SOLUTION-BASED SYNTHESIS OF CsSnI3

Abstract

This invention discloses a solution-based synthesis of cesium tin tri-iodide (CsSnI3) film. More specifically, the invention is directed to a solution-based drop-coating synthesis of cesium tin tri-iodide (CsSnI3) films. CsSnI3 films are ideally suited for a wide range of applications such as light emitting and photovoltaic devices.

Description

BACKGROUND OF THE INVENTION

The current thin-film photovoltaic technologies can be classified by the different materials used for the light absorption in a solar cell. These materials include amorphous and polycrystalline silicon, CdTe, CuIn_xGa_1-xSe₂(CIGS), GaAs, and photosensitive organic dyes. A transformative technology may emerge when a new and better material is being discovered for thin-film photovoltaic applications.

D. Scaife, P. Weller, and W. Fisher, reported an early study on the structural information of CsSnI₃ compound in form of powders, J. Solid State Chem. 9, 308 (1974).

P. Mauersberger and F. Huber, synthesized a yellow, needle-like CsSnI₃ microcrystal, and studied its crystal structure, Acta Cryst. B 36, 683 (1980).

K. Yamada, S. Funabiki, H. Horimoto, T. Matsui, T. Okuda, and S. Ichiba, reported the polymorph nature of CsSnI₃compound, Chem. Lett. (The Chemical Society of Japan) 20, 801 (1991).

The black polymorph of CsSnI₃ could be obtained through a phase transition from the yellow polymorph CsSnI₃ by increasing its temperature above 425° K. It was further demonstrated by differential thermal analysis and X-ray diffraction that during the cooling of the black CsSnI₃ from 450° K, its ideal cubic perovskite structure (B-α) deformed to a tetragonal structure (B-β) at 426° K, and became an orthorhombic structure (B-γ) below 351° K. Experimental studies of electrical and optical properties of this compound have been hindered by lack of high quality CsSnl₃ samples either in bulk or thin film format.

Aiming at the unique properties of hybrid organic-inorganic perovskites based on tin halides, I. Borriello, G. Gantel, and D. Ninno, recently calculated band structures of B-α, B-β, and B-γ from the first principles using the crystal structures published by Yamada et al., Phys. Rev. B 77, 235214 (2008). It was concluded that all three structures had direct band-gap (E_g) at Z, R, and Γ points for B-α, B-β, and B-γ, respectively, with E_g (B-α)<E_g (B-β)<E_g (B-γ).

A need still exists in the industry for developing low cost synthesis methods for CsSnI₃ thin films, especially in large scale. The successful implementation of these materials for various applications requires a detailed understanding of both their processing and materials properties.

BRIEF SUMMARY OF THE INVENTION

This invention is directed to solution-based synthesis of cesium tin tri-iodide (CsSnI₃) films. This invention is also directed to effective and inexpensive methods to synthesize the films on large-area substrates such as glass, ceramics, and metal foils.

One embodiment of this invention is directed to a process of forming CsSnI₃ film on a substrate, comprising steps of:

• • (a)providing a substrate;
  • (b)providing homogeneous CsSnI₃ solution;
  • (c)drop-coating the homogeneous CsSnI₃ solution onto the substrate;
  • (d)heating the substrate after step (c) until the substrate is dry; and
  • (e)forming the CsSnI₃ film on the substrate.

Another embodiment of this invention is directed to a process of forming CsSnI₃ film on a substrate, comprising steps of:

• • (a) providing a substrate;
  • (b)provide CsI solution;
  • (c)provide SnCl₂ solution;
  • (d)drop-adding the CsI solution into the SnCl₂ solution to form a mixture;
  • (e)stirring the mixture to make a homogeneous CsSnI₃ solution,
  • (f)drop-coating the homogeneous CsSnI₃ solution onto the substrate;
  • (g)heating the substrate after step (f) until the substrate is dry; and
  • (h)forming the CsSnI₃ film on the substrate.

Yet, another embodiment of this invention is directed to CsSnI₃ films synthesized on a substrate by any one of the processes disclosed above.

In the process, the steps are performed under ambient condition; the substrate is selected from glass, ceramic, silicon, and metal foils; a ratio of the CsI solution to the SnCl₂ solution in the mixture ranges from about 1/10 to about 1/3.

The CsI solution is made by fully dissolving CsI powder (99.9% purity) in a solvent selected from the group consisting of water, deionized water, distilled water and mixtures thereof. The CsI solution is about 5 wt % to about 50 wt % CsI solution.

