characterised by the photosensitive area

Industry

CPC
H01L27/1461

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/1461characterised by the photosensitive area

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Imaging element, stacked imaging element, and solid-state imaging d...
- Patent number 12,170,304
- Issue date Dec 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Fumihiko Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat panel detector, driving method, driving device and flat panel...
- Patent number 12,170,305
- Issue date Dec 17, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Shuai Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing device for controlling pixel output level and oper...
- Patent number 12,170,856
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jaeyoung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with pixel separation structure
- Patent number 12,170,296
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Seungjoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel circuit, control method and image sensor
- Patent number 12,170,297
- Issue date Dec 17, 2024
- SMARTSENS TECHNOLOGY (HK) CO., LIMITED
- Guang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a photodiode
- Patent number 12,170,298
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jameyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic modules and wafer-level methods for manufacturing th...
- Patent number 12,169,315
- Issue date Dec 17, 2024
- ams Sensors Singapore Pte. Ltd.
- Qi Chuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, driving method therefor, and electronic...
- Patent number 12,166,062
- Issue date Dec 10, 2024
- Sony Group Corporation
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, semiconductor apparatus, equipment, circuit subs...
- Patent number 12,167,156
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Hideo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device, imaging module, electronic device, and imaging system
- Patent number 12,165,049
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Time of flight sensors with light directing elements
- Patent number 12,164,062
- Issue date Dec 10, 2024
- ams International AG
- Miguel Bruno Vaello Paños
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having a gate electrode on a semiconductor pattern sid...
- Patent number 12,166,049
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Younggu Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, method of manufacturing the same, and imaging device
- Patent number 12,160,650
- Issue date Dec 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Dobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device including signal line and unit pixel cell including...
- Patent number 12,160,673
- Issue date Dec 3, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,894
- Issue date Dec 3, 2024
- Innolux Corporation
- Hsiao-Feng Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside illuminated structures with parallel charge transfer
- Patent number 12,159,887
- Issue date Dec 3, 2024
- Quantum-Si Incorporated
- Eric A. G. Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,159,890
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jung Hye Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device with capacitance switching
- Patent number 12,155,947
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Soichi Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform threshold voltage non-planar transistors
- Patent number 12,154,919
- Issue date Nov 26, 2024
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having curved imager
- Patent number 12,154,920
- Issue date Nov 26, 2024
- Denso Corporation
- Kouji Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and operation method thereof
- Patent number 12,155,945
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yongjun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,154,928
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Young-sun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and mobile terminal
- Patent number 12,154,918
- Issue date Nov 26, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhitao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit pixel with photoelectric converters and storage MOS capacitor...
- Patent number 12,151,617
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Jung Wook Lim
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Light detection device including an avalanche diode
- Patent number 12,148,772
- Issue date Nov 19, 2024
- Canon Kabushiki Kaisha
- Junji Iwata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Trench-gate source follower for low-noise scaled pixel
- Patent number 12,148,774
- Issue date Nov 19, 2024
- Shenzhen Goodix Technology Co., Ltd.
- Yunfei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection device and display device
- Patent number 12,148,776
- Issue date Nov 19, 2024
- Japan Display Inc.
- Yoshitaka Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and electronic device including a share...
- Patent number 12,149,852
- Issue date Nov 19, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenichi Obata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20240421167
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421170
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- HAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...
- Publication number 20240421176
- Publication date Dec 19, 2024
- Florian Perminjat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, FOCUS ADJUSTMENT DEVICE, AND IMAGING DEVICE
- Publication number 20240421168
- Publication date Dec 19, 2024
- Nikon Corporation
- Sota NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
READOUT ARCHITECTURES FOR ERROR REDUCTION IN INDIRECT TIME-OF-FLIGH...
- Publication number 20240418836
- Publication date Dec 19, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Zheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD
- Publication number 20240421173
- Publication date Dec 19, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiyue SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240421171
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taesub JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING
- Publication number 20240413178
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Rita KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240413183
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- HAEYONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMA...
- Publication number 20240406599
- Publication date Dec 5, 2024
- Sony Semiconductor Solutions Corporation
- HIROAKI AMMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET TOOL KIT FOR FORMING SEMICONDUCTOR STRUCTURE AND CMOS IMAGE SEN...
- Publication number 20240404832
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Chenchia Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL, AND ELECTRONIC DEVICE
- Publication number 20240405033
- Publication date Dec 5, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Fei Ai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR
- Publication number 20240405041
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD
- Publication number 20240405042
- Publication date Dec 5, 2024
- PixArt Imaging Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
- Publication number 20240405043
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240405038
- Publication date Dec 5, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masami FUNABASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND APPARATUS
- Publication number 20240407098
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240405048
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- JUNSEOK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20240405051
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- DAIKI SHIRAHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...
- Publication number 20240405036
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- Ki June LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR AND MANUFATURING METHOD THEREOF
- Publication number 20240405037
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Gyunha Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405040
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seonghoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GERMANIUM-BASED PHOTODETECTOR WITH REDUCED DARK CURRENT AND METHODS...
- Publication number 20240405035
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yeh-Hsun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH SHARED GATE ARCHITECTURE FOR METAL LAYER REDUCTION
- Publication number 20240405039
- Publication date Dec 5, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Yaxin Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE SEMICONDUCTOR DEVICE INCLUDING HETEROJUNCTION PHOTOD...
- Publication number 20240395834
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Zhaoyao Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20240393439
- Publication date Nov 28, 2024
- STMicroelectronics International N.V.
- Raul Andres BIANCHI
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the photosensitive area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Imaging element, stacked imaging element, and solid-state imaging d...

