Semiconductor device and method for manufacturing the same

Abstract

A semiconductor device including a semiconductor substrate and a recessed transistor provided on the semiconductor substrate, wherein the recessed transistor includes a recess formed in a surface of the semiconductor substrate, an insulating film provided on a surface in the recess, a gate electrode at least partly buried in the recess, and a first diffusion layer and a second diffusion layer formed in a surface of the semiconductor substrate with the gate electrode located between the first diffusion layer and the second diffusion layer, and wherein the insulating film includes a thicker film portion between the first diffusion layer and the gate electrode, the thicker film portion being thicker than a portion of the insulating film located between the gate electrode and a channel region of the recessed transistor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing an example of a DRAM making up a semiconductor device in accordance with an embodiment of the present invention;

FIG. 2 is a plan view of the DRAM shown in FIG. 1;

FIG. 3A is a sectional view showing a step of a process of manufacturing the DRAM shown in FIG. 1;

FIG. 3B is a sectional view showing a step succeeding the step shown in FIG. 3A;

FIG. 3C is a sectional view showing a step succeeding the step shown in FIG. 3B;

FIG. 3D is a sectional view showing a step succeeding the step shown in FIG. 3C;

FIG. 3E is a sectional view showing a step succeeding the step shown in FIG. 3D;

FIG. 3F is a sectional view showing a step succeeding the step shown in FIG. 3E;

FIG. 4 is a sectional view of a semiconductor device related to the present invention;

FIG. 5A is a sectional view showing a step of a process of manufacturing the DRAM shown in FIG. 4;

FIG. 5B is a sectional view showing a step succeeding the step shown in FIG. 5A;

FIG. 5C is a sectional view showing a step succeeding the step shown in FIG. 5B;

FIG. 5D is a sectional view showing a step succeeding the step shown in FIG. 5C;

FIG. 5E is a sectional view showing a step succeeding the step shown in FIG. 5D; and

FIG. 5F is a sectional view showing a step succeeding the step shown in FIG. 5E.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a sectional view showing an example of a DRAM making up a semiconductor device in accordance with an exemplary embodiment of the present invention. FIG. 2 is a plan view of the DRAM shown in FIG. 1. FIG. 1 shows a cross section taken along line II-II in FIG. 2. In FIG. 1, an isolation region 12 partitioning an element formation region is formed on a major surface of a P-type silicon substrate 11. In the element formation region, an Si recess portion 13 is formed, and a gate insulating film having a thicker film portion 15 and a thinner film portion 14 is formed on a surface of an inner wall of the Si recess portion 13. A gate electrode 16 buried in the Si recess portion 13 is formed on the gate insulating film. Diffusion layers 18 and 19 making up a source region and a drain region of a transistor are located across the gate electrode 16. In the element formation region 30, a P-type punch through stopper layer 17 is formed on the side closer to a bit line making up a cell node. A shallow N-type diffusion layer 18 making up one of the source and drain regions is formed on the P-type punch through stopper layer 17. A deep N-type diffusion layer 19 making up the other of the source and drain regions is formed on the side closer to a storage node. The gate electrode is composed of a DOPOS film 23 and a WSi₂ film 24. An SiN film 25 is formed on the WSi₂ film 24.

The gate insulating film has the thicker film portion 15 adjacent to the deep N-type diffusion layer 19 and the thinner film portion 14 adjacent to the shallow N-type diffusion layer 18, the P-type punch through stopper layer 17 and a channel region 27. For the dimensions of the portions, for example, the depth of the recess is about 150 nm, and a gate length (word line width) is at most 100 nm. The thicker film portion 15 of the gate insulating film has a thickness of about 15 nm, and the thinner film portion 14 has a thickness of about 7 nm. The thicker film portion preferably has a thickness at least 1.5 times, more preferably at least twice, as large as that of the thinner film portion. Moreover, the thickness of the thicker film portion is preferably set to be at least 10 nm. The upper limit of the thickness of the thicker film portion is not particularly limited but may be appropriately set provided that the desired element properties are obtained and that a decrease in productivity resulting from the difficulty of film formation for manufacture can be avoided.

In FIG. 2, each gate electrode 16 is configured as a word line extending in the row direction of a memory cell array in a DRAM device. The shallow diffusion layer 18 and the deep diffusion layer 19 are formed in each element formation region 30. Each bit line forming a data line extends over the corresponding element formation region 30 so as to overlap the region. The bit line is connected to the shallow diffusion layer 18 in the corresponding column. A stacked capacitive element is formed over each element formation region 30. A lower electrode of the stack capacitive element is connected to the corresponding deep diffusion layer 19. Plugs connecting the above components form a storage node.

With reference to FIGS. 3A to 3F, description will be given of an example of a method for manufacturing the DRAM shown in FIGS. 1 and 2. The isolation region 12 of depth about 250 nm is formed on the P-type Si substrate using an STI (Shallow Trench Isolation) process. A pad oxide film 21 of thickness about 10 nm is formed by a thermal oxidation process (FIG. 3A). Then, a photolithography technique is used to pattern a photo resist film so that the photo resist film covers a portion of the element formation region connected to the bit line during the subsequent step. The photo resist film is then used as a mask to inject arsenic (As) of dose 1E13 cm⁻² to 1E15 cm⁻² with energy of 60 to 200 KeV. Phosphorous (P) of dose 1E13 cm⁻² to 1E15 cm⁻² is further injected with energy of 30 to 100 KeV. The deep N-type diffusion layer 19 is thus formed (FIG. 3B).

