1. Field of the Invention
The present invention relates to a solid-state image sensor, a range finder using the solid-state image sensor and imaging devices using the range finder, such as a digital still camera and a digital video camera.
2. Description of the Related Art
For a digital still camera or video camera, there has been proposed a solid-state image sensor using a ranging pixel having a ranging (focus-detecting) function for some or all of the pixels of the solid-state image sensor, so as to detect an object distance by a phase difference system (Japanese Patent No. 4027113). The ranging pixel is so constructed that a plurality of photoelectric conversion portions are provided to guide light fluxes having passed through different exit pupil regions of a camera lens to different photoelectric conversion portions. The photoelectric conversion portion has a function of converting light to an electric charge and storing the electric charge during a photographing (exposure).
Here, a plurality of ranging pixels are used to detect images (referred to as an image A and an image B, respectively) by light fluxes having passed through different regions of an exit pupil, thereby measuring an amount of deviation between the image A and the image B. An amount of defocus is calculated from this amount of deviation and a base length (space between different exit pupil regions) to detect a distance (focus position). At this time, the exit pupil surface of the camera lens and the surface of the photoelectric conversion portion reside substantially in a conjugate relation. Accordingly, an exit pupil region to pass through and light reception sensitivity are determined according to the position and size of the photoelectric conversion portion. That is, when the photoelectric conversion portion is made large, the passing exit pupil region becomes large, and the quantity of light received in the photoelectric conversion portion increases to heighten the sensitivity.
When photoelectric conversion portions of a ranging pixel having a plurality of photoelectric conversion portions are formed large, the proportion of the photoelectric conversion portions in the ranging pixel becomes large, and the distance between the photoelectric conversion portions gets closer. When the distance between the photoelectric conversion portions gets closer, an electric charge generated in one photoelectric conversion portion easily migrates to another photoelectric conversion portion (electronic crosstalk). An electric charge signal thereby mutually interferes between the photoelectric conversion portions in the ranging pixel, so that the electric charge signal is difficult to correspond to the exit pupil region through which light fluxes have passed. As a result, an error occurs in the amount of deviation between the image A and the image B and in the base length, and so ranging precision is liable to be deteriorated.
The present invention has been made in view of the foregoing problems. According to the present invention, there is provided a solid-state image sensor comprising a plurality of pixels, at least one pixel of the plurality of the pixels having a plurality of photoelectric conversion portions and a pupil-dividing member that causes light that passes through an exit pupil and is incident on a region defined by the member itself to be incident on the plurality of the photoelectric conversion portions, wherein potential profiles (hereinafter also referred to as shape) with respect to electric charge of the plurality of the photoelectric conversion portions change in a perpendicular line direction of the substrate, and wherein a distance between potential centroids in a section perpendicular to the perpendicular line of the plurality of the photoelectric conversion portions is longer on a back side that is a side opposite to a light incidence side than on the light incidence side.
According to the present invention, the potential profiles of the plurality of the photoelectric conversion portions of the ranging pixel are formed as described above, so that a solid-state image sensor capable of conducting ranging with high sensitivity and high precision, and a range finder using the same can be realized.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Preferred embodiments of the present invention will now be described in detail in accordance with the accompanying drawings.
In the present invention, at least one pixel of a plurality of pixels formed in a solid-state image sensor is used as a ranging pixel having a plurality of photoelectric conversion portions formed in a substrate. Each of the plurality of the photoelectric conversion portions changes in potential profile with respect to electric charge in a perpendicular line direction of the substrate, and a distance between potential centroids in a section perpendicular to the perpendicular line of the plurality of the photoelectric conversion portions is longer on a back side that is a side opposite to a light incidence side than on the light incidence side. And, a distance between mutually opposing inside contours of the potential profiles of the plurality of the photoelectric conversion portions in a direction perpendicular to the perpendicular line may be longer on a back side that is a side opposite to a light incidence side than on the light incidence side. Since the potential of the photoelectric conversion portion is lower than a surrounding potential, the potential profile is defined by a boundary thereof. In addition, the potential centroid in the section perpendicular to the perpendicular line is defined as a position where, with the centroid as a center, a sumproduct of a distance from the centroid and a potential depth at that position balances in both sides in the perpendicular section. The present invention is intended to inhibit the mutual interference of the accumulated electric charge between the photoelectric conversion portions. It is better for this to arrange regions where the accumulated electric charge is relatively dense as separate as possible in the back side. Therefore, in the present invention, at least one of the distance between the contours in the direction perpendicular to the perpendicular line and the distance between the potential centroids is controlled so as to become longer on the back side that is a side opposite to the light incidence side than on the light incidence side. In an embodiment which will be described subsequently, both distances between the contours and between the centroids become gradually longer toward the back side from the light incidence side. However, the present invention is not limited to this mode. Examples of other modes include such a mode that the distance between the contours in the direction perpendicular to the perpendicular line does not very change in the perpendicular line direction of the substrate, while the distance between the potential centroids becomes longer toward the back side. Signal separation performance in each photoelectric conversion portion is improved by the above-described construction to improve distance measurement precision. In addition, since the plurality of the photoelectric conversion portions may not be so separated on the light incidence side, a lot of incident light can be received to prevent the reduction of sensitivity.
