Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

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H01L27/14683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 12,169,142
- Issue date Dec 17, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with stress adjusting layers
- Patent number 12,154,933
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 12,152,936
- Issue date Nov 26, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 12,148,782
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side-type image sensor
- Patent number 12,148,755
- Issue date Nov 19, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing module and manufacturing method thereof
- Patent number 12,143,701
- Issue date Nov 12, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Shih-Chieh Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure, connection structure,...
- Patent number 12,142,621
- Issue date Nov 12, 2024
- Dexerials Corporation
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element and electronic equipment
- Patent number 12,136,639
- Issue date Nov 5, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masashi Ohura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging device, and method of manufacturing s...
- Patent number 12,132,061
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tsuyoshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping structure along image sensor element to mitigate damage to...
- Patent number 12,132,066
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, method of manufacturing the same, and electronic appa...
- Patent number 12,125,860
- Issue date Oct 22, 2024
- Sony Corporation
- Hiroshi Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with dummy pixel structures
- Patent number 12,125,868
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making isolation region of CIS device
- Patent number 12,125,866
- Issue date Oct 22, 2024
- Hua Hong Semiconductor (Wuxi) Limited
- Yuanyuan Qui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,119,359
- Issue date Oct 15, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with photosensitive element mounted to back...
- Patent number 12,119,361
- Issue date Oct 15, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device, solid state imaging device manufacturin...
- Patent number 12,119,366
- Issue date Oct 15, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Komai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device, method for producing the same, and...
- Patent number 12,107,110
- Issue date Oct 1, 2024
- Canon Kabushiki Kaisha
- Toshiyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate for a front-facing image sensor
- Patent number 12,100,727
- Issue date Sep 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,100,719
- Issue date Sep 24, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI chip with backside alignment mark
- Patent number 12,094,997
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection element, manufacturing method thereof, flat panel detector
- Patent number 12,087,784
- Issue date Sep 10, 2024
- Xuecheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, solid-state imaging device manufacturin...
- Patent number 12,087,794
- Issue date Sep 10, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Katsunori Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging in curved arrays: methods to produce free-formed curved det...
- Patent number 12,087,803
- Issue date Sep 10, 2024
- California Institute of Technology
- Todd J. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with sequentially-coupled charge storage and ass...
- Patent number 12,085,442
- Issue date Sep 10, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device, electronic apparatus, and method for manufact...
- Patent number 12,074,182
- Issue date Aug 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, with transfer transistor gate electrode...
- Patent number 12,068,352
- Issue date Aug 20, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takahiro Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package having a light blocking member
- Patent number 12,068,345
- Issue date Aug 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for curved-surface image sensor
- Patent number 12,062,673
- Issue date Aug 13, 2024
- OmniVision Technologies, Inc.
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation structure for scaled pixel region
- Patent number 12,062,678
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD
- Publication number 20240421173
- Publication date Dec 19, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiyue SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...
- Publication number 20240421177
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuang-Ji Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE CAPTURING APPARATUS
- Publication number 20240413180
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- IPPEI YOSHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240413178
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Rita KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD
- Publication number 20240405042
- Publication date Dec 5, 2024
- PixArt Imaging Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURIN...
- Publication number 20240405050
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- Katsunori HIRAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, METHOD FOR PRODUCING THE SAME, AND...
- Publication number 20240395844
- Publication date Nov 28, 2024
- Canon Kabushiki Kaisha
- Toshiyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395842
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaesang YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ETCH STOP LAYER FOR A PIXEL SENSOR
- Publication number 20240387586
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Stress Adjusting Layers
- Publication number 20240387595
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SHIELDING USING AIR GAPS
- Publication number 20240387584
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-WIDE FIELD-OF-VIEW PINHOLE COMPOUND EYE USING HEMISPHERICAL N...
- Publication number 20240387582
- Publication date Nov 21, 2024
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Zhiyong FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND METHOD THEREOF
- Publication number 20240387588
- Publication date Nov 21, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS
- Publication number 20240379726
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DESIGN
- Publication number 20240379694
- Publication date Nov 14, 2024
- Obsidian Sensors, Inc.
- Heesun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION FOR CROSS-TALK REDUCTION
- Publication number 20240379714
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20240379701
- Publication date Nov 14, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jeonghan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION SUBSTRATE, MANUFACTURING METHOD THEREFOR AND FLAT PANEL D...
- Publication number 20240369722
- Publication date Nov 7, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Jianxing SHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...
- Publication number 20240371907
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Dummy Pixel Structures
- Publication number 20240371910
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371904
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STABLIZING LINE-OF-SIGHT FALLING POINT
- Publication number 20240363670
- Publication date Oct 31, 2024
- Reco BioTek Co., Ltd
- Chang Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION
- Publication number 20240363653
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI CHIP WITH BACKSIDE ALIGNMENT MARK
- Publication number 20240363791
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Wei Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240363663
- Publication date Oct 31, 2024
- Sony Semiconductor Solutions Corporation
- SHINGO TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CURVED-SURFACE IMAGE SENSOR
- Publication number 20240355846
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBLE TO LONGWAVE INFRARED PHOTODETECTOR ON SILICON
- Publication number 20240347561
- Publication date Oct 17, 2024
- The Board of Trustees of the University of Arkansas
- Shui-Qing Fisher Yu
- H01 - BASIC ELECTRIC ELEMENTS

Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit with sequentially-coupled charge storage and ass...

Image sensors with stress adjusting layers

Integrated circuit with sequentially-coupled charge storage and ass...

Composite BSI structure and method of manufacturing the same

Front-side-type image sensor

Image capturing module and manufacturing method thereof

Method of manufacturing connection structure, connection structure,...

Imaging element and electronic equipment

Semiconductor device, imaging device, and method of manufacturing s...

Capping structure along image sensor element to mitigate damage to...

Image sensor, method of manufacturing the same, and electronic appa...

Image sensors with dummy pixel structures

Method for making isolation region of CIS device

Through-substrate via structure and method of manufacture

Imaging device

Circuit board assembly with photosensitive element mounted to back...

Solid state imaging device, solid state imaging device manufacturin...

Photoelectric conversion device, method for producing the same, and...

Method for manufacturing a substrate for a front-facing image sensor

Reliable semiconductor packages

BSI chip with backside alignment mark

Detection element, manufacturing method thereof, flat panel detector

Solid-state imaging device, solid-state imaging device manufacturin...

Imaging in curved arrays: methods to produce free-formed curved det...

Integrated circuit with sequentially-coupled charge storage and ass...

Semiconductor device, electronic apparatus, and method for manufact...

Solid-state imaging device, with transfer transistor gate electrode...

Image sensor package having a light blocking member

Apparatus and method for curved-surface image sensor

Trench isolation structure for scaled pixel region

Patents Applicationslast 30 patents

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

RELIABLE SEMICONDUCTOR PACKAGES

DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD

BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LE...

SOLID-STATE IMAGE CAPTURING APPARATUS

SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING

OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURIN...

PHOTOELECTRIC CONVERSION DEVICE, METHOD FOR PRODUCING THE SAME, AND...

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

CONTACT ETCH STOP LAYER FOR A PIXEL SENSOR

Image Sensors With Stress Adjusting Layers

PIXEL SHIELDING USING AIR GAPS

ULTRA-WIDE FIELD-OF-VIEW PINHOLE COMPOUND EYE USING HEMISPHERICAL N...

IMAGE SENSOR PACKAGES AND METHOD THEREOF

DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS

SENSOR DESIGN

DEEP TRENCH ISOLATION FOR CROSS-TALK REDUCTION

SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD

DETECTION SUBSTRATE, MANUFACTURING METHOD THEREFOR AND FLAT PANEL D...

CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...

Image Sensors With Dummy Pixel Structures

COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR STABLIZING LINE-OF-SIGHT FALLING POINT

IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION

BSI CHIP WITH BACKSIDE ALIGNMENT MARK

SENSOR DEVICE AND MANUFACTURING METHOD

APPARATUS AND METHOD FOR CURVED-SURFACE IMAGE SENSOR

VISIBLE TO LONGWAVE INFRARED PHOTODETECTOR ON SILICON