The SnCl₂ solution is made by fully dissolving SnCl₂ powder (99.9% purity) in a solvent selected from the group consisting of anhydrous alcohol, glacial acetic acid; ethylene glycol or triethylene glycol; and mixtures thereof. The SnCl₂ solution is about 5 wt % to about 80 wt % SnCl₂ solution.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 shows the experimental setup for forming CsI and SnCl₂ solutions.

FIG. 2 shows the cross-sectional scanning electron micrographic (SEM) image of the cross-section of CsSnI₃ film deposited by solution-based drop-coating on a ceramic substrate using the CsSnI₃ containing solution.

FIG. 3 shows photoluminescence (PL) spectra of CsSnI₃ film. The dashed line was taken from CsSnI₃ film made from the solution-based synthesis; the solid curve was taken from CsSnI₃ thin film made from the vacuum-powder-based synthesis. The inset displays the normalized photoluminescence (PL) spectra. The inset indicates that the spectra are the same for CsSnI₃ from solution-based and vacuum-powder-based synthesis.

FIG. 4 shows (a) X-ray diffraction data (XRD) profile taken from CsSnI₃ film as shown in FIG. 2, and (b) theoretical calculated XRD profile using orthorhombic crystal structure of CsSnI₃.

DETAILED DESCRIPTION OF THE INVENTION

U.S. patent application Ser. No. 13,151,243 discloses the vacuum-powder-based synthesis and characterization of CsSnI₃ thin films. The precursor materials (powder) of CsI and SnCl₂ (or SnI₂) were alternately evaporated in a vacuum chamber on a substrate. The resulting CsSnI₃ thin-film was formed after a post-deposition thermal treatment. The CsSnI₃ thin films exhibit outstanding optical, electrical, and ferroelectric properties. These features make CsSnI₃ thin films ideally suited for a wide range of applications such as light emitting and photovoltaic devices.

More specifically, U.S. patent application Ser. No. 13,151,243 discloses that CsSnI₃ is a promising material in the application of thin-film solar cells, since CsSnI₃ was found to possess a direct band gap of 1.32 eV at room temperature, right in the narrow region of optimal band gaps for the Shockley-Queisser maximum efficiency limit of a solar cell.

An effective and inexpensive method to synthesize large domain size high quality perovskite semiconductor thin films on large-area substrates such as glass, ceramics, silicon, and metal foils are disclosed in the present invention.

More specifically, a non-vacuum, solution-based method to synthesize CsSnI₃ films is disclosed in the present invention. The films can be fabricated on inexpensive substrates such as glass, ceramics, silicon, and metal foils by the solution-based drop-coating. This non-vacuum-powder based demonstration of the CsSnI₃ film formation further enhances the likelihood of using CsSnI₃ as a new absorption material for solar cells.

WORKING EXAMPLES

The procedures of synthesizing polycrystalline CsSnI₃ film using solutions were described.

The solutions of precursor materials were synthesized in ambient conditions. The ambient conditions refer to: room temperature or temperature of 298.15° K. (or 25° C., 77° F.); and an absolute pressure of 100 kPa (or 14.504 psi, 0.986 atm). The experimental setup was shown in FIG. 1.

Example 1

Synthesis of CsI Solution

12 gram of CsI powder (99.9% purity) was added to 30 gram of deionized water to form 28.6 wt % (weight percent) CsI solution. The CsI powder was fully dissolved in deionized water. The CsI solution was stirred for 30 minutes.

CsI solution was colorless and stable in ambient conditions.

The CsI solution could comprise more CsI powder as long as the amount of CsI powder was fully dissolved in deionized water, and the CsI solution was colorless. CsI powder could dissolve in less than its own mass of water without apparent decomposition.

It would be apparent to one skilled in the art that CsI solutions could be made using any solvents other than those used in the examples. Examples of the solvent include but not limited to, water, distilled water, mixtures thereof.

The wt % range of the CsI solution was ranging from about 5.0 wt % to about 50.0 wt %, or from about 15 wt % to about 40 wt %.

Example 2

Synthesis of SnCl₂ Solution

An amount of 4 gram of SnCl₂ powder (99.9% purity) was added to 20 gram of anhydrous ethanol to form 16.7 wt % of solution. The SnCl₂ powder was fully dissolved in anhydrous ethanol to form the SnCl₂ solution. The solution was stirred for 30 minutes.

SnCl₂ solution was colorless and stable in ambient conditions.

