Patent Application
20240274710
This application relates to the field of semiconductor technologies, and in particular, to a SiC MOSFET, a SiC MOSFET preparation method, and an integrated circuit.
As a next-generation wide bandgap semiconductor material, silicon carbide (SiC) has excellent performance in the field of power semiconductors, and is the cutting edge and future direction of development of power semiconductor devices. Compared with gallium arsenide and silicon, silicon carbide has overwhelming properties in the case of high pressure and high temperature. SiC is a chemical compound semiconductor material that includes silicon (Si) and carbon (C), and has many excellent characteristics, such as a large band gap, a high breakdown electric field, a high thermal conductivity, a high saturation velocity, and a high maximum operating temperature. These characteristics enable a silicon carbide electronic device to work in an environment with a high voltage, high calorific value, and high frequency. Compared with an insulated gate bipolar transistor (IGBT) made of Si, a metal-oxide-semiconductor field-effect transistor (MOSFET) made of SiC is characterized by a smaller size, lower power consumption, and an excellent thermal conductivity property while providing the same power.
Preparation of a gate oxide layer is a key step in production of a SiC MOSFET. At present, a commonly used method is to directly perform high-temperature thermal oxidation on a SiC epitaxial wafer, to form a silicon dioxide gate oxide layer on a surface of the SiC epitaxial wafer. However, numerous interface states exist at a SiC/SiO2 interface (for example, Si- and C-dangling bonds at the interface, a C-related defect, and an oxide defect near the interface). An interface trap traps carriers in an inversion layer, causing a current density of the device to decrease. Moreover, the trapped carriers generate Coulomb scattering on free carriers in a channel, resulting in low channel mobility and compromising a conduction characteristic of the device. Although nitridation processing may be performed on the interface through subsequent nitrogen and oxygen annealing after the oxidation to improve the channel mobility, the channel mobility is still far lower than that of a silicon carbide body material.
This application provides a SiC MOSFET, a SiC MOSFET preparation method, and an integrated circuit, to improve channel mobility of the SiC MOSFET.
According to a first aspect, this application provides a SiC MOSFET. The SiC MOSFET may include a SiC semiconductor substrate, a drift layer, a fin-shaped channel layer (namely a well region), a source region, a gate electrode, a gate oxide layer, a first insulated isolating layer, a second insulated isolating layer, a source electrode, and a drain electrode. The drift layer is located on the SiC semiconductor substrate, the fin-shaped channel layer is located on the drift layer, the source region is located on the fin-shaped channel layer, and the first insulated isolating layer is located on a portion that is of the drift layer and that is not covered by the fin-shaped channel layer. As the fin-shaped channel layer and the source region are of a stacking structure, the gate electrode is located on the first insulated isolating layer and is located on two sides of the stacking structure, and the gate oxide layer is located between the gate electrode and the stacking structure. The second insulated isolating layer covers an external side wall and an upper surface of the gate electrode. The source electrode covers the first insulated isolating layer, the second insulated isolating layer, and the source region. The drain electrode is located on a side that is of the SiC semiconductor substrate and that is away from the drift layer. The first insulated isolating layer is configured to isolate the gate electrode and the drift layer. The gate oxide layer is configured to isolate the gate electrode and the fin-shaped channel layer, and is configured to isolate the gate electrode and the source region. The second insulated isolating layer is configured to isolate the gate electrode and the source electrode.
In this application, the fin-shaped channel layer means that the channel layer is of a strip shape, and the gate electrode is located on two sides of the fin-shaped channel layer. Therefore, the SiC MOSFET is a fin field-effect transistor (Fin FET). Disposing the gate electrode on the two sides of the fin-shaped channel layer is conducive to reducing a width of the fin-shaped channel layer (namely a distance between the gate oxide layer on the two sides of the fin-shaped channel layer). This is favorable for global inversion of the fin-shaped channel layer, thereby forming a large carrier path in the fin-shaped channel layer. In this way, most carriers in the SiC MOSFET flow through an electron path formed in the fin-shaped channel layer, so that a quantity of carriers that flow on an edge of the gate oxide layer is reduced, thereby greatly improving channel mobility and also improving reliability of the gate oxide layer.
