A semiconductor process chamber commonly comprises a container, a lid, and a seal that seals the interface therebetween. The lid is usually convertible between a condition whereat it seals the access opening into the processing space, and a condition whereat the access opening is uncovered for loading/unloading of the processing space. The container's interface surface and/or the lid's interface surface can include a circumferential groove in which the seal is situated.
Many semiconductor manufacturing methods now require processing chambers to create ultra-high-vacuum (UHV—pressures lower than about 10−7 pascal and/or 10−9 torr) and/or ultra-high-purity (UHP—total maximum contaminant level of 10 ppm) environments. And these manufacturing methods can involve repeated opening and sealing process chambers so that substrates (e.g., wafers) can be continuously loaded, processed, and then unloaded therefrom. Slow production rates (e.g., caused by long pump-down times), significant equipment downtime (e.g., for seal replacement or interface cleaning) and/or substandard yields (e.g., due to particle generation) are generally used as undesirable by semiconductor manufacturers.
A seal comprises an elastomeric element and a metallic element that can seal the container-lid interface of a process chamber. The seal can be constructed to achieve ultra high vacuum levels without compromising on cleanliness, and still allow a clamped (rather than bolted) container-lid interface. Thus, the seal can efficiently be used in UHV and/or UHP processing chambers with unbolted and/or dynamic interfaces.
The elastomeric element and the metallic element can be arranged and adapted to seal the chamber's interface sequentially during its conversion to a sealed condition. The elastomeric element creates a seal during early evacuation stages, with the help of a clamping device. This maintains the chamber's vacuum, so that pressure differential can continue to rise, and provide the sealing load necessary for the metallic element to create a seal. In this manner, the composite seal capitalizes on the low-sealing-load ability of elastomeric element, while still providing a metallic seal during high pressure differential periods.
The elastomeric element and the metallic element can be arranged and adapted to seal the chamber's interface in series when processing chamber is in its sealed condition. The metallic element can be positioned upstream of the elastomeric element relative to the processing chamber. (In cylindrical processing chambers, for example, the metallic element can be positioned radially inward of the elastomeric element.) In this manner, the metallic element shields the elastomeric element from gas permeation, thermal exposure, and reactive plasmas, and/or ion-impingement. The metallic element can also shield the processing chamber from particles generated by the elastomeric element. In this manner, the disadvantages often associated with elastomeric seals (e.g., gas-permeation bulk, reactive degrade, thermal-exposure deterioration, shortened life span, impure-particle generation, electrical-discontinuity causation, etc.) are eliminated or at least minimized.
Referring now to the drawings, and initially to
The process chamber 10 can be an ultra-high-vacuum (UHV) and/or ultra-high-purity (UHP) chamber which is part of a semiconductor manufacturing process. When the lid 14 is in its load-unload condition, the substrate 24 (e.g., a wafer) can be inserted through the access opening 22 into the processing space 20 and staged on the pedestal 26. Once the lid 14 is converted to its sealed condition, the interface 16 is sealed, the substrate 24 can be processed within the container 12. The processing can comprise photo-masking, deposition, oxidation, nitridation, ion implantation, diffusion, and/or etching. After the wafer-processing step, the vacuum can be released within the processing space 20, and the lid can be converted from its sealed condition to its load-unload condition. The substrate 24 can be withdrawn from the processing space 20 (through the access opening 22) and the steps repeated for the next substrate (e.g., the next wafer in the processing line).
The container 12 includes an interface surface 30 surrounding the access opening 22 and the lid 14 includes an interface surface 32 seated against the container's interface surface 30 when in its sealed condition. These surfaces 30/32 together define the interface 16 between the container 12 and the lid 14. A clamp 34 (or other suitable means) can be provided to brace, lock, or otherwise hold the lid 14 against the container 12.
The container's interface surface 30 and/or the lid's interface surface 32 includes at least one groove 36. In many of the illustrated embodiments, the grooves 36 have a rectangular cross-sectional shapes. But, the groove 36 can have such a rectangular cross-section shape (
As is best seen by referring additionally to the 2nd-7th drawing sets, a seal 40 is situated in the groove 36. The seal 40 has a generally ring-like shape, so as to be seated in the continuous groove 36.
The seal 40 can generally comprises an elastomeric element 40 and a metallic element 50. The elastomeric element 40 can be made from polymeric materials including nylon, polytetrafluoroethylene, fluorinated ethylene-propylene, chlorotrifluoroethylene, perfluoroalkoxy polymer, polyvinyls, polyethylene, polypropylene, polystyrene, polysulfone and the like. The metallic element can be made from aluminum, steel, stainless steel, copper, brass, titanium, nickel, and alloys thereof.