The SnCl₂ solution could comprise more SnCl₂ powder as long as the amount of SnCl₂ powder was fully dissolved in anhydrous ethanol, and the solution was colorless.

It would be apparent to one skilled in the art that SnCl₂ solutions could be made using any solvents other than those used in the examples. Examples of the solvent include but not limited to, anhydrous alcohol, such as but not limited to, anhydrous methanol and anhydrous isopropyl; glacial acetic acid; ethylene glycol or triethylene glycol; and the mixtures thereof.

The wt % range of the SnCl₂ solution was ranging from about 20 wt % to about 80%, or from about 10 wt % to about 50 wt %.

Example 3

Synthesis of CsSnI₃ Film by Drop-Coating

A given amount of the prepared CsI solution was transferred to a reaction vial first. SnCl₂ solution was then slowly dropped into the vial by a pipet. The ratio of CsI solution to SnCl₂ solution was in a range of about 1/10 to about 1/3. CsSnI₃ was formed immediately as black grains suspending in the mixed solution. This phenomenon implied that the CsSnI₃ was neither soluble in DI water nor in ethanol.

After five minutes sonication (using ultrasonic vibrator), homogeneous black CsSnI₃solution with CsSnI₃ black grains uniformly distributed in the solution, was formed. The homogeneous CsSnI₃ solution contained CsSnI₃ grains with a typical diameter of a few micrometers.

The homogeneous CsSnI₃ solution was drop-coated on a substrate, such as a microscope glass slide or a piece of ceramics.

After drop-coating, the substrate was heat treated at 70° C. for 5 minutes to remove residual solvents. SnCl₂ film with a thickness ˜40 μm was obtained by drop-coating the homogeneous CsSnI₃ solution. The heating temperature ranged from about 50° C. to about 90° C.

The cross-sectional scanning electron micrographic (SEM) image taken from the film on a glass substrate was shown in FIG. 2. FIG. 2 indicated that the film was dense and filled with large polycrystalline domains ranging from a few micrometers to 10 μm.

The chemical reaction for the mixture of the solutions could be described as the following:

3CsI+SnCl₂→CsSnI₃+2CsCl,

The reaction was verified by identifying the end products of CsSnI₃ and CsCl using the X-ray diffraction (XRD) data to be discussed later.

Photoluminescence (PL) data and X-ray diffraction data (XRD) were used to identify CsSnI₃ and to characterize the crystalline quality of each individual domain.

PL spectra were taken from a Nanolog system from Horiba Jobin Yvon. The Nanolog system had a 450 W Xe-lamp light source, a double-grating excitation spectrometer to select a central excitation wavelength and its bandwidth, a sample compartment, and an emission spectrometer to spectrally select desired emission to a photomultiplier tube (Hamamatsu P2658P) coupled with single photon-counting electronic circuits.

A relative low photoexcitation level of ˜20 mW cm⁻² was used.

As shown in FIG. 3, the PL intensity of a typical solution-based drop-coated CsSnI₃ film on a glass substrate was about half of the PL intensity taken from a typical thin-film synthesized from thermal evaporator powders by the vacuum- powder based method (as disclosed in U.S. patent application Ser. No. 13,151,243) under the identical excitation and PL collection conditions.

The PL line shape was identical for the solution-based and vacuum-powder based deposition or synthesis methods as displayed in the inset of the FIG. 3. This result strongly suggested that the CsSnI₃ film quality was compatible using two different synthesis methods.

XRD data were used not only to further verify the crystal structure of CsSnI₃ but importantly also to identify the side products when the CsI solution was formed as the end products and mixed with the SnCl₂ solution (as shown in the reaction).

FIG. 4( a) showed the XRD data measured from the same drop-coated CsSnI₃film used for taking the SEM image in FIG. 2.

FIG. 4( b) showed theoretical calculated XRD profile by using a commercial software package CASTEP written by researchers at the Universities of York, Durham, St. Andrews, Cambridge and Rutherford Labs, using orthorhombic crystal structure of CsSnI₃. CASTEP uses density functional theory with a plane wave basis set to calculate the electronic properties of crystalline solids and other materials from first principles.

All the measured peaks were accounted for and sorted into four groups.

The first group consisted of the peaks of 1 to 3 and all others not number-labeled. These peaks were originated from the orthorhombic structure of CsSnI₃ and match the calculated XRD profile, as taught by CASTEP, as shown in FIG. 4(b).

