The present invention relates generally to a precision apparatus including a stage assembly having a stage capable of increased vertical movement.
Precision assemblies such as exposure apparatuses are commonly used to transfer images from a reticle onto a semiconductor wafer during semiconductor processing. A typical exposure apparatus includes an illumination source, a reticle stage assembly that retains a reticle, an optical assembly, a wafer stage assembly that retains a semiconductor wafer, a measurement system, and a control system.
In one embodiment, the wafer stage assembly includes a wafer stage that retains the wafer, and a wafer mover assembly that precisely positions the wafer stage and the wafer. Somewhat similarly, the reticle stage assembly includes a reticle stage that retains the reticle, and a reticle mover assembly that precisely positions the reticle stage and the reticle.
The size of the images and features within the images transferred onto the wafer from the reticle are extremely small. Accordingly, the precise positioning of the wafer and the reticle relative to the optical assembly is critical to the manufacture of high density, semiconductor wafers. Recently, one or more E/I core type actuators have been used in the wafer stage assembly and/or the reticle stage assembly. E/I core type actuators can include a somewhat “E”shaped electromagnet and an “I”shaped target that is spaced apart a relatively small gap from the electromagnet. Each electromagnet has an electrical coil wound around the center section. Current directed through the coil creates an electromagnetic field that attracts the target toward the electromagnet, effectively decreasing the gap between the electromagnet and the target. Although the amount of current is an important factor in determining the force of attraction, a larger gap between the electromagnet and the target requires a greater amount of current to generate the same attractive force. Additionally, a greater amount of current typically results in more heat being generated during actuation.
The force generated by each E/I core actuator can be used to move a device along and/or about an X axis, a Y axis and/or a Z axis. For example, in an exposure apparatus, the control system can direct current to the electromagnets to control the position of a stage.
Unfortunately, the stroke of the E/I core actuator can be limited. One attempt to increase the travel of the E/I core actuator includes enlarging the gap between the electromagnet and the target. However, the enlarged gap requires a greater level of current, which typically results in an increase in heat of the system. Further, an enlarged gap can require a significant increase in power consumption, i.e. a reduction in the force per amp efficiency of the stage assembly.
In light of the above, there is a need for a stage assembly for a precision assembly, including a stage having an increased vertical stroke component about the X axis, about the Y axis and/or along the Z axis that does not significantly cause an increase in heat or excessive power consumption.
The present invention is directed to a stage assembly that includes a first stage, a second stage that supports a device, and a mover assembly that moves the second stage relative to the first stage. The first stage supports the second stage. In one embodiment, the mover assembly includes a support mover and a first mover component that is coupled to the support mover. The support mover moves the first mover component to change a distance between the first mover component and one of the stages. In one embodiment, the first mover component is part of an attraction-only type actuator that moves the second stage with one degree of freedom in a direction that is substantially toward and away from the first stage. Further, the support mover can include a mover motor and a support mover carriage. The mover motor causes at least a portion of the support mover carriage to move in a first direction, which moves the first mover component in a second direction that is different than the first direction.
In another embodiment, the stage assembly includes a stage base having a guide surface, a first stage, a second stage, and a first mover subassembly including a first mover and a second mover that are arranged in series. In this embodiment, the stage base supports the first stage. The first stage moves relative to the stage base. In one embodiment, the movers cooperate to move the second stage relative to the first stage. For example, one of the movers can include an attraction-only type actuator. In one embodiment, the movers cooperate to move the second stage along an axis that is substantially perpendicular to the guide surface. In an alternative embodiment, the movers cooperate to move the second stage with three degrees of freedom relative to the first stage. The stage assembly can also include a second mover subassembly that cooperates with the first mover subassembly to move the second stage with three degrees of freedom relative to the first stage.
Further, the first mover can directly move a portion of the second mover. In another embodiment, the first mover is secured to the first stage and the second mover is secured to the second stage. Moreover, the first mover can move the second stage relative to the second mover. The first mover can also move a portion of the second mover along an axis that is substantially perpendicular to the guide surface, and the second mover can move the second stage along an axis that is substantially perpendicular to the guide surface.
In yet another embodiment, the stage assembly includes a stage base having a guide surface, a device table that supports a device, and a first mover subassembly. The first mover subassembly can include a first mover and a second mover that are positioned in series. The movers cooperate to move the device table along an axis that is substantially perpendicular to the guide surface. With these designs, the stage assembly allows greater movement of the device table, and thus the device, along an axis that is perpendicular to the guide surface of the stage base.