The SiC MOSFET provided in this embodiment of this application may be an NMOS transistor, or may be a PMOS transistor. This is not limited herein. When the SiC MOSFET is an NMOS transistor, the SiC semiconductor substrate may be an N++ region and serves as a drain region, the drift layer may be an N+ region and mainly serves to bear high voltage, the source region may be an N++ region, and the fin-shaped channel layer may be a P region, namely a P-well. A P-well is a region that is on an N-type semiconductor layer and that is doped with a P-type impurity of a density high enough to neutralize the N-type semiconductor layer and make the N-type semiconductor layer have a P-type characteristic. When the SiC MOSFET is a PMOS transistor, the SiC semiconductor substrate may be a P++ region and serves as a drain region, the drift layer may be a P+ region and mainly serves to bear high voltage, the source region may be a P++ region, and the fin-shaped channel layer may be an N region, namely an N-well. An N-well is a region that is on a P-type semiconductor layer and that is doped with an N-type impurity of a density high enough to neutralize the P-type semiconductor layer and make the P-type semiconductor layer have an N-type characteristic. During specific implementation, the SiC MOSFET is generally an NMOS transistor because hole mobility is lower than electron mobility. This is not limited herein.
During specific implementation, two types of carriers exist in a semiconductor, namely holes in a valence band and electrons in a conduction band. A semiconductor that mainly uses electrons for conduction is referred to as an N-type semiconductor, and a semiconductor that mainly uses holes for conduction is referred to as a P-type semiconductor. It should be noted that in this application, in a layer and region prefixed with N or P, a majority of carriers are electrons or holes, respectively. In addition, a plus sign “+” following N or P indicates that the region or layer has a higher doping density than a layer or region not marked with a plus sign “+”, and a larger quantity of plus signs “+” indicates a higher doping density. Ns or Ps followed by the same quantity of plus signs “+” mean that the regions or layers have similar doping densities, and do not necessarily have the same doping density.
In this application, an N-type semiconductor region is mainly doped with an N-type impurity, such as phosphorus (P) or nitrogen (N). A P-type semiconductor region is mainly doped with a P-type impurity, such as aluminum (Al), boron (B), gallium (Ga), or beryllium (Be).
For example, the SiC MOSFET may further include a floating region that is located on the drift layer and that is separately located on the two sides of the fin-shaped channel layer. In this way, an electric field strength beneath the gate oxide layer can be weakened, thereby protecting the gate oxide layer and greatly improving gate reliability of the device.
During specific implementation, when the SiC MOSFET is an NMOS transistor, the floating region is a P-type semiconductor region. When the SiC MOSFET is a PMOS transistor, the floating region is an N-type semiconductor region. A doping density of the floating region is generally lower than a doping density of the fin-shaped channel layer.
Further, to implement reverse parallel connection of a flyback diode inside the device, the SiC MOSFET may further include: a groove that is located on the two sides of the fin-shaped channel layer and that penetrates through the first insulated isolating layer and a part of the floating region; and an ohmic contact portion that is padded in the groove. The source electrode is electrically connected to the floating region through the ohmic contact portion.
In this application, the ohmic contact portion may be formed by using any material that can form ohmic contact with the floating region. This is not limited herein.
In this application, to avoid a bipolar degradation effect for the SiC MOSFET, a schottky barrier diode is integrated inside the SiC MOSFET, to improve a reverse conduction characteristic and a switching characteristic. For example, in the SiC MOSFET, at least two spaced floating regions are separately disposed on the two sides of the fin-shaped channel layer. The SiC MOSFET may further include: a groove that is located on the two sides of the fin-shaped channel layer and that penetrates through the first insulated isolating layer and a part of the drift layer, where the groove is located between adjacent floating regions; and a schottky contact portion that is padded in the groove.
During specific implementation, the schottky contact portion may be formed by using any material that can form schottky contact with the drift layer. This is not limited herein. For example, the schottky contact portion may be formed by using alloy. This is not limited herein.
During specific implementation, a material of the gate electrode in this application may be a polycrystalline silicon material, or may be another material that has a good electric conduction characteristic, such as metal. This is not limited herein.