Peaks 1 and 2 reflected the expected XRD features of the Sn—I—Sn bond tilting) (163° in the a- and b-direction, respectively, in reference to the cubic-structure of CsSnI₃.

Peak 3 represented the signature of the Sn—I—Sn bond tilting (170°) in the c-direction in reference to the tetragonal structure of CsSnI₃.

The second group included the peaks of 4 and 5. Those peaks were originated from the residual material CsI.

The peaks of 6 and 7 made up the third group. The peaks of 6 and 7 were originated from CsCl, leading to the unambiguous determination of the chemical reaction as the CsI solution was transferred into the SnCl₂ solution to form CsCl.

Finally, the presence of peaks 8 and 9 made up the fourth group. The peaks 8 and 9 matched Sn (IV) dioxide, SnO₂. It should be mentioned here that the absence of XRD peaks associated with the residual SnCl₂ strongly suggested that the chemical reaction under the ambient conditions resulting in favor of CsSnI₃ formation.

In summary, CsSnI₃ were synthesized using the CsI and SnCl₂ solutions.

A solution-based method, capable of large-scale production, was employed to fabricate CsSnI₃ films at a low cost, especially suitable for solar cell applications. The film polycrystalline quality was characterized by SEM, PL, and XRD data. Those data was verified to be comparable to that of similar thin-films synthesized by the vacuum-powder-based evaporation method.

While the invention has been described in detail and with reference to specific examples and the embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof.

Claims

1. A process of forming CsSnI3 film on a substrate, comprising steps of: (a)providing a substrate;(b)providing homogeneous CsSnI3 solution;(c)drop-coating the homogeneous CsSnI3 solution onto the substrate;(d)heating the substrate after step (c) until the substrate is dry; and(e)forming the CsSnI3film on the substrate.

2. The process of claim 1,wherein the process steps (a) to (c) are performed under ambient condition; a temperature in heating step (d) ranges from about 50° C. to about 90° C.; and the substrate is selected from glass, ceramic, silicon, and metal foils.

3. The process of claim 1, wherein the homogeneous CsSnI3 solution is formed by drop-adding a CsI solution into a SnCl2 solution to form a mixture; and stirring the mixture to form the homogeneous CsSnI3 solution; wherein a ratio of the CsI solution to the SnCl2 solution in the mixture ranges from about 1/10 to about 1/3.

4. The process of claim 3, wherein the CsI solution is about 5 wt % to about 50 wt % CsI solution by fully dissolving CsI powder (99.9% purity) in a solvent; andthe SnCl2 solution is about 5 wt % to about 80 wt % SnCl2 solution by fully dissolving SnCl2 powder (99.9% purity) in a solvent.

5. The process of claim 4, wherein the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of water, deionized water, distilled water and mixtures thereof; andthe solvent for dissolving SnCl2 powder (99.9% purity) is selected from the group consisting of anhydrous alcohol, glacial acetic acid; ethylene glycol or triethylene glycol; and mixtures thereof.

6. The process of claim 4, wherein the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of water, deionized water, distilled water and mixtures thereof; and the CsI solution is about 15 wt % to about 40 wt % CsI solution; andthe solvent for dissolving SnCl2 powder (99.9% purity) is selected from the group consisting of anhydrous ethanol, anhydrous methanol, anhydrous isopropyl and mixtures thereof; and the SnCl2 solution is about 20 wt % to about 50 wt % SnCl2 solution.

7. The process of claim 6, wherein the steps (a) to (c) are performed under ambient condition;a temperature in heating step (d) ranges from about 50° C. to about 90° C.;the substrate is selected from glass, ceramic, silicon, and metal foils;the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of deionized water, distilled water and mixtures thereof; andthe solvent for dissolving SnCl2 powder (99.9% purity) is anhydrous ethanol.

8. A process of forming CsSnI3 on a substrate, comprising steps of: (a)providing a substrate;(b)provide CsI solution;(c)provide SnCl2 solution;(d)drop-adding the CsI solution into the SnCl2 solution to form a mixture;(e)stirring the mixture to make a homogeneous CsSnI3 solution,(f)drop-coating the homogeneous CsSnI3 solution onto the substrate;(g)heating the substrate after step (f) until the substrate is dry; and(h)forming the CsSnI3 film on the substrate.

9. The process of claim 8, wherein the process steps (a) to (f) are performed under ambient condition; a temperature in heating step (g) ranges from about 50° C. to about 90° C.; and the substrate is selected from glass, ceramic, silicon, and metal foils.

