The present embodiments herein relate to a spectroscopy system for imaging to, for example, interrogate defects and unknown substances. More particularly, some embodiments herein relate to a Photoluminescence (PL) and Raman spectroscopy (microscope) system having novel modular interchangeable component and assembly arrangements.
Photoluminescence (PL) and Raman spectroscopy are important techniques for evaluating materials, finding defects, and identifying unknown substances. The present beneficial example PL/Raman microscope system disclosed herein focuses laser light through an objective lens onto a sample. Light emitted by the sample is collected by an optical fiber and delivered to a spectrometer. A light emitting diode (LED) and camera are also provided for widefield imaging required for basic sample inspection and identifying regions of interest.
In a first aspect, the invention herein is directed to a Photoluminescence (PL) and Raman spectroscopy (microscope) system having novel modular interchangeable component and assembly arrangements.
Another beneficial aspect can include a spectroscopic microscope kit that generally includes a laser source; a removably coupled module for the laser source; a filter assembly for filtering a source emission; a main body for directing optical information of the spectroscopic microscope, wherein the main body includes a removable objective lens to focus the laser source onto a sample and collect light emitted from the sample and a removable dichroic module to reflect the laser onto the sample and transmit emitted light to the filter assembly, and dichroic module; a removable long pass module to reject the laser source; and a removable fiber assembly to transfer light to the spectroscopic microscope.
A beneficial microscope embodiment, as disclosed herein and as generally shown in
The main body 14 with all of the attached components can be positioned in a housing 30 so as to scan on inspect a sample on a stage 32. With reference to
With reference to
As will be discussed in more detail below, one or more modules (e.g., LED, laser, notch filter, dichroic, and long pass) or other components may be configured as a kit for specific scanning applications. An important feature of the invention is that the modular design allows for the microscope main body 14 to be reconfigured, by for example, selecting a laser module 18 of a specific wavelength, a long pass filter module 26 to allow only specific wavelengths to pass, and a specific dichroic mirror module 24 for reflecting and/or allowing to pass only specific wavelengths of light. Other exemplary kits may pair specific LED modules 10 with specific laser modules 18 for specific applications.
An electromagnetic source, such as, for example, a light emitting diode (LED) or often a laser diode is the light source used for widefield images captured by the camera assembly 16. The LED is changeable to allow flexibility in the choice of illumination type and wavelength so as to often but not necessarily provide hyperspectral interrogation/analysis (see
Color LEDs are most often used for visual inspection and are typically chosen so that they have a slightly shorter wavelength than the laser that is used for excitation during scanning. For example, at 385 nm LED may used in conjunction with a 405 nm laser. With this example, and with reference back to
The filter assembly 12 in
Plate beam-splitters are supplied as a module on a metal carrier to ensure proper and repeatable alignment.
With reference to
The quick release tilt plates are removably coupled (e.g., screws see set screw location 62) and often with resiliency components (e.g., springs) to allow fine adjustment to the position of the laser and centering of the wide field image (e.g., by selectively tightening and loosening the screws if such is the arrangement). A set screw can be utilized in the quick release tilt plates to also allow easy removal of the laser module 18 and the camera module 16 while mostly preserving the alignment of the microscope.
The camera assembly 16 serves a dual purpose. First it is a means of viewing the sample. Second, it provides the feedback needed for the autofocus algorithm to properly focus the excitation on the sample. The camera system is designed to work in conjunction with filtering arrangements that often includes a notch filter module 20, which reduces the intensity of laser light. If needed, the end of the camera lens tube can accommodate additional lens tubes for filters 68.
The laser module 18, shown in
The notch filter module 20, shown in
With reference to
A dichroic mirror reflects light with a shorter wavelength than the designed cutoff wavelength and passes light that has a longer wavelength than the cutoff. Thus, the dichroic reflects the excitation source and transmits the longer-wavelength signal light. The dichroic mirror is mounted in a keyed housing and this whole part is referred to as the dichroic module 24 (see
The dichroic mirror of the dichroic module 24 can be replaced with, for example, a beam-splitter for reflectance measurements. Typically, this is done with a beam-splitter, often a 50/50 beam-splitter, which means that half the light incident on the beamsplitter is directed downward and half goes through it regardless of the wavelength.