The present invention is also directed to a precision assembly, a device, a wafer, and a method for positioning one or more stages of a stage assembly.
The novel features of this invention, as well as the invention itself, both as to its structure and its operation, will be best understood from the accompanying drawings, taken in conjunction with the accompanying description, in which similar reference characters refer to similar parts, and in which:
A number of Figures include an orientation system that illustrates an X axis, a Y axis that is orthogonal to the X axis and a Z axis that is orthogonal to the X and Y axes. These axes can also be referred to as a first axis, a second axis and a third axis.
The precision assembly 10 can be particularly useful as an exposure apparatus. An exposure apparatus can be used as a lithographic device that transfers a pattern (not shown) of an integrated circuit from a reticle 26 onto a semiconductor wafer 28. The precision assembly 10 mounts to a mounting base 30, e.g., the ground, a base, or floor or some other supporting structure.
There are a number of different types of lithographic devices. For example, the precision assembly 10 can be used as scanning type photolithography system that exposes the pattern from the reticle 26 onto the wafer 28 with the reticle 26 and the wafer 28 moving synchronously. In a scanning type lithographic device, the reticle 26 is moved perpendicularly to an optical axis of the optical assembly 16 by the reticle stage assembly 24, and the wafer 28 is moved perpendicularly to the optical axis of the optical assembly 16 by the wafer stage assembly 24. Scanning of the reticle 26 and the wafer 28 occurs while the reticle 26 and the wafer 28 are moving synchronously.
Alternatively, the precision assembly 10 can be a step-and-repeat type photolithography system that exposes the reticle 26 while the reticle 26 and the wafer 28 are stationary. In the step and repeat process, the wafer 28 is in a substantially constant position relative to the reticle 26 and the optical assembly 16 during the exposure of an individual field. Subsequently, between consecutive exposure steps, the wafer 28 is consecutively moved with the wafer stage assembly 24 perpendicularly to the optical axis of the optical assembly 16 so that the next field of the wafer 28 is brought into position relative to the optical assembly 16 and the reticle 26 for exposure. Following this process, the images on the reticle 26 are sequentially exposed onto the fields of the wafer 28 so that the next field of the wafer 28 is brought into position relative to the optical assembly 16 and the reticle 26.
However, the use of the precision assembly 10 provided herein is not limited to a photolithography system for semiconductor manufacturing. The precision assembly 10, for example, can be used as an LCD photolithography system that exposes a liquid crystal display device pattern onto a rectangular glass plate or a photolithography system for manufacturing a thin film magnetic head. Further, the present invention can also be applied to a proximity photolithography system that exposes a mask pattern from a mask to a substrate with the mask located close to the substrate without the use of a lens assembly.
The apparatus frame 12 is rigid and supports the components of the precision assembly 10. The apparatus frame 12 illustrated in
The illumination system 14 includes an illumination source 32 and an illumination optical assembly 34. The illumination source 32 emits a beam (irradiation) of light energy. The illumination optical assembly 34 guides the beam of light energy from the illumination source 32 to the optical assembly 16. The beam illuminates selectively different portions of the reticle 26 and exposes the wafer 28. In
The illumination source 32 can be a g-line source (436 nm), an i-line source (365 nm), a KrF excimer laser (248 nm), an ArF excimer laser (193 nm) or a F2 laser (157 nm). Alternatively, the illumination source 32 can generate charged particle beams such as an x-ray or an electron beam. For instance, in the case where an electron beam is used, thermionic emission type lanthanum hexaboride (LaB6) or tantalum (Ta) can be used as a cathode for an electron gun. Furthermore, in the case where an electron beam is used, the structure could be such that either a mask is used or a pattern can be directly formed on a substrate without the use of a mask.
The optical assembly 16 projects and/or focuses the light passing through the reticle 26 to the wafer 28. Depending upon the design of the precision assembly 10, the optical assembly 16 can magnify or reduce the image illuminated on the reticle 26. The optical assembly 16 need not be limited to a reduction system. It could also be a 1× or a magnification system.
