductor package and method for manufacturing the same

Epitaxial oxide materials, structures, and devices

Semiconductor device package and method of manufacturing the same

Platforms including microelectronic packages therein coupled to a c...

Isolator with forward and return paths

Device and method for freeze-drying

Semiconductor package and antenna module comprising the same

Semiconductor packages and associated methods with antennas and EMI...

Devices and methods for enhancing insertion loss performance of an...

Nanowire-based integrated via in anodic aluminum oxide layer for CM...

Power amplifier modules including semiconductor resistor and tantal...

RF amplifier package

Balun

Wilkinson divider

Patents Applicationslast 30 patents

MOUNTING STRUCTURE

CHIP, CHIP PREPARATION METHOD, RADIO FREQUENCY POWER AMPLIFIER, AND...

HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT

HETEROGENEOUS INTEGRATION OF RADIO FREQUENCY TRANSISTOR CHIPLETS HA...

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

Semiconductor Device and Method of Making an Interconnect Bridge wi...

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

Lateral escape using triangular structure of transceivers

METACONDUCTOR BASED COAXIAL TYPE RF DEVICES

MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE

OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS

Multiband QAM Interface for Slab Waveguide

DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMANCE OF AN...

INTEGRATED CIRCUIT PACKAGE

HYBRID POWER AMPLIFIER WITH GAN-ON-SI AND GAN-ON-SIC CIRCUITS

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POWER MODULE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Transmission Line Structures for Three-Dimensional Integrated Circu...

PACKAGE STRUCTURE

REDUCED-SIZE DIE, RELATED DEVICES AND METHODS