According to a second aspect, this application provides a SiC MOSFET preparation method. The preparation method may include: forming a drift layer on a SiC semiconductor substrate through epitaxy; forming a fin-shaped channel layer on the drift layer and a source region located on the fin-shaped channel layer; as the fin-shaped channel layer and the source region are of a stacking structure, separately performing thermal oxidation processing on side walls on two sides of the stacking structure to form a gate oxide layer; performing thermal oxidation processing on an exposed surface of the drift layer to form a first insulated isolating layer; forming a gate electrode on a side that is of each gate oxide layer and that is away from the stacking structure; forming, through deposition, a second insulated isolating layer that covers an external side wall and an upper surface of the gate electrode; forming, through deposition, a source electrode that covers the first insulated isolating layer, the second insulated isolating layer, and the source region; and forming, through deposition, a drain electrode on a side that is of the SiC semiconductor substrate and that is away from the drift layer.
Optionally, to prevent an upper surface of the source region from oxidation when the gate oxide layer is formed, in this application, the forming a fin-shaped channel layer on the drift layer and a source region located on the fin-shaped channel layer may include: growing a channel layer on the drift layer through epitaxy; performing ion injection on a region that is of the channel layer and that is close to a surface, to form a source region; forming a nitride layer on the channel layer; and etching on the channel layer and the nitride layer to form the fin-shaped channel layer and the source region located on the fin-shaped channel layer, and retaining the nitride layer located on the source region. After an isolating oxide layer that covers the external side wall and the upper surface of the gate electrode and an upper surface of the drift layer is formed through deposition, the nitride layer located on the source region further needs to be removed.
In a feasible implementation, before the separately performing thermal oxidation processing on side walls on two sides of the stacking structure to form a gate oxide layer, the method further includes: forming, through deposition, an oxide protection layer that covers a surface and a side wall of the stacking structure; injecting ions to the drift layer by using the oxide protection layer as an ion injection mask layer, to separately form a floating region on two sides of the fin-shaped channel layer; and removing the oxide protection layer.
Further, after the forming, through deposition, a second insulated isolating layer that covers an external side wall and an upper surface of the gate electrode, the method may further include: forming a groove that penetrates through the first insulated isolating layer and a part of the floating region; and padding an ohmic contact portion in the groove.
In another feasible implementation, before the separately performing thermal oxidation processing on side walls on two sides of the stacking structure to form a gate oxide layer, the method further includes: forming, through deposition, an oxide protection layer that covers a surface and a side wall of the stacking structure; separately forming at least one photoresist material blocking portion on the drift layer on two sides of the oxide protection layer; injecting ions to the drift layer by using the oxide protection layer and the photoresist material blocking portion as an ion injection mask layer, to separately form at least two floating regions on the two sides of the fin-shaped channel layer; and removing the oxide protection layer and the photoresist material blocking portion.
Further, after the forming, through deposition, a second insulated isolating layer that covers an external side wall and an upper surface of the gate electrode, the method may further include: forming, at a position corresponding to a region between adjacent floating regions, a groove that penetrates through the first insulated isolating layer and a part of the drift layer; and padding a schottky contact portion in the groove.
According to a third aspect, this application further provides an integrated circuit. The integrated circuit includes a circuit board and a SiC MOSFET that is disposed on the circuit board. The SiC MOSFET may be the SiC MOSFET according to any one of the first aspect or the various implementations of the first aspect, or may be a SiC MOSFET prepared by using the preparation method according to any one of the second aspect or the various implementations of the second aspect.
For technical effects that can be achieved in the third aspect, refer to the description of the technical effects that can be achieved in any possible design of the first aspect. Details are not described herein again.
To make the objectives, technical solutions, and advantages of this application clearer, the following further describes this application in detail with reference to the accompanying drawings. However, example implementations may be implemented in a plurality of forms, and should not be understood as being limited to the example implementations described herein. On the contrary, the implementations are provided to make this application more comprehensive and complete, and comprehensively convey the idea of the example implementations to a person skilled in the art. In addition, same reference numerals in the figures represent same or similar structures. Therefore, repeated description thereof is omitted. Expressions of positions and directions in this application are described by using the accompanying drawings as an example. However, changes may be made based on a requirement, and the changes fall within the protection scope of this application. The accompanying drawings in this application are merely used to illustrate a relative position relationship and do not represent a true scale.