The elastomeric element 50 and the metallic element 60 can be arranged and adapted to seal the chamber's interface 16 sequentially during conversion to the sealed condition. Specifically, for example, the seal 40 can be designed so that the uncompressed height h1 of the elastomeric element 40 is greater than the uncompressed height h2 of the metallic element 50. (See A figures in 2nd-7th drawing sets.) This height difference can result in the elastomeric element 50 being contacted and compressed prior to contact-compression of the metallic element 60.
When converting the lid 14 to the sealed condition, the elastomeric element is first contacted by the lid 14 (See B figures in 2nd-7th drawing sets). Thereafter, possibly with the help of the clamp 34, the elastomeric element 50 is compressed. (See C figures in 2nd-7th drawing sets.) The clamp 34 need only be sufficient to compress the elastomeric element 50 (not the metallic element 60), whereby an easily removable, and/or manually operable, clamping arrangement can be used. The elastomeric element 50 creates a seal during early evacuation stages, thereby allowing the vacuum to continue to build in the processing chamber 20. As the pressure differential rises, it creates a sealing load sufficient to compress the metallic element 60. (See D figures in 2nd-7th drawing sets.)
The elastomeric element 60 and the metallic element 60 can be arranged and adapted to seal the chamber's interface 16 in series when processing chamber 20 is in a sealed condition. And the metallic element 50 can be situated to encounter processing activity upstream of the elastomeric element 40. In the illustrated embodiment, this upstream-orientation results in the metallic element 50 being positioned radially inward from the elastomeric element 40. In any event, the metallic element 50 (which can be made of a material impervious to gas within the processing space 20) functions as a shield to protect the elastomeric element 40 from gas permeation. The metallic element 50 also shields the elastomeric element 40 from direct impingement of high energy or ions. In some cases, the metallic element 50 can also function to energize the elastomeric element 40.
Referring particularly to
When the lid 14 is in its loading/unloading condition, the seal's elastomeric member 50 and its metallic element 60 can each be in an uncompressed condition. The height he of the elastomeric member will 50 will represent its uncompressed height h1 and the height hm of the metallic member 60 will represent its uncompressed height h2. If h1 and h2 are greater than the groove's height hg, they will project beyond the groove's ceiling plane. (See
The lid's interfacing surface 32 will first contact the elastomeric member 50. (See
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In the 2ndthrough 7th drawing sets, the elastomeric element 50 and the metallic element 60 were shown positioned within the same groove 36. As shown in
In the two-groove design shown in the 8th drawing set, the container 12 can further comprise an evacuation conduit 37 between the two grooves 36 and 38, which is sealed upon
As was indicated above, the metallic element 60 can function as a shield to protect the elastomeric element 50 from gas permeation, ion impingement, chemically corrosive vapors, and other life-shortening enemies. That being said, the elastomeric member 50 may need replacement before, and/or more often, than the metallic element 60. In many designs (see e.g., the seal 40 in the 2nd-5th and 8th drawing sets) the elastomeric element 50 can be replaced, with or without replacement of the metallic member 60.
The seal 40 can be designed by optimizing parameters including the stiffness value of the elastomeric element, the stiffness value of the metallic element, the uncompressed height h1 of the elastomeric element, the uncompressed height h2 of the metallic element, and the initial gap distance g between the interfacing surfaces. The optimizing step can comprise, for example, finite element analysis (FEA).
Although the processing chamber 20, the seal 10, the elastomeric element 40, the metallic element 50, and/or associated methods have been shown and described with respect to certain embodiments, it is obvious that equivalent alterations and modifications will occur to others skilled in the art. In regard to the various functions performed by the above described elements (e.g., components, assemblies, systems, devices, compositions, etc.), the terms (including a reference to a “means”) used to describe such elements are intended to correspond, unless otherwise indicated, to any element which performs the specified function of the described element (i.e., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function. In addition, while a particular feature of the invention may have been described above with respect to only one or more of several illustrated embodiments, such feature may be combined with one or more other features of the other embodiments, as may be desired and advantageous for any given or particular application.
This application is related to U.S. Provisional Patent Application No. 60/887,630 filed on Feb. 1, 2007, U.S. Provisional Patent Application No. 60/908,217 filed on Mar. 27, 2007, and U.S. Provisional Patent Application No. 60/949,657 filed on Jul. 13, 2007. The entire disclosures of these earlier provisional applications are hereby incorporated by reference.
Number | Date | Country | |
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60887630 | Feb 2007 | US | |
60908217 | Mar 2007 | US | |
60949657 | Jul 2007 | US |