Flat panel detector, driving method, driving device and flat panel...

Image processing device for controlling pixel output level and oper...

Image sensor with pixel separation structure

Pixel circuit, control method and image sensor

Image sensor including a photodiode

Optoelectronic modules and wafer-level methods for manufacturing th...

Solid-state imaging device, driving method therefor, and electronic...

Circuit substrate, semiconductor apparatus, equipment, circuit subs...

Reliable semiconductor packages

Semiconductor device and method of manufacturing the same, and elec...

Imaging device, imaging module, electronic device, and imaging system

Time of flight sensors with light directing elements

Image sensor having a gate electrode on a semiconductor pattern sid...

Sensor package, method of manufacturing the same, and imaging device

Imaging device including signal line and unit pixel cell including...

Display device

Backside illuminated structures with parallel charge transfer

Image sensor

Imaging device with capacitance switching

Uniform threshold voltage non-planar transistors

Camera module having curved imager

Image sensor device and operation method thereof

Image sensor

Display panel and mobile terminal

Unit pixel with photoelectric converters and storage MOS capacitor...

Light detection device including an avalanche diode

Trench-gate source follower for low-noise scaled pixel

Detection device and display device

Solid-state imaging element and electronic device including a share...

Patents Applicationslast 30 patents

IMAGE SENSOR

IMAGE SENSOR

OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED...

IMAGE SENSOR, FOCUS ADJUSTMENT DEVICE, AND IMAGING DEVICE

READOUT ARCHITECTURES FOR ERROR REDUCTION IN INDIRECT TIME-OF-FLIGH...

RELIABLE SEMICONDUCTOR PACKAGES

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD

IMAGE SENSOR

SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING

IMAGE SENSOR

SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMA...

WET TOOL KIT FOR FORMING SEMICONDUCTOR STRUCTURE AND CMOS IMAGE SEN...

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

ARRAY SUBSTRATE, DISPLAY PANEL, AND ELECTRONIC DEVICE

IMAGE SENSOR

OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD

IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER

IMAGING DEVICE

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

MODULE AND APPARATUS

IMAGE SENSOR

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

FINGERPRINT SENSOR, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...

IMAGE SENSOR AND MANUFATURING METHOD THEREOF

SEMICONDUCTOR DEVICE

GERMANIUM-BASED PHOTODETECTOR WITH REDUCED DARK CURRENT AND METHODS...

IMAGE SENSOR WITH SHARED GATE ARCHITECTURE FOR METAL LAYER REDUCTION

PHOTOSENSITIVE SEMICONDUCTOR DEVICE INCLUDING HETEROJUNCTION PHOTOD...

OPTOELECTRONIC DEVICE