Claims
- 1. A soldering apparatus for dipping a terminal pin (1), to which an end portion (2a) of a coil (2) is connected, in molten solder (4) contained in a solder bath (3) and for soldering the end portion (2a) of said coil (2) to said terminal pin by using solder, said soldering apparatus further comprising:
- relative displacement means (20) for causing relative displacement between said molten solder (4) and said terminal pin (1) while said terminal pin is dipped in said molten solder, to facilitate the removal of a coating on the end portion of said coil,
- wherein the soldering of the end portion of said coil to said terminal pin occurs in said solder bath.
- 2. The soldering apparatus as set forth in claim 1, wherein said relative displacement means (20) is an actuator for causing a reciprocating motion of said terminal pin (1) or of said solder bath (3).
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-315382 |
Nov 1997 |
JPX |
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Parent Case Info
This is a divisional of application No. 09/082,076 filed May 21, 1998, the disclosure of which is incorporated herein by reference.
US Referenced Citations (19)
Foreign Referenced Citations (2)
Number |
Date |
Country |
492 654 |
Jul 1992 |
EPX |
30 36 197 |
Apr 1982 |
DEX |
Divisions (1)
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Number |
Date |
Country |
Parent |
082076 |
May 1998 |
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