formed in openings in a dielectric

Industry

CPC
H01L21/76843

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76843formed in openings in a dielectric

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate oxide formation for fin field-effect transistor
- Patent number 12,363,934
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Bingwu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Semiconductor device having a uniform and thin silicide layer on an...
- Patent number 12,362,187
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor deposition of films comprising molybdenum
- Patent number 12,354,877
- Issue date Jul 8, 2025
- ASM IP Holding B.V.
- Bhushan Zope
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gates of transistors having reduced resistivity
- Patent number 12,347,729
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,334,435
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,327,787
- Issue date Jun 10, 2025
- Kioxia Corporation
- Takashi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with adjustment layers and method for fabricat...
- Patent number 12,327,793
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polish slurry and method of manufacture
- Patent number 12,327,734
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate to source drain interconnects
- Patent number 12,327,788
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,327,758
- Issue date Jun 10, 2025
- SK Hynix Inc.
- Nam Yeal Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free contact trench fill in gate-all-around FET architecture
- Patent number 12,327,761
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device
- Patent number 12,322,649
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier for interconnects
- Patent number 12,322,650
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods
- Patent number 12,322,647
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having graphene-containing-structures
- Patent number 12,315,810
- Issue date May 27, 2025
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 12,315,763
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Younghoon Goo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lines and methods for fabricating the same
- Patent number 12,315,762
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239525
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Se Ra HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVI...
- Publication number 20250236793
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Min Hyung CHO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE-TREATMENT METHOD AND SUBSTRATE-TREATMENT SYSTEM
- Publication number 20250239446
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Isao GUNJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Different Via Configurations for Different Via Interface Requirements
- Publication number 20250239527
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...
- Publication number 20250226307
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...
- Publication number 20250218949
- Publication date Jul 3, 2025
- Intel Corporation
- Sriharsha Karumuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250218950
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT SPACER STRUCTURE
- Publication number 20250210510
- Publication date Jun 26, 2025
- Intel Corporation
- Rohan BAMBERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201709
- Publication date Jun 19, 2025
- Fujian Jinhua Integrated Circuit Co, Ltd.
- Xiaoqin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192038
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE INTERCONNECT STRUCTURE
- Publication number 20250192028
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20250192026
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY
- Publication number 20250183177
- Publication date Jun 5, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167105
- Publication date May 22, 2025
- Chun-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contact Metal
- Publication number 20250167047
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250169090
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157963
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...
- Publication number 20250157916
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS

formed in openings in a dielectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Methods of forming semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device structures

MIM structure

Gate oxide formation for fin field-effect transistor

Self-forming embedded diffusion barriers

Semiconductor device having a uniform and thin silicide layer on an...

Methods of performing chemical-mechanical polishing process in semi...

Cobalt based interconnects and methods of fabrication thereof

Vapor deposition of films comprising molybdenum

Treatment of spin on organic material to improve wet resistance

Metal gates of transistors having reduced resistivity

Method for forming a semiconductor structure by diffusing manganese...

Middle-of-line interconnect structure and manufacturing method

Semiconductor memory device

Semiconductor device with adjustment layers and method for fabricat...

Chemical mechanical polish slurry and method of manufacture

Contact with a silicide region

Gate to source drain interconnects

Method for fabricating semiconductor device

Void-free contact trench fill in gate-all-around FET architecture

Interconnect structure of semiconductor device

Diffusion barrier for interconnects

Semiconductor devices and methods

Passivation layers with rounded corners

Integrated assemblies having graphene-containing-structures

Three-dimensional memory device and method of making thereof using...

Self-aligned lines and methods for fabricating the same

Interconnection structure and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ETCHING COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVI...

SUBSTRATE-TREATMENT METHOD AND SUBSTRATE-TREATMENT SYSTEM

Different Via Configurations for Different Via Interface Requirements

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...

INTERCONNECT LINES WITH LINE WIDTH PROFILE

TECHNIQUES TO FORM INTEGRATED CIRCUIT STRUCTURES WITH CONDUCTIVE IN...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT SPACER STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

BACK END OF LINE INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

Metal-Insulator-Metal Structure

CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of Forming Contact Metal

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...