Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

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H01L27/14683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated sensor for lifetime characterization
- Patent number 12,300,711
- Issue date May 13, 2025
- Quantum-Si Incorporated
- Eric A. G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and method of fabricating the same
- Patent number 12,278,248
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Bongjin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods of forming the same
- Patent number 12,261,188
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
- Patent number 12,255,170
- Issue date Mar 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yasushi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbolometer systems and methods
- Patent number 12,255,221
- Issue date Mar 18, 2025
- Teledyne FLIR Commercial Systems, Inc.
- Eric A. Kurth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with overlap of backside trench isolation structure an...
- Patent number 12,255,219
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing radiographic imaging apparatus
- Patent number 12,248,109
- Issue date Mar 11, 2025
- FUJIFILM Corporation
- Haruyasu Nakatsugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,886
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Kyongsoon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,243,893
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbolometer systems and methods
- Patent number 12,243,904
- Issue date Mar 4, 2025
- Teledyne FLIR Commercial Systems, Inc.
- Eric A. Kurth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and related methods
- Patent number 12,237,351
- Issue date Feb 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a separation structure
- Patent number 12,230,658
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Min Ho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatuses, display panels and preparation methods of disp...
- Patent number 12,225,803
- Issue date Feb 11, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ke Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Intermediate connection member, method for manufacturing intermedia...
- Patent number 12,211,879
- Issue date Jan 28, 2025
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Avalanche photodiode array
- Patent number 12,205,967
- Issue date Jan 21, 2025
- Max-Planck-Gesellschaft zur Forderung der Wissenschaften E.V.
- Rainer Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a detecting device the getter of which is b...
- Patent number 12,199,211
- Issue date Jan 14, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Geoffroy Dumont
- G01 - MEASURING TESTING
Information Patent Grant
Back-side illuminated image sensor
- Patent number 12,199,131
- Issue date Jan 14, 2025
- STMicroelectronics (Crolles 2) SAS
- Laurent Gay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator structure for a front side type imager
- Patent number 12,198,975
- Issue date Jan 14, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods of forming the same
- Patent number 12,191,338
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Ying Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor substrate
- Patent number 12,183,641
- Issue date Dec 31, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel pattern design to improve carrier transfer efficiency
- Patent number 12,183,764
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for CMOS image sensors including through-substrat...
- Patent number 12,176,370
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with varying same-color color filter thickness
- Patent number 12,176,366
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Dong Min Keum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 12,169,142
- Issue date Dec 17, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with stress adjusting layers
- Patent number 12,154,933
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 12,152,936
- Issue date Nov 26, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 12,148,782
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20250072148
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE-TYPE IMAGE SENSOR
- Publication number 20250072111
- Publication date Feb 27, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250063839
- Publication date Feb 20, 2025
- Sony Semiconductor Solutions Corporation
- ISAYA KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epitaxial Structures in Image Sensors
- Publication number 20250063838
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yu LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHO...
- Publication number 20250048762
- Publication date Feb 6, 2025
- Sony Semiconductor Solutions Corporation
- Shingo HAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL PATTERN DESIGN TO IMPROVE CARRIER TRANSFER EFFICIENCY
- Publication number 20250048753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROADBAND SILICON SENSOR
- Publication number 20250040265
- Publication date Jan 30, 2025
- SRI International
- John McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, METHOD OF MANUFACTURING PHOTOELEC...
- Publication number 20250040273
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- Mahito Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS AND METHODS OF FABRICATING THE SAME
- Publication number 20250040282
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Jihun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250031476
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Minho JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE,...
- Publication number 20250031468
- Publication date Jan 23, 2025
- DEXERIALS CORPORATION
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
- Publication number 20250031472
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng Chieh CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250022902
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- KATSUNORI TOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250022900
- Publication date Jan 16, 2025
- Samsung Electronics Co.,Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION PANEL, PHOTOELECTR...
- Publication number 20250022907
- Publication date Jan 16, 2025
- Sharp Display Technology Corporation
- Rikiya TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250015115
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- KAZUYA FURUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LAMINATE, IMAGE SENSOR, AND METHOD FOR MANUFACTURING SUST...
- Publication number 20250015105
- Publication date Jan 9, 2025
- KANEKA CORPORATION
- Ayumu OGAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
STRUCTURE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20250015122
- Publication date Jan 9, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20250006763
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Kook Tae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250006764
- Publication date Jan 2, 2025
- Sony Semiconductor Solutions Corporation
- Kyohei MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING WITH DEEP TRENCH ISOLATION STRUCTURE
- Publication number 20240429258
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD
- Publication number 20240421173
- Publication date Dec 19, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiyue SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE CAPTURING APPARATUS
- Publication number 20240413180
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- IPPEI YOSHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240413178
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Rita KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD
- Publication number 20240405042
- Publication date Dec 5, 2024
- PixArt Imaging Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURIN...
- Publication number 20240405050
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Katsunori HIRAMATSU
- H01 - BASIC ELECTRIC ELEMENTS

Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated sensor for lifetime characterization

Image sensor package and method of fabricating the same

Image sensor device and methods of forming the same

Semiconductor package, electronic apparatus, and method for manufac...

Microbolometer systems and methods

Image sensor with overlap of backside trench isolation structure an...

Method of manufacturing radiographic imaging apparatus

Semiconductor package

Image sensor device

Microbolometer systems and methods

Semiconductor package structure and related methods

Image sensor including a separation structure

Semiconductor device and method of forming micro interconnect struc...

Display apparatuses, display panels and preparation methods of disp...

Intermediate connection member, method for manufacturing intermedia...

Camera module, and photosensitive assembly and manufacturing method...

Reliable semiconductor packages

Avalanche photodiode array

Process for fabricating a detecting device the getter of which is b...

Back-side illuminated image sensor

Semiconductor on insulator structure for a front side type imager

Image sensor device and methods of forming the same

Method for evaluating semiconductor substrate

Channel pattern design to improve carrier transfer efficiency

Stacked structure for CMOS image sensors including through-substrat...

Image sensor with varying same-color color filter thickness

Integrated circuit with sequentially-coupled charge storage and ass...

Image sensors with stress adjusting layers

Integrated circuit with sequentially-coupled charge storage and ass...

Composite BSI structure and method of manufacturing the same

Patents Applicationslast 30 patents

DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

FRONT-SIDE-TYPE IMAGE SENSOR

IMAGING DEVICE AND ELECTRONIC DEVICE

Epitaxial Structures in Image Sensors

SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND MANUFACTURING METHO...

CHANNEL PATTERN DESIGN TO IMPROVE CARRIER TRANSFER EFFICIENCY

BROADBAND SILICON SENSOR

PHOTOELECTRIC CONVERSION ELEMENT, METHOD OF MANUFACTURING PHOTOELEC...

IMAGE SENSORS AND METHODS OF FABRICATING THE SAME

IMAGE SENSOR

METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE,...

DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION PANEL, PHOTOELECTR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SUBSTRATE LAMINATE, IMAGE SENSOR, AND METHOD FOR MANUFACTURING SUST...

STRUCTURE FOR A FRONT-FACING IMAGE SENSOR

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

LIGHT DETECTING DEVICE AND ELECTRONIC DEVICE

GUARD RING WITH DEEP TRENCH ISOLATION STRUCTURE

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

RELIABLE SEMICONDUCTOR PACKAGES

DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

SOLID-STATE IMAGE CAPTURING APPARATUS

SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING

OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURIN...