Number | Date | Country | Kind |
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92201178.8 | Apr 1992 | EPX |
Number | Name | Date | Kind |
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4491860 | Lim | Jan 1985 | |
5019234 | Harper | May 1991 | |
5028531 | Dohjo et al. | Jul 1991 |
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R. S. Nowicki et al. "Studies of the Ti-W/AU Metallization on Aluminum" Apr. 7, 1978 Thin Solid Films 53 pages, 195-205. |
P. B. Ghate et al. "Application of Ti:W Barrier Metallization for Integrated Circuits" Thin Solid Films, 53 Apr. 28, 1978 pp. 117-128. |