Claims
- 1. A semiconductor processing method comprising the steps of:
- transporting an incoming case containing semiconductor wafers to be processed to a first side of a semiconductor processing device;
- removing an ID card identifying the semiconductor wafers from the incoming case at the first side of the processing device and storing the ID card;
- moving the incoming case from the first side to a second side of the processing devise spaced from the first side;
- loading the semiconductor wafers from the incoming case into the processing device at the second side;
- processing the semiconductor wafers in the processing device;
- disposing an outgoing case for processed wafers at the first side of the processing device;
- attaching the ID card to the outgoing case;
- unloading the processed semiconductor wafers from the processing device into the outgoing case at the first side of the processing device; and
- transporting the outgoing case away from the first side of the processing device.
- 2. The method according to claim 1 wherein the first and second sides are on opposite sides of the processing device.
- 3. The method according to claim 1 wherein attaching the ID card comprises disposing the ID card in an external pocket of the outgoing case.
- 4. The method according to claim 1 wherein removing the ID card comprises removing the ID card from an external pocket of the incoming case.
- 5. The method according to claim 1 including returning the incoming case to the first side of the processing device after removing the semiconductor wafers from the incoming case.
- 6. The method according to claim 5 wherein returning the incoming case to the first side of the processing device comprises disposing the incoming case in a storage area.
- 7. The method according to claim 6 wherein disposing the outgoing case at the first side comprises removing the outgoing case from the storage area.
- 8. The method according to claim 5 including transporting the incoming case from the first side after returning the incoming case to the first side.
- 9. The method according to claim 1 including reusing the incoming case as an outgoing case.
- 10. The method according to claim 1 comprising removing and attaching the ID card with a robot.
Priority Claims (1)
Number |
Date |
Country |
Kind |
4-204068 |
Jul 1992 |
JPX |
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Parent Case Info
This disclosure is a division of application Ser. No. 07/970,471, filed Nov. 2, 1992, now U.S. Pat. No. 5,383,482.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
970471 |
Nov 1992 |
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