Then, the Si recess portion 13 is formed in the Si substrate 11 using the photolithography technique and a dry etching technique (FIG. 3C). At this time, the recess is formed in a portion including the boundary of the deep N-type diffusion layer 19 in the depth direction. This exposes the N-type diffusion layer 19 from a side wall of the Si recess portion 13 on the storage node side and exposes the substrate 11 from a side wall of the Si recess portion 13 on the bit line side.

The photo resist is removed, and a thermal oxide film is formed on a flat surface of the Si substrate to a film thickness of 7 nm by the thermal oxidation process (FIG. 3D). At this time, inside the recess the thickness of the oxide film contacting the diffusion layer on the bit line side is almost the same as that of the flat surface, 7 nm. The thinner film portion 14 is thus formed. The storage node-side oxide film contacting the diffusion layer with arsenic (As) and phosphorous (P) injected thereinto is subjected to faster oxidation under the effect t of impurities. The thickness of the oxide film thus becomes about 15 nm, forming the thicker film portion 15.

Then, a DOPOS film 23, a WSi₂ film 24, and an SiN film 25 are formed. A photo resist 22 is formed using the photolithography technique (FIG. 3E). The SiN film 25, the WSi₂ film 24, and the DOPOS film 23 are patterned with the photo resist 22 as a mask using the dry etching technique, to form a gate electrode. The photolithography technique is continuously used to form the photo resist 22 that opens only in a bit contact region. Boron (B) and phosphorous (P) are injected under conditions similar to those for the step described with reference to FIG. 5E to form the P-type punch through stopper layer 17 and the shallow N-type diffusion layer 18 (FIG. 3F). The photo resist 22 is removed to obtain the structure shown in FIG. 1.

Subsequently, an interlayer insulating film, a bit contact, and a capacitive contact are formed using the conventional method. Further, a capacitive element is formed on the capacitive contact and a bit line is formed on the capacitive element via the interlayer insulating film.

The above process uses the same number of photo masks as that used in the conventional process, preventing an increase in the number of masks used compared to that in the related art.

With the structure in accordance with the above embodiment, the increased thickness of a portion of the gate insulating film closer to the storage node enables a reduction in overlap capacity. Further, keeping the film thickness of the gate oxide film in the channel portion at the desired value enables a good balance to be achieved between the high speed performance of the device and the switching property of the transistor. Furthermore, forming the storage node-side diffusion layer deeper enables the refresh time to be extended.

Claims

1. A semiconductor device comprising a semiconductor substrate and a recessed transistor provided on the semiconductor substrate, wherein the recessed transistor comprises:a recess formed in a surface of the semiconductor substrate;an insulating film provided on a surface in the recess;a gate electrode at least partly buried in the recess; anda first diffusion layer and a second diffusion layer formed in a surface of the semiconductor substrate with the gate electrode located between the first diffusion layer and the second diffusion layer, andwherein the insulating film comprises a thicker film portion between the first diffusion layer and the gate electrode, the thicker film portion being thicker than a portion of the insulating film located between the gate electrode and a channel region of the recessed transistor.

2. The semiconductor device according to claim 1, wherein the semiconductor device comprises a memory cell comprising the recessed transistor as a cell transistor; a storage node to which the first diffusion layer is connected; and a data line to which the second diffusion layer is connected.

3. The semiconductor device according to claim 1, wherein the insulating film comprises a thinner film portion thinner than the thicker film portion, the thinner film portion being formed between the second diffusion layer and the gate electrode.

4. The semiconductor device according to claim 1, wherein the gate electrode comprises a polysilicon layer formed on the insulating film and at least partly buried in the recess and a metal containing film formed on the polysilicon layer.

5. The semiconductor device according to claim 1, wherein the first diffusion layer is formed deeper than the second diffusion layer.

6. The semiconductor device according to claim 1, further comprising a third diffusion layer formed under the second diffusion layer, wherein impurities of a conductivity type different from that of the second diffusion layer are diffused in the third diffusion layer.

7. A method for manufacturing a semiconductor device comprising the steps of: forming a first diffusion layer in a surface of a semiconductor substrate so as to form a first region in which the first diffusion layer is formed and a second region in which the first diffusion layer is not formed;forming a recess in a surface of the semiconductor substrate adjacent to the first diffusion layer to form an exposed surface of the first diffusion layer and an exposed surface of the second region in the recess;forming an oxide film on a surface in the recess using a thermal oxidation process so that the oxide film comprises a thicker film portion on the exposed surface of the first diffusion layer, the thicker film portion being thicker than a thinner film portion formed on the exposed surface of the second region;forming a gate electrode on the oxide film in the recess, the gate electrode being at least partly buried in the recess; andforming a second diffusion layer opposite to the first diffusion layer via the recess.

8. The method for manufacturing the semiconductor device according to claim 7, wherein the thicker film portion and the thinner film portion are formed during the same thermal oxidation process.

9. The method for manufacturing the semiconductor device according to claim 7, wherein the second diffusion layer is formed shallower than the first diffusion layer.

10. The method for manufacturing the semiconductor device according to claim 7, further comprising the step of introducing impurities of a conductivity type different from that of the second diffusion layer, under the second diffusion layer to form a third diffusion layer.