High-frequency adaptations

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H01L23/66

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/66High-frequency adaptations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package and manufacturing method of the same
- Patent number 12,322,668
- Issue date Jun 3, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,322,702
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient stabilized SOI FETs
- Patent number 12,322,713
- Issue date Jun 3, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial oxide transistor
- Patent number 12,324,276
- Issue date Jun 3, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated with passive device and method for manufacturi...
- Patent number 12,324,169
- Issue date Jun 3, 2025
- BOE Technology Group Co., Ltd.
- Yingwei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor manufacturing pro...
- Patent number 12,322,672
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,322,691
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of radio frequency transistor chiplets ha...
- Patent number 12,322,714
- Issue date Jun 3, 2025
- PseudolithIC, Inc.
- James Buckwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,665
- Issue date Jun 3, 2025
- NXP B.V.
- Denizhan Karaca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a radar sensor
- Patent number 12,313,767
- Issue date May 27, 2025
- Robert Bosch GmbH
- Christian Hollaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching module
- Patent number 12,316,285
- Issue date May 27, 2025
- Kyosan Electric Mfg. Co., Ltd.
- Hiroshi Kunitama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based monolithic microwave integrated circuits in...
- Patent number 12,315,830
- Issue date May 27, 2025
- Wolfspeed, Inc.
- Jeremy Fisher
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaged transistor amplifiers that include integrated passive devi...
- Patent number 12,315,829
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- David Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,308,306
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Yuanhao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded radio-frequency devices configured to provide shielding fo...
- Patent number 12,308,325
- Issue date May 20, 2025
- Skyworks Solutions, Inc.
- Pietro Natale Alessandro Chyurlia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 12,308,326
- Issue date May 20, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,300,637
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Ko Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,682
- Issue date May 13, 2025
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and preparation method thereof
- Patent number 12,302,622
- Issue date May 13, 2025
- Dynax Semiconductor, Inc.
- Shufeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package with via structure and method of formation thereof
- Patent number 12,300,874
- Issue date May 13, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 12,301,179
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Yoshinobu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
High ruggedness heterojunction bipolar transistor (HBT)
- Patent number 12,295,152
- Issue date May 6, 2025
- Visual Photonics Epitaxy Co., Ltd.
- Chao-Hsing Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183517
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE
- Publication number 20250183240
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Mudit Sunilkumar Khasgiwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20250183848
- Publication date Jun 5, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takashi SUMIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Device Package Including Antenna Horn and Semicondu...
- Publication number 20250183516
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20250183849
- Publication date Jun 5, 2025
- SUMITOMO ELECTRONIC DEVICE INNOVATIONS, INC.
- Takashi SUMIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20250183515
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC INTEGRATION OF MINIATURIZED CAPACITOR BANK WITH CHALCOGE...
- Publication number 20250176448
- Publication date May 29, 2025
- Dell Products L.P.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250174508
- Publication date May 29, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20250176268
- Publication date May 29, 2025
- InnoLux Corporation
- Chu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174582
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250174583
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Kazuya OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...
- Publication number 20250174875
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
- Publication number 20250167142
- Publication date May 22, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL)
- Publication number 20250169085
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE
- Publication number 20250167096
- Publication date May 22, 2025
- Shinko Electric Industries Co., Ltd.
- Makoto Tsukahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DIE
- Publication number 20250167143
- Publication date May 22, 2025
- MACOM Technology Solutions Holdings, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...
- Publication number 20250159787
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...
- Publication number 20250159987
- Publication date May 15, 2025
- Hangzhou Geo-chip Technology Co., Ltd.
- Ruili WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...
- Publication number 20250155489
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Akio MATSUSHITA
- G01 - MEASURING TESTING
Information Patent Application
FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE
- Publication number 20250159788
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20250158269
- Publication date May 15, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...
- Publication number 20250157953
- Publication date May 15, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...
- Publication number 20250157954
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LIMITED
- Robert James MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT, CRYSTAL, AND SYS...
- Publication number 20250159786
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20250150113
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile Resonator Radiator for Phased Array Applications
- Publication number 20250149794
- Publication date May 8, 2025
- International Business Machines Corporation
- Duixian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS
- Publication number 20250151340
- Publication date May 8, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet DEDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20250151392
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Stabilized SOI FETs
- Publication number 20250149470
- Publication date May 8, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT COMPONENT
- Publication number 20250149472
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Hisatoshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS

High-frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package and manufacturing method of the same

Semiconductor package

Transient stabilized SOI FETs

Epitaxial oxide transistor

Antenna in package having antenna on package substrate

Dual-mode wireless charging device

Substrate integrated with passive device and method for manufacturi...

Semiconductor package structure and semiconductor manufacturing pro...

Package structure and method of manufacturing the same

Heterogeneous integration of radio frequency transistor chiplets ha...

Integrated circuit

Package structure and manufacturing method thereof

Antenna and device configurations

Method for manufacturing a radar sensor

Switching module

Group III nitride-based monolithic microwave integrated circuits in...

Packaged transistor amplifiers that include integrated passive devi...

Semiconductor device package and method of manufacturing the same

Shielded radio-frequency devices configured to provide shielding fo...

Electronic component with lid to manage radiation feedback

Semiconductor apparatus

Method of forming an electronic device structure having an electron...

Semiconductor package

Electronic component module

Semiconductor device and preparation method thereof

Antenna package with via structure and method of formation thereof

High frequency amplifier

Package comprising discrete antenna device

Electronic circuit comprising a RF switches having reduced parasiti...

High ruggedness heterojunction bipolar transistor (HBT)

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

NOVEL POWER ARCHITECTURE WITH DUAL CORE ADVANCE SUBSTRATE

DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE

Microelectronic Device Package Including Antenna Horn and Semicondu...

DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE

Antenna Effect Protection and Electrostatic Discharge Protection fo...

MONOLITHIC INTEGRATION OF MINIATURIZED CAPACITOR BANK WITH CHALCOGE...

SEMICONDUCTOR DEVICE PACKAGE

Electronic device

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...

PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS

SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL)

INTERCONNECT SUBSTRATE

POWER AMPLIFIER DIE

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...

RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...

METHOD FOR EVALUATING SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SE...

FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE

ANTENNA MODULES AND COMMUNICATION DEVICES

VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...

METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT, CRYSTAL, AND SYS...

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

Versatile Resonator Radiator for Phased Array Applications

POWER DEVICE PROGNOSTICS WITH QUANTUM SENSING THROUGH 2-D MATERIALS

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

Transient Stabilized SOI FETs

HIGH-FREQUENCY CIRCUIT COMPONENT