With reference to
An optical fiber is connected to the spectrometer (not shown) and fiber assembly 28 (see
The fiber assembly 20 attaches to the top of the microscope main body 14 at the second portion 42 of the microscope main body. From top to bottom it is comprised of an SMA fiber coupling 84, a Z adjust 86, an X-Y adjust 88, and lens tube 90. The Z adjust 86 rotates to change the spacing from the lens to the multimode fiber without rotating the fiber, while the X-Y adjust 88 allows the focused light to be incident on the core of the fiber. The lens tube 90 contains a focusing achromatic lens, which focuses the signal light onto the fiber.
The lens tube 90 at the bottom of the fiber module can be arranged to slide into the bore of the main body at second portion 42, while cage rods (e.g., 30 mm rods) guide it into precise position. Fasteners 92 (e.g., set screws) secure the cage rods to the module for a desired placement. Additional optics 94, such as other filters or a polarizer, can be attached below the lens. The module supports direct attachment of SM1 threaded lens tubes (such as Thorlabs® part number SM1L05 or SM1L03).
A collection of modules or other components is referred to as a “kit.” Kits can add additional capabilities such as different excitation wavelengths, Raman spectroscopy, and reflectance spectroscopy. Replaceable optics are pre-set and mostly self-aligning, and so do not require user modification or maintenance.
Wavelength kits are provided for particular wavelengths or applications. All kits may be color-coded and marked so the user can tell at a glance which kit is installed and if all parts are installed.
Examples 1-4, focus on the laser, dichroic mirror, and long-pass filter. The other components of an exemplary kit include the beamsplitters, fiber module LED, and notch filter. Beamsplitters come in overlapping UV, visible, and NIR spectral ranges. The beamsplitters and fiber module must be suitable for the laser wavelength. The LED has a wavelength shorter than the laser and is included for wide-field sample inspection. The notch filter blocks the specific wavelength of the laser from reaching the camera.
Gallium oxide (Ga2O3) is a semiconductor that is being researched for applications in high-power electronics. To investigate the photoluminescence (PL) of this material, a UV kit according to an embodiment of this invention was used. This kit consisted of a 355 nm laser, 355 nm dichroic mirror (which reflected the laser light into the objective and transmitted the longer-wavelength PL), and 355 nm long-pass filter (which transmitted wavelengths >355 nm). The PL map showed certain regions on the sample surface that had bright emissions near 375 nm. Alternative embodiments of this kit include a 349 nm to 405 nm laser, a 349 nm to 405 nm dichroic mirror, and a 349 nm to 405 nm long-pass filter.
To investigate these bright emitters further, the UV kit was swapped for a Raman kit according to another embodiment of this invention. This kit consists of a 532 nm laser, 532 nm dichroic mirror, and 532 nm long-pass filter. The peaks in the spectrum correspond to vibrational modes of the material. It was found that, in the bright emitter regions, specific vibrational modes were observed. The frequencies of these modes indicated that the bright emitters were a chemical compound consisting of silicon, carbon, and hydrogen, rather than the Ga2O3 itself. The chemical compound likely came from the polishing compound that was used to fabricate the smooth surfaces of the sample.
The UV kit and Raman Kit are basically the three components two of which fit within slots in the main body (i.e., the dichroic module (see
Indium phosphide (InP) wafers are frequently used as substrates for the growth of infrared laser and LED heterostructures. Wafers are commercially available and may easily be obtained in large quantity for production. Defects in substrates are generally specified as a dislocation density, but the inhomogeneity of their distribution and the range of sizes is not known from one wafer to the next. When growing a new device on such a wafer, it is imperative to understand how the substrate defects affect the heterojunctions above them that comprise the active layers of the device. At a minimum, the quality of the wafers should be measurable in order to determine whether they are of sufficient quality to be used in the production of reliable devices with near-zero latent defects.
A square 10 mm commercial InP wafer was obtained. To investigate defects in this material, a red kit according to another embodiment of the invention was used. This kit has a 635 nm laser, 635 nm dichroic mirror, and 635 nm long-pass filter. Scanning the wafer, dislocations were identified via a decrease in PL intensity and shift in the PL wavelength. The defect density agreed with that specified by the supplier (˜50,000/sq.cm).
