Patent Application
20090301551
1. Field of the Invention
In at least one aspect, the present invention relates to a method and apparatus for depositing silicon films on a substrate.
2. Background Art
A significant portion of solar cell technology is based around the photovoltaic properties of silicon. In particular, crystalline, polycrystalline, and amorphous silicon have all been used to fabricate photovoltaic devices. Although photovoltaic technology is progressing, the costs of forming the requisite silicon precursors remains high. Moreover, many silicon precursors present safety concerns necessitating the implementation of expensive chemical handling equipment.
Accordingly, for at least these reasons, there is a need for methods for forming and handling silicon precursors with reduced associated costs.
The present invention solves one or more problems of the prior art by providing in at least one aspect a method for depositing a silicon film on a substrate. The method of this embodiment includes a step of flowing a first silicon-containing gaseous composition through an electric discharge in an electric discharge chamber generated to form a second silicon-containing composition that is different than the first silicon-containing composition. The second composition is directed into a deposition chamber to form a silicon-containing film on one or more substrates positioned within the deposition chamber. An activated hydrogen-containing composition is introduced into the deposition chamber during film deposition. The activated hydrogen-containing composition is formed by exposing hydrogen gas to microwave radiation. In accordance with the present invention, at least a portion of a silicon-containing monomeric feedstock is converted to a polymer in the electric discharge chamber. The polymer is then transported to the deposition chamber. Advantageously, the polymer transported thereto allow for the deposition of crystalline silicon films (e.g., polycrystalline or microcrystalline silicon films) at a low temperature than deposition from just the monomer. Moreover, the polycrystalline silicon deposition rate is enhanced by utilization of the generated silicon-containing polymer. Advantageously, the silicon films made by the method of this embodiment may be incorporated into photovoltaic devices such as solar cells and into silicon-based electronic devices.
Reference will now be made in detail to presently preferred compositions, embodiments and methods of the present invention, which constitute the best modes of practicing the invention presently known to the inventors. The Figures are not necessarily to scale. However, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms. Therefore, specific details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for any aspect of the invention and/or as a representative basis for teaching one skilled in the art to variously employ the present invention.
Except in the examples, or where otherwise expressly indicated, all numerical quantities in this description indicating amounts of material or conditions of reaction and/or use are to be understood as modified by the word “about” in describing the broadest scope of the invention.
It is also to be understood that this invention is not limited to the specific embodiments and methods described below, as specific components and/or conditions may, of course, vary. Furthermore, the terminology used herein is used only for the purpose of describing particular embodiments of the present invention and is not intended to be limiting in any way.
It must also be noted that, as used in the specification and the appended claims, the singular form “a,” “an,” and “the” comprise plural referents unless the context clearly indicates otherwise. For example, reference to a component in the singular is intended to comprise a plurality of components.
Throughout this application, where publications are referenced, the disclosures of these publications in their entireties are hereby incorporated by reference into this application to more fully describe the state of the art to which this invention pertains.
A silent electric discharge is an electric discharge that is generated across a gap that is typically quite small (e.g, less than 5 mm). Sometimes in such discharges, light or audible sound is not observed.
With reference to
Still referring to
Electric discharge chamber 14 includes electrodes 28, 30. Electrodes 28 and 30 are necessarily at different electrical potentials. Typically, the potential difference between electrodes 28 and 30 is from about 5 KV to about 30 KV. In a refinement of the present embodiment, the potential difference between electrodes 28 and 30 is from about 8 KV to about 20 KV. In yet another variation, of the present embodiment, the potential difference between electrodes 28 and 30 is from about 8 KV to about 12 KV. DC voltage source 32 is deployed to provide the necessary potential differences between electrodes 28 and 30. In order to maintain the potential difference and of course to prevent shorting, electrodes 28, 30 must be isolated from each other. Insulating barrier 36 and O-ring 38 provide the necessary separation.
First silicon-containing composition 22 enters electric discharge chamber 14 via entrance port 50, travels through gap region 52, and exits through exit port 54. In one variation of the present embodiment, the first silicon-containing composition comprises a silicon halide. Examples of suitable silicon halides include, but are not limited to, SiCl4, SiCl3H, SiF4, SiCl2H2, and combinations thereof. In another variation of the present embodiment, the first silicon-containing composition comprises SiH4, GeH4, and mixtures thereof.
The electric discharge within gap region 52 initiates various chemical reactions and rearrangements advantageously transforming the first silicon-containing composition into a form that readily forms silicon films at temperatures below about 600° C. The deposition rate of the depositing crystalline silicon films is enhance by the inclusion of the activated species described below. In a refinement of the present embodiment, the electric discharge within gap region 52 initiates various chemical reactions and rearrangements advantageously transforming the first silicon-containing composition into a form that readily forms silicon films at temperatures below about 600° C. In a refinement of the present embodiment, the electric discharge within gap region 52 initiates various chemical reactions and rearrangements advantageously transforming the first silicon-containing composition into a form that readily forms silicon films at temperatures below about 700° C. In still another refinement of the present embodiment, the electric discharge within gap region 52 initiates various chemical reactions and rearrangements advantageously transforming the first silicon-containing composition into a form that readily forms silicon films at temperatures below about 300° C.
With reference to
In another variation, reactants are introduced and removed from deposition system 10 in a flow through manner. In this variation, valve 57 and 7454, 56, 57, 96, 98 are opened while valves 59, 94 are closed. Gas then flows through electric discharge chamber 14 and deposition chamber 12 as set forth above. However, in this variation, the reactants do not circulate. Instead, the reactant gases are removed by pump 70.
An activated hydrogen-containing composition is introduced into the deposition chamber 12 while the second silicon-containing composition is present therein. In this embodiment, the activated hydrogen-containing composition being formed by exposing hydrogen gas to microwave radiation derived from microwave cavity 106. Gas inlet 108 is used to introduce the a hydrogen-containing gas to deposition chamber 12. Valve 110 regulates the introduce of the hydrogen-containing gas into deposition chamber 12. In a refinement of the present invention, a microwave power from about 100 to about 500 watts is used in order to minimized the reaction of the activated hydrogen-containing composition with the walls of deposition chamber 12 which is typically quartz. A microwave frequency of about 2.45 gigahertz is particularly convenient for this application. In another variation of the present embodiment, the activated hydrogen-containing composition is generated by an RF glow discharge. Examples of typical RF frequencies include, but at not limited to, 13.56 MHZ, 27.12 MHZ, 40.60 MHZ. In another variation, the activated hydrogen-containing composition is generated by an inductively-coupled plasma. Examples of RF frequencies for this latter variation include, but are not limited to, 27.12 MHZ and 40.60 MHZ. The activated hydrogen-containing enhances the deposition of crystalline silicon films (e.g., polycrystalline or various microcrystalline silicon films). It should be appreciated that other activated species may be substituted for or used in addition to the activated hydrogen-containing composition. An example of such a species would be an activated argon or mixtures of hydrogen and argon.
In a variation of the present invention, a dopant containing composition may be introduced into deposition chamber 12 to form doped crystalline silicon films is desired. Such dopants may be introduce via inlet 108 or a separate include if desired. Suitable dopants include, but are not limited to, phosphine and diborane.
While embodiments of the invention have been illustrated and described, it is not intended that these embodiments illustrate and describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.
This application claims the benefit of U.S. provisional application Ser. No. 61/053,033 filed May 14, 2008.
| Number | Date | Country | |
|---|---|---|---|
| 61053033 | May 2008 | US |