It should be noted that specific details are set forth in the following description to facilitate full understanding of this application. However, this application can be implemented in other manners different from those described herein, and a person skilled in the art can make similar inferences without departing from the connotation of this application. Therefore, this application is not limited to the specific implementations disclosed below. Subsequent descriptions in this specification are example implementations of this application, and the descriptions are intended to describe general principles of this application, but are not intended to limit the scope of this application. The protection scope of this application is subject to the appended claims.
To facilitate understanding of a SiC MOSFET provided in embodiments of this application, the following first describes an application scenario of the SiC MOSFET.
Compared with a Si material, a SiC material has advantages such as a large band gap, a high critical breakdown electric field, a high thermal conductivity, and a high electron saturation drift velocity. These characteristics enable a silicon carbide electronic device to work in an environment with a high voltage, high calorific value, and high frequency. Compared with an IGBT prepared by using Si, a MOSFET prepared by using SiC has advantages such as a smaller size, lower power consumption, and better thermal conductivity while proving the same power. Therefore, SiC MOSFETs can be widely used in electric vehicles, charging piles, uninterruptible power supplies, smart grids, and other fields.
Preparation of a gate oxide layer is a key step in production of a SiC MOSFET. At present, a commonly used method is to directly perform high-temperature thermal oxidation on a SiC epitaxial wafer, to form a silicon dioxide gate oxide layer on a surface of the SiC epitaxial wafer. However, numerous interface states exist at a SiC/SiO2 interface (for example, Si- and C-dangling bonds at the interface, a C-related defect, and an oxide defect near the interface). An interface trap traps carriers in an inversion layer, causing a current density of the device to decrease. Moreover, the trapped carriers generate Coulomb scattering on free carriers in a channel, resulting in low channel mobility and compromising a conduction characteristic of the device. Although nitridation processing may be performed on the interface through subsequent nitrogen and oxygen annealing after the oxidation to improve the channel mobility, the channel mobility is still far lower than that of a silicon carbide body material.
In view of this, embodiments of this application provide a SiC MOSFET and an integrated circuit, which can improve channel mobility and are described in detail in the following with reference to specific accompanying drawings and embodiments.
During specific implementation, two types of carriers exist in a semiconductor, namely holes in a valence band and electrons in a conduction band. A semiconductor that mainly uses electrons for conduction is referred to as an N-type semiconductor, and a semiconductor that mainly uses holes for conduction is referred to as a P-type semiconductor. It should be noted that in this application, in a layer and region prefixed with N or P, a majority of carriers are electrons or holes, respectively. In addition, a plus sign “+” following N or P indicates that the region or layer has a higher doping density than a layer or region not marked with a plus sign “+”, and a larger quantity of plus signs “+” indicates a higher doping density. Ns or Ps followed by the same quantity of plus signs “+” mean that the regions or layers have similar doping densities, and do not necessarily have the same doping density.
Refer to
In this application, the fin-shaped channel layer 12 means that the channel layer is of a strip shape, and the gate electrode 14 is located on two sides of the fin-shaped channel layer 12. Therefore, the SiC MOSFET is a Fin FET. Disposing the gate electrode 14 on the two sides of the fin-shaped channel layer 12 is conducive to reducing a width of the fin-shaped channel layer 12 (namely a distance between two gate oxide layers on the two sides of the fin-shaped channel layer 12). This is favorable for global inversion of the fin-shaped channel layer 12, thereby forming a large carrier path in the fin-shaped channel layer 12. In this way, most carriers in the SiC MOSFET flow through an electron path formed in the fin-shaped channel layer 12, so that a quantity of carriers that flow on an edge of the gate oxide layer 15 is reduced, thereby greatly improving channel mobility and also improving reliability of the gate oxide layer 15.
The SiC MOSFET provided in this embodiment of this application may be an NMOS transistor, or may be a PMOS transistor. This is not limited herein. When the SiC MOSFET is an NMOS transistor, the SiC semiconductor substrate 10 may be an N++ region and serves as a drain region, the drift layer 11 may be an N+ region and mainly serves to bear high voltage, the source region 13 may be an N++ region, and the fin-shaped channel layer 12 may be a P region, namely a P-well. A P-well is a region that is on an N-type semiconductor layer and that is doped with a P-type impurity of a density high enough to neutralize the N-type semiconductor layer and make the N-type semiconductor layer have a P-type characteristic. When the SiC MOSFET is a PMOS transistor, the SiC semiconductor substrate 10 may be a P++ region and serves as a drain region, the drift layer 11 may be a P+ region and mainly serves to bear high voltage, the source region 13 may be a P++ region, and the fin-shaped channel layer 12 may be an N region, namely an N-well. An N-well is a region that is on a P-type semiconductor layer and that is doped with an N-type impurity of a density high enough to neutralize the P-type semiconductor layer and make the P-type semiconductor layer have an N-type characteristic. During specific implementation, the SiC MOSFET is generally an NMOS transistor because hole mobility is lower than electron mobility. This is not limited herein.