By alloying with different elements, InP-based semiconductors can be made to emit light in the important telecommunication wavelength range around 1300 nm. To investigate such materials, a NIR Kit according to a further embodiment of this invention was used. This consists of a 940 or 975 nm laser, matching dichroic mirror, and long-pass filter. To acquire the PL emission, a spectrometer with an InGaAs detector array is used, which has a useful spectral range of 900-1700 nm. Defects in a device are evident by a change in PL intensity and/or a shift in PL wavelength.
Some semiconductors have a bandgap that is “ultra-wide.” An important example is aluminum gallium nitride (AlGaN), which has applications in UV LEDs that can be used for sterilization. For these materials, a high photon energy (short wavelength) is required to generate PL. To address this need, a deep UV kit according to another embodiment of this invention was used. The deep UV kit consists of a 266 nm laser, 266 nm dichroic mirror, and 266 nm long-pass filter. It also has a UV-enhanced camera that can detect wavelengths in the deep UV (˜266 nm) range. The UV camera is required for sample inspection, so the user knows where data is being collected from.
A reflectivity spectrum shows how much light is reflected from a sample, as a function of wavelength. An exemplary reflectivity kit according to an embodiment of the invention consists of a white LED and a glass (or similar) beamsplitter that reflects a portion of the LED light and transmits the reflected light from the sample. No long-pass filter is required. The reflected spectrum is compared to a reference; for example, a highly reflecting mirror. The reflectivity is defined as R=Isample/Ireference, where I is the signal intensity. Low reflectivity means that the sample is absorbing in the given spectral region. This kit can be used on any type of material. The reflectivity kit has been successfully used to scan a $100 bill.
It is also to be noted that the configurations herein are often coupled to a computer /processor (not shown) and can include any known in the art computing device. Example computing devices, as disclosed herein, often includes incorporated individual software modules, components, and the routines utilized may be a computer program, procedure, or process written as source code in C, C#, C++, Java, and/or other suitable programming languages. Image processing and data analysis often incorporated and done in MATLAB® and Origin®. The computer programs, procedures, or processes may be compiled into intermediate, object or machine code and presented for execution by any of the example suitable computing devices discussed above. Various implementations of the source, intermediate, and/or object code and associated data may be stored in one or more computer readable storage media that include read-only memory, random-access memory, magnetic disk storage media, optical storage media, flash memory devices, and/or other suitable media. A computer-readable medium, in accordance with aspects of the present invention, refers to media known and understood by those of ordinary skill in the art, which have encoded information provided in a form that can be read (i.e., scanned/sensed) by a machine/computer/processor and interpreted by the machine's/computer's/processor's hardware and/or software. It is also to be appreciated that as used herein, the term “computer readable storage medium” excludes propagated signals, per se.
It is also to be noted that the system itself can be configured with a communication interface (not shown) that includes a wireless transmitter/receiver unit to transmit signals from, for example, the processor to other devices (e.g., a network, and/or via a direct connection to another device), and to receive signals from other devices and communicate the received signals back to processor.
A display of any data can include an electronic display (e.g., including a flat panel display element such as a liquid crystal display element, an organic light-emitting diode display element, an electrophoretic display element, or another type of display element) of any location coordinates and/or physiological measurements provided by the catheter. Moreover, such a display can also include via a graphical user interface (GUI) to aid the user in orchestrating the manipulation and detection any information gathered.
Moreover, various methods and protocols for sending commands to and receiving signals from the microscope system can include USB, serial, parallel, FireWire and other conventional and proprietary peripheral device connections. In addition, some or all of the separate modules can be communicatively connected and controlled via the utilized software/ processor through connections external to the mechanical connection points and all connections (communication lines, power, etc.) can be any suitable electrical contact connections or wired connections.
It is to be understood that features described with regard to the various embodiments herein may be mixed and matched in any combination without departing from the spirit and scope of the invention. Although different selected embodiments have been illustrated and described in detail, it is to be appreciated that they are exemplary, and that a variety of substitutions and alterations are possible without departing from the spirit and scope of the present invention.
This application claims priority to U.S. Ser. No. 63/213,895 filed on Jun. 23, 2021, and the complete contents thereof is herein incorporated by reference.
Number | Date | Country | |
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63213895 | Jun 2021 | US |