When far ultra-violet rays such as the excimer laser is used, glass materials such as quartz and fluorite that transmit far ultra-violet rays can be used in the optical assembly 16. When the F2 type laser or x-ray is used, the optical assembly 16 can be either catadioptric or refractive (a reticle should also preferably be a reflective type), and when an electron beam is used, electron optics can consist of electron lenses and deflectors. The optical path for the electron beams should be in a vacuum.
Also, with an exposure device that employs vacuum ultra-violet radiation (VUV) of wavelength 200 nm or lower, use of the catadioptric type optical system can be considered. Examples of the catadioptric type of optical system include the disclosure Japan Patent Application Disclosure No. 8-171054 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S. Pat. No, 5,668,672, as well as Japan Patent Application Disclosure No. 10-20195 and its counterpart U.S. Pat. No. 5,835,275. In these cases, the reflecting optical device can be a catadioptric optical system incorporating a beam splitter and concave mirror. Japan Patent Application Disclosure No. 8-334695 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S. Pat. No. 5,689,377 as well as Japan Patent Application Disclosure No. 10-3039 and its counterpart U.S. patent application No. 873,605 (Application Date: Jun. 12, 1997) also use a reflecting-refracting type of optical system incorporating a concave mirror, etc., but without a beam splitter, and can also be employed with this invention. As far as is permitted, the disclosures in the above-mentioned U.S. patents, as well as the Japan patent applications published in the Official Gazette for Laid-Open Patent Applications are incorporated herein by reference.
The reticle stage assembly 22 holds and positions the reticle 26 relative to the optical assembly 16 and the wafer 28. Somewhat similarly, the wafer stage assembly 24 holds and positions the wafer 28 with respect to the projected image of the illuminated portions of the reticle 26. The stage assemblies 22, 24 are described in more detail below.
In photolithography systems, when linear motors (see U.S. Pat. Nos. 5,623,853 or 5,528,118) are used in a reticle stage assembly 22 or a wafer stage assembly 24, the linear motors can be either an air levitation type employing air bearings or a magnetic levitation type using Lorentz force or reactance force. Additionally, the stage can move along a guide, or it can be a guideless type of stage. As far as is permitted, the disclosures in U.S. Pat. Nos. 5,623,853 and 5,528,118 are incorporated herein by reference.
Alternatively, the reticle stage and/or the wafer stage could be driven by a planar motor. The planar motor drives the stage by an electromagnetic force generated by a magnet unit having two-dimensionally arranged magnets and an armature coil unit having two-dimensionally arranged coils in facing positions. With this type of driving system, either the magnet unit or the armature coil unit is connected to the stage and the other unit is mounted on the moving plane side of the stage.
Movement of the stages as described above generates reaction forces that can affect performance of the photolithography system. Reaction forces generated by motion of the wafer stage can be mechanically transferred to the floor (ground) by use of a frame member as described in U.S. Pat. No. 5,528,100 and published Japanese Patent Application Disclosure No. 8-136475. Additionally, reaction forces generated by motion of the reticle stage can be mechanically transferred to the floor (ground) by use of a frame member as described in U.S. Pat. No. 5,874,820 and published Japanese Patent Application Disclosure No. 8-330224. As far as is permitted, the disclosures in U.S. Pat. Nos. 5,528,100 and 5,874,820 and Japanese Patent Application Disclosure No. 8-330224 are incorporated herein by reference.
The control system 18 receives position information from the measurement system 19 and uses this position information to control one or both of the stage assemblies 22, 24 to precisely position the reticle 26 and/or the wafer 28.
The measurement system 19 can monitor the position and movement of portions of the reticle stage assembly 22, the wafer stage assembly 24, the reticle 26 and/or the wafer 28 relative to the optical assembly 16 or some other reference, as provided in greater detail below. This information is provided to the control system 18 to allow the control system to control the reticle stage assembly 22 to precisely position the reticle 26, and/or the wafer stage assembly 24 to precisely position the wafer 28. For example, the measurement system 19 can utilize multiple laser interferometers, encoders, sensors and/or other measuring devices.
A photolithography system (an exposure apparatus) according to the embodiments described herein can be built by assembling various subsystems, including each element listed in the appended claims, in such a manner that prescribed mechanical accuracy, electrical accuracy, and optical accuracy are maintained. In order to maintain the various accuracies, prior to and following assembly, every optical system is adjusted to achieve its optical accuracy. Similarly, every mechanical system and every electrical system are adjusted to achieve their respective mechanical and electrical accuracies. The process of assembling each subsystem into a photolithography system includes mechanical interfaces, electrical circuit wiring connections and air pressure plumbing connections between each subsystem. Needless to say, there is also a process where each subsystem is assembled prior to assembling a photolithography system from the various subsystems. Once a photolithography system is assembled using the various subsystems,.a total adjustment is performed to make sure that accuracy is maintained in the complete photolithography system. Additionally, it is desirable to manufacture an exposure system in a clean room where the temperature and cleanliness are controlled.