It should be noted that, as an example for illustration in both the specification and accompanying drawings of this application, the SiC MOSFET is an NMOS transistor. For a case in which the SiC MOSFET is a PMOS transistor, an N region in the NMOS transistor may be replaced with a P region, and a P region in the NMOS transistor may be replaced with an N region.
In this application, an N-type semiconductor region is mainly doped with an N-type impurity, such as phosphorus (P) or nitrogen (N). A P-type semiconductor region is mainly doped with a P-type impurity, such as aluminum (Al), boron (B), gallium (Ga), or beryllium (Be).
During actual application, a high electric field exists in a drift region when the SiC MOSFET is in a blocked state, and a curvature effect exists at a bottom part of the fin-shaped channel layer 12, causing an especially centralized electric field beneath the gate oxide layer 15. Long-standing high electric field stress causes quality degradation of the gate oxide layer 15, compromising reliability of the device.
Therefore, for example, refer to
During specific implementation, when the SiC MOSFET is an NMOS transistor, the floating region 20 is a P-type semiconductor region. When the SiC MOSFET is a PMOS transistor, the floating region 20 is an N-type semiconductor region. A doping density of the floating region 20 is generally lower than a doping density of the fin-shaped channel layer 12.
Further, to implement reverse parallel connection of a flyback diode inside the device, refer to
In this application, the ohmic contact portion may be formed by using any material that can form ohmic contact with the floating region 20. This is not limited herein.
During specific implementation, a SiC MOSFET may have a bipolar degradation effect. This effect is mainly triggered by basal plane dislocation previously existing on SiC crystal. During bipolar operation, energy released by combination of electrons and holes causes a stacking fault to spread at a position of the basal plane dislocation. The stacking fault spreads to a surface of a semiconductor material and then stops spreading. A region covered by an expanded stacking fault is no longer conductive. Therefore, an effective active region of the SiC MOSFET is reduced.
To avoid a bipolar degradation effect for the SiC MOSFET, a schottky barrier diode (SBD) may be reversely connected in parallel to the SiC MOSFET to implement reverse flyback. However, an external SBD connected in parallel inevitably increases packaging costs and stray inductance, causing degradation of a switching characteristic of the device.
Therefore, in this application, to avoid a bipolar degradation effect for the SiC MOSFET, a schottky barrier diode is integrated inside the SiC MOSFET, to improve a reverse conduction characteristic and a switching characteristic. For example, refer to
During specific implementation, the schottky contact portion 22 may be formed by using any material that can form schottky contact with the drift layer 11. This is not limited herein. For example, the schottky contact portion 22 may be formed by using alloy. This is not limited herein.
During specific implementation, a material of the gate electrode in this application may be a polycrystalline silicon material, or may be another material that has a good electric conduction characteristic, such as metal. This is not limited herein.
For example, the gate electrode in the SiC MOSFET is generally formed by using polycrystalline silicon.
It should be noted that in this application, comparison between doping densities of two regions is merely comparison between densities of impurities doped in these two regions, and components of the impurities are not limited. In other words, the components of the impurities may be the same or may be different. A material of a substrate to which the impurities are doped is SiC.
In an embodiment, the drift layer 11, the fin-shaped channel layer 12, and the source region 13 may be formed by performing ion doping on a SiC material that is grown through epitaxy. A material of the gate oxide layer 15 and the first insulated isolating layer 16 is SiO2 formed by performing thermal oxidation on a SiC material. A material of the second insulated isolating layer 17 may be at least one of silicon oxide and silicon nitride.