The solid-state image sensor according to an embodiment of the present invention and a range finder using the same will hereinafter be described with references to the attached drawings. In that embodiment, a digital camera is described as an example of imaging devices equipped with the range finder. However, the present invention is not limited thereto. In addition, those having the same function are given the same reference signs in all the drawings, and their repeated descriptions are omitted or simplified.
An embodiment relating to a solid-state image sensor to which the present invention is applied, a range finder equipped with this sensor, and imaging devices containing this detector, such as a camera will be described.
Here, the surface of the semiconductor substrate 201 and the surface of an exit pupil 104 of the camera lens reside substantially in a conjugate relation. Accordingly, the first photoelectric conversion portion 204 and the second photoelectric conversion portion 205 of the ranging pixel respectively receive light fluxes having passed through different exit pupil regions (first region 105 and second region 106) as illustrated in
Incidentally, the pixel in the present invention has a single pupil-dividing member. That is, different pupils have their corresponding different pupil-dividing members. The pupil-dividing member has a function of causing light that passes through the exit pupil 104 and is incident on a region defined by the pupil-dividing member to be incident on the photoelectric conversion portion 204 or 205. For example, the pupil-dividing member may be such a condenser member 211 as described above or an optical waveguide formed by a core member and a cladding member.
In order to obtain an imaging image using the ranging pixel, it is only necessary to add signals of all the photoelectric conversion portions (the first photoelectric conversion portion 204 and the second photoelectric conversion portion 205) present in the pixel. An imaging signal (‘A+B’ in
The photoelectric conversion portions according to the embodiment will be described with reference to
Light incident on the ranging pixel is converted to electrons 215 at a light incidence side surface of the photoelectric conversion portion (
On the other hand, a portion between the first photoelectric conversion portion and the second photoelectric conversion portion is formed of a P-type semiconductor to form a barrier portion 214 with a higher potential than the photoelectric conversion portions. Since this barrier portion 214 does not have a function of storing the electrons, this portion does not have sensitivity even when light reaches the barrier portion 214 or becomes a main cause of the electronic crosstalk noise. Accordingly, when the incident light is condensed on the photoelectric conversion portions 204 and 205 without reaching the barrier portion 214, the sensitivity becomes high, and the noise is lowered. In the solid-state image sensor according to this embodiment, the distance between the potential centroids of the first photoelectric conversion portion 204 and the second photoelectric conversion portion 205 in the direction perpendicular to the perpendicular line was made short on the light incidence side to form the barrier portion thin in order to cause the incident light to reach the photoelectric conversion portions. The barrier portion 214 is formed thin, whereby the area proportion of the photoelectric conversion portions 204 and 205 in the pixel when viewed from the light incidence side can be made large to improve the sensitivity.
In addition to this, the photoelectric conversion portions are formed in such a manner that the barrier portion becomes thick by making long the distance between the potential centroids of the first photoelectric conversion portion 204 and the second photoelectric conversion portion 205 on the back side as described above. The mutual interference (electronic crosstalk) of the electrons accumulated in the photoelectric conversion portions between the photoelectric conversion portions thereby becomes small, and so signal separation performance in each photoelectric conversion portion is improved. As a result, light separation characteristics are improved to improve the ranging precision.
Here, as illustrated in
In addition, peak positions of the sensitivities of the first photoelectric conversion portion 204 and the second photoelectric conversion portion 205 of the ranging pixel with respect to the angle of incidence are each designed so as to be at between 5 degrees and 20 degrees in terms of absolute value as illustrated in
As illustrated in
In
Production Process of Solid-State Image Sensor
A production process of a solid-state image sensor including the pixel 200 according to this embodiment will now be described with reference to
FD portions 206 and 207 and a diffusion portion (not illustrated) are then formed by the same ion implantation method (
A connection hole such as a contact hole 218 is then formed in the interlayer insulating film for electrical connection to electrically connect with another metal wiring. Likewise, a wiring 219 is formed and covered with the interlayer insulating film 220 (
Incidentally, in this embodiment, the photoelectric conversion portions 204 and 205 have been formed by an oblique ion implantation process. However, the process is not limited thereto. For example, an ion implantation process may be conducted several times according to an impurity concentration and a depth direction of the substrate to form the photoelectric conversion portions. In this embodiment, description has been given taking a CMOS solid-state image sensor of a front-side illumination type as an example. However, the solid-state image sensor is not limited to the front-side illumination type. Even when the present invention is applied to a back-side illumination type in which the positions of the metal wiring portion and the photoelectric conversion portions are reversed, the same effect is achieved. In this embodiment, the photoelectric conversion portions have been formed with the N-type semiconductor. However, they may also be formed with a P-type semiconductor. In this case, a hole is generated as an electric charge by light.
In addition, the shape of the photoelectric conversion portions according to the present invention is not limited to the downward tapering convex form as illustrated in
Although the favorable embodiment of the present invention has been described above, the present invention is not to this embodiment, and various modifications and changes may be made within the gist of the present invention. The above-described solid-state image sensor according to the present invention can be used in imaging devices such as a digital camera requiring a range finder, to say nothing of the range finder. At that time, it is only necessary to suitably position the solid-state image sensor with respect to an optical system which forms an image of an object according to its construction.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Applications No. 2012-253961, filed Nov. 20, 2012, and No. 2013-209805, filed Oct. 7, 2013 which are hereby incorporated by reference herein in their entirety.
Number | Date | Country | Kind |
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2012-253961 | Nov 2012 | JP | national |
2013-209805 | Oct 2013 | JP | national |