In the embodiment illustrated in
In
The first stage 206 can be generally rectangular and plate shaped, as illustrated in
The design of the first stage mover assembly 204 can be varied to suit the movement requirements of the stage assembly 220. In one embodiment, the first stage mover assembly 204 includes one or more movers, such as rotary motors, voice coil motors, linear motors utilizing a Lorentz force to generate drive force, electromagnetic actuators, planar motors, or some other force actuators.
In
In the embodiment illustrated in
The first mover subassembly 212 can be maintained above the second mover subassembly 214 with vacuum pre-load type air bearings (not shown). With this design, the first stage 206 can be movable relative to the stage base 202 at least along the planar degrees of freedom. Alternatively, the first mover subassembly 212 could be supported above the second mover subassembly 214 by other ways, such as guides, a rolling type bearing, or by magnetic and/or electromagnetic levitation forces. With these designs, the first stage mover assembly 204 can be movable with up to six degrees of freedom.
The control system 218 directs electrical current to one or more of the conductors in the conductor array. The electrical current through the conductors causes the conductors to interact with the magnetic field of the magnet array. This generates a force between the magnet array and the conductor array that can be used to control, move, and position the first mover subassembly 212 and the first stage 206 relative to the second mover subassembly 214 and the stage base 202. The control system 218 adjusts and controls the current level for each conductor to achieve the desired resultant forces. Stated another way, the control system 218 directs current to the conductor array to position the first stage 206 relative to the stage base 202.
Alternatively, for example, the first stage mover assembly 204 can include other types of movers, such as a linear motor, a voice coil motor and/or electromagnetic actuators somewhat similar to the actuators utilized to move the second stage 208.
The second stage 208 includes a device holder (not shown) that retains the device 200. The device holder can include a vacuum chuck, an electrostatic chuck, or some other type of clamp.
The second stage mover assembly 210 moves and adjusts the position of the second stage 208 relative to the first stage 206. For example, the second stage mover assembly 210 can adjust the position of the second stage 208 with six degrees of freedom. Alternatively, for example, the second stage mover assembly 210 can be designed to move the second stage 208 with less than six degrees of freedom. In one embodiment, the second stage mover assembly 210 includes one or more electromagnetic actuators 232. The second stage mover assembly 210 can also include one or more rotary motors, voice coil motors, linear motors, planar motors or other type of actuators.
In the embodiment illustrated in
The design of each vertical mover subassembly 216 can vary. For example, as illustrated in
At least one of the movers 231, 232 can include a first mover component 222 and a second mover component 224. In the embodiment illustrated in
Moreover, in the embodiment illustrated in
In the embodiment illustrated in
In
The control system 218 directs current to the vertical mover subassemblies 216 and/or horizontal mover subassemblies 217 to position the second stage 208 relative to the first stage 206.
The combination of the first mover component 222 and the conductor 234 is sometimes referred to herein as an electromagnet, while the second mover component 224 is sometimes referred to herein as a target. As an example, the electromagnets can be mounted to the component support 226 (illustrated in
Alternatively, the second mover components 224 can be integrally formed into the second stage 208. Moreover, the configuration of the E/I core actuators 232 can be reversed and each second mover component 224 can be the secured to a separate component support 226 and each first mover component 222 can be secured to the second stage 208. Alternatively, for example, the electromagnetic actuator can have a “C”shaped core instead of an “E”shaped core. Still alternatively, the electromagnetic actuator can have a core with a different configuration.
The control system 218 (illustrated in
In this embodiment, a measurement system 219 includes one or more sensors 236 that measure the gap distance between the first mover component 222 and the second mover component 224 for each electromagnetic actuator 232. The positioning of the sensors 236 and the specific location being measured can vary. A suitable sensor 236, for example, can include a capacitor sensor. However, any other appropriate sensor can be used.