Refer to
For example, the SiC semiconductor substrate 10 may be an N-type semiconductor. During specific implementation, SiC may be first formed on the SiC semiconductor substrate through epitaxy, and then N-type ions are injected to the SiC to form the drift layer.
As shown in
As shown in
As shown in
As shown in
For example, step S103 and step S104 may be performed at the same time.
For example, a material of the gate electrode 14 may be a polycrystalline silicon material. This is not limited herein.
For example, the second insulated isolating layer 17 may be formed by using at least one of silicon oxide and silicon nitride. This is not limited herein.
Optionally, as shown in
For example, the source electrode may be formed by using a conductive material, such as metal.
For example, the drain electrode may be formed by using a conductive material, such as metal.
It should be noted that in this application, step S108 may alternatively be performed before any one of step S101 to step S107. This is not limited herein.
Optionally, in this application, before thermal oxidation processing is separately performed on the side walls on the two sides of the stacking structure to form the gate oxide layer in step S103, the method may further include: forming, through deposition, an oxide protection layer that covers a surface and a side wall of the stacking structure; injecting ions to the drift layer by using the oxide protection layer as an ion injection mask layer, to separately form a floating region on two sides of the fin-shaped channel layer; and removing the oxide protection layer.
The following describes this application in detail by using an N-type SiC MOSFET as an example in combination with specific embodiments. It should be noted that this embodiment is intended for better explaining the present invention, rather than limiting this application. To facilitate understanding of a field-effect transistor provided in embodiments of this application, the following describes a field-effect transistor preparation method with reference to accompanying drawings.
In an embodiment of this application, with reference to
For example, a material of the oxide protection layer 32 may be silicon dioxide. A purpose of the oxide protection layer 32 is to prevent a floating region from subsequently diffusing to beneath the fin-shaped channel layer 12.
Using the oxide protection layer 32 as the ion injection mask layer can save a mask for preparing the floating region.
In another embodiment of this application, with reference to
During specific implementation, a quantity of photoresist material blocking portions 33 on each side of the stacking structure may be determined based on a quantity of floating regions to be formed on the side of the stacking structure. For example, if n floating regions need to be formed on the side of the stacking structure, n−1 photoresist material blocking portions 33 need to be formed on the side, where n is an integer greater than 1.
In the SiC MOSFET provided in this embodiment of this application, the gate electrode 14 is located on two sides of the fin-shaped channel layer 12. Therefore, the SiC MOSFET is a Fin FET. Disposing the gate electrode 14 on the two sides of the fin-shaped channel layer 12 is conducive to reducing a width of the fin-shaped channel layer 12. This is favorable for global inversion of the fin-shaped channel layer, thereby forming a large carrier path in the fin-shaped channel layer 12. In this way, most carriers in the SiC MOSFET flow through an electron path formed in the fin-shaped channel layer 12, so that a quantity of carriers that flow on an edge of the gate oxide layer 15 is reduced, thereby greatly improving channel mobility and also improving reliability of the gate oxide layer 15. Further, in the SiC MOSFET, the floating regions 20 are disposed on the drift layer 11, so that an electric field strength beneath the gate oxide layer 15 can be weakened, thereby protecting the gate oxide layer 15 and greatly improving gate reliability of the device. In addition, in this application, a schottky barrier diode is integrated inside the SiC MOSFET. This can avoid a bipolar degradation effect for the SiC MOSFET, thereby improving a reverse conduction characteristic and a switching characteristic.
Correspondingly, an embodiment of this application further provides an integrated circuit. The integrated circuit may include a circuit board and any SiC MOSFET provided in the foregoing embodiments of this application. The SiC MOSFET is disposed on the circuit board. A problem solving principle of the integrated circuit is similar to that of a SiC MOSFET described above. Therefore, for implementations of the integrated circuit, refer to implementations of the SiC MOSFET. Repeated content is not described herein again.
Obviously, a person skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, this application is intended to cover these modifications and variations of this application provided that they fall within the scope of protection defined by the claims of this application and their equivalent technologies.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210206634.7 | Mar 2022 | CN | national |
This application is a continuation of International Application No. PCT/CN2022/142808, filed on Dec. 28, 2022, which claims priority to Chinese Patent Application No. 202210206634.7, filed on Mar. 2, 2022. The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2022/142808 | Dec 2022 | WO |
| Child | 18645785 | US |