10. The process of claim 8, wherein the CsI solution in (b) is about 5 wt % to about 50 wt % CsI solution by fully dissolving CsI powder (99.9% purity) in a solvent;the SnCl2 solution in (c) is about 5 wt % to about 80 wt % SnCl2 solution by fully dissolving SnCl2 powder (99.9% purity) in a solvent; andthe mixture in (d) having a ratio of the CsI solution to the SnCl2 solution ranging from about 1/10 to about 1/3.

11. The process of claim 10, wherein the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of water, deionized water, distilled water and mixtures thereof; andthe solvent for dissolving SnCl2 powder (99.9% purity) is selected from the group consisting of anhydrous alcohol, glacial acetic acid; ethylene glycol or triethylene glycol; and mixtures thereof.

12. The process of claim 10, wherein the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of water, deionized water, distilled water and mixtures thereof; and the CsI solution is about 15 wt % to about 40 wt % CsI solution; andthe solvent for dissolving SnCl2 powder (99.9% purity) is selected from the group consisting of anhydrous ethanol, anhydrous methanol, anhydrous isopropyl and mixtures thereof; and the SnCl2 solution is about 20 wt % to about 50 wt % SnCl2 solution.

13. The process of claim 12, wherein the steps (a) to (f) are performed under ambient condition;a temperature in heating step (g) ranges from about 50° C. to about 90° C.;the substrate is selected from glass, ceramic, silicon, and metal foils;the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of deionized water, distilled water and mixtures thereof; andthe solvent for dissolving SnCl2 powder (99.9% purity) is anhydrous ethanol.

14. A CsSnI3 film synthesized on a substrate by steps of (a)providing a substrate;(b)provide a CsI solution;(c)provide a SnCl2 solution;(d)drop-adding the CsI solution into the SnCl2 solution to form a mixture;(e)stirring the mixture to make a homogeneous CsSnI3 solution,(f)drop-coating the homogeneous CsSnI3 solution onto the substrate;(g)heating the substrate after step (f) until the substrate is dry; and(h)forming the CsSnI3 film on the substrate.

15. The CsSnI3 film of claim 14, wherein the steps (a) to (f) are performed under ambient condition; a temperature in heating step (g) ranges from about 50° C. to about 90° C.; and the substrate is selected from glass, ceramic, silicon, and metal foils.

16. The CsSnI3 film of claim 14, wherein the CsI solution in (b) is about 5 wt % to about 50 wt % CsI solution by fully dissolving CsI powder (99.9% purity) in a solvent; andthe SnCl2 solution in (c) is about 5 wt % to about 80 wt % SnCl2 solution by fully dissolving SnCl2 powder (99.9% purity) in a solvent; andthe mixture in (d) having a ratio of the CsI solution to the SnCl2 solution ranging from about 1/10 to about 1/3.

17. The CsSnI3 film of claim 16, wherein the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of water, deionized water, distilled water and mixtures thereof; andthe solvent for dissolving SnCl2 powder (99.9% purity) is selected from the group consisting of anhydrous alcohol, glacial acetic acid; ethylene glycol or triethylene glycol; and mixtures thereof.

18. The CsSnI3 film of claim 16, wherein the solvent for dissolving CsI powder (99.9% purity) is selected from the group consisting of water, deionized water, distilled water and mixtures thereof; and the CsI solution is about 15 wt % to about 40 wt % CsI solution; andthe solvent for dissolving SnCl2 powder (99.9% purity) is selected from the group consisting of anhydrous ethanol, anhydrous methanol, anhydrous isopropyl and mixtures thereof; and the SnCl2 solution is about 20 wt % to about 50 wt % SnCl2 solution.

19. The CsSnI3 film of claim 14, wherein the substrate is selected from glass, ceramic, and silicon, and metal foils;the CsI solution in (b) is about 15 wt % to about 40 wt % CsI solution by fully dissolving CsI powder (99.9% purity) in a solvent selected from the group consisting of deionized water, distilled water and mixtures thereof;;the SnCl2 solution in (c) is about 20 wt % to about 50 wt % SnCl2 solution by fully dissolving SnCl2 powder (99.9% purity) in anhydrous ethanol;the mixture in (d) having a ratio of the CsI solution to the SnCl2 solution ranging from about 1/10 to about 1/3;the steps (a) to (f) are performed under ambient condition; anda temperature in heating step (g) ranges from about 50° C. to about 90° C.