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6-026672 | Feb 1994 | JPX |
Number | Name | Date | Kind |
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4866008 | Brighton et al. | Sep 1989 | |
4985750 | Hoshino | Jan 1991 |
Number | Date | Country |
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49-3237 | Jan 1974 | JPX |
0605560 | Jan 1985 | JPX |
63-156341 | Jun 1988 | JPX |
Entry |
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J. S. H. Cho et al., "Copper Interconnection with Tungsten Cladding for ULSI", pp. 39 and 40. |
Kazuhide Ohno et al., "Fine Copper Pattern Formation Using RIE with a SICI.sub.4, N.sub.2, Cl.sub.2 and NH.sub.3 Mixture, and Its Electromigration Characteristics", Abstract No. 318, pp. 486 and 487. |
Y. Nakasaki et al., "Orientation Control of Cu Interconnects . . . Interfacial energy of Cu/Barrier Metal Structures", Abstract No. 30p-ZH-7, p. 707. |