Claims
- 1. An SMT LED device, comprising:
a substrate having circuit traces to provide connections for the LED, and for mounting the LED; solder pads on a first side of the substrate and coupled to the circuit traces for providing external connections with the LED; an LED die mounted on a second surface of the substrate and coupled to the circuit traces; an optical waveguide mounted on the second surface of the substrate and coupled to the LED die to direct light from the LED die in a specified direction; and the waveguide being composed of a material resistant to deformation in the presence of temperatures found in a solder reflow process.
- 2. The LED according to claim 1, further comprising positioning indicia on at least one of the waveguide and the substrate.
- 3. The LED according to claim 1, further comprising a light projection surface on a portion of the waveguide to which light is directed.
- 4. The LED according to claim 1, further comprising a guide structure on a portion of the waveguide for locating the LED on a printed circuit board with automated machinery.
- 5. The LED according to claim 1, further comprising a total internal reflective contour on a portion of the waveguide for directing the light from the LED die in the specified direction.
- 6. The LED according to claim 1, wherein the waveguide material is transparent.
- 7. The LED according to claim 1, wherein the waveguide material is a high temperature thermoplastic.
- 8. A waveguide for use with an SMT LED, comprising:
an optical guide on a first portion of the waveguide for use with automated SMT manufacturing equipment; a contour portion for receiving light supplied by the LED and directing the light in a coherent direction; a light emission surface for passing the directed light; locating indicia for coupling the waveguide to the LED in a specified relationship; and the waveguide being composed of a material resistant to deformation at temperatures provided in a solder reflow process.
- 9. The waveguide according to claim 8, wherein the material is transparent.
- 10. The waveguide according to claim 8, wherein the material is a high temperature thermoplastic.
- 11. A method for automatically mounting a complete SMT LED module, comprising:
providing an LED die on a substrate suitable for SMT mounting; coupling a waveguide to the substrate and the LED die to receive light emitted from the LED die and direct the light in a specified direction, the waveguide being composed of a material resistant to deformation when exposed to temperatures provided in a solder reflow process; and mounting the complete SMT LED module to a printed circuit board using automated positioning and mounting equipment.
- 12. An SMT LED module, comprising:
a substrate having electrical connections for connecting the module to a circuit; an LED die mounted on the substrate and electrically connected to the electrical connections; an optical waveguide mounted on the substrate and optically coupled to the LED die to direct light from the LED die in a specified direction; and the waveguide having guides suitable for use with automated manufacturing equipment, whereby the module is automatically mountable to the circuit.
RELATED APPLICATION
[0001] This application is based on and claims benefit of U.S. Provisional Application No. 60/407,434, filed Aug. 29, 2002, entitled SMT LED INDICATOR PACKAGE, the entire disclosure of which is hereby incorporated by reference, and to which a claim of priority is hereby made.
Provisional Applications (1)
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Number |
Date |
Country |
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60407434 |
Aug 2002 |
US |