Assuming the first mover component 222 remains a substantially fixed distance from the first stage 206 (illustrated in
As illustrated in
In
Each horizontal mover subassembly 217 can include an actuator pair 230 comprising two electromagnetic actuators 232. Alternatively, for example, one or more of the horizontal mover subassemblies 217 can include a voice coil motor or another type of motor or actuator. Depending upon the orientation of the horizontal mover subassemblies 217, the second stage 208 can be moved along the X axis, along the Y axis and/or about the Z axis relative to the first stage 206.
Each vertical mover subassembly 216 can include an attraction-only type actuator 232. The attraction-only type actuator 232 can lift the second stage 208 relative to the first stage 206, against the force of gravity, which urges the second stage 208 down toward the first stage 206 along the Z axis. Alternatively, for example, an actuator pair 230 (illustrated in
Additionally, each of the vertical mover subassemblies 216 illustrated in
In the embodiment illustrated in
The design of the component support 226 can vary. For example, as illustrated in
The support mover 228 moves the component support 226, and thus, the first mover component 222, in a direction that is substantially parallel to the Z axis. The design of the support mover 228 can vary. For example, the support mover 228 can include one or more rotary motors, voice coil motors, linear motors utilizing a Lorentz force to generate drive force, electromagnetic actuators, planar motors, or some other force actuators. In the embodiment illustrated in
The support mover carriage 240 can have a somewhat angled, mover surface 242 that can contact the support surface 238 of the component support 226. Movement of the mover surface 242 against the support surface 238 of the component support 226 can result in vertical movement along the Z axis of the component support 226 relative to the first stage 206.
The support surface 238 can be preloaded to contact the mover surface 242. Although the support surface 238 and the mover surface 242 are illustrated in
In an alternative embodiment, the sum of the angles of the support surface 238 and the mover surface 242 relative to the top surface of the first stage 206 can range between approximately 5 degrees and 175 degrees. For example, in alternative embodiments, the sum of the angles of the support surface 238 and the mover surface 242 relative to the top surface of the first stage 206 can be approximately 45 degrees, 60 degrees, 75 degrees, 90 degrees, 105 degrees, 120 degrees or 135 degrees. Still alternatively, the sum of the angles can be greater or less than the stated amounts. In yet another alternative embodiment, the sum of the angles is approximately zero degrees.
The support mover motor 244 causes the lead screw 246 to rotate, which in turn results in movement of the support mover carriage 240 substantially along the X axis. The support mover motor 244 can be secured to the first stage 206 as illustrated in
The support guides 227 position and support the component support 226 and the support mover 228. The support guides 227 are positioned within the stage apertures 229, and can include one or more bushings or vacuum pre-load type air bearings (not shown), as examples. With this design, the support guides 227 allow motion of the component support 226 relative to the first stage 206 substantially along the Z axis, and/or motion of the support mover carriage 240 of the support mover 228 in a direction that is substantially parallel to the X-Y plane, e.g. perpendicular to the Z axis. Alternatively, the component supports 226 and/or the support movers 228 could be supported by other ways, such as a rolling type bearing, or by magnetic and/or electromagnetic levitation forces.
The control system 218 directs current to the support mover 228 and one of the mover components 222, 224 to adjust the position of the second stage 208 along the Z axis. The current necessary to maintain a substantially constant force of attraction between the mover components 222, 224 increases significantly with an increase in distance between the mover components 222, 224. It is therefore desirable to maintain a relatively small distance between the mover components 222, 224 to decrease power consumption and the generation of excessive heat.
At a given attractive force between the first mover component 222 and the second mover component 224, the second mover component 224 is positioned a gap distance G1 from the first mover component 222, which can generally be in the range of between approximately 0 and 500 micrometers. However, the second stage mover assembly 210 can maintain the gap distance G1 toward the lower end of this range, thereby requiring a decreased current to the first mover component 222, resulting in lower power consumption and a decrease in the generation of heat. The electromagnet actuators 232 illustrated in
In
In the embodiment illustrated in
As a result of the positioning of the first mover component 222, in conjunction with the attractive force between the mover components 222, 224, the second mover component 224 is positioned a second mover component distance D2, from the first stage 206, which can vary depending upon the amount of the attractive force between the mover components 222, 224.
The second stage mover assembly 210 provided herein allows the mover components 222, 224 to remain relatively close together, without unduly limiting the stroke of the second stage 208 in a direction along the Z axis, or rotation about the X axis and/or about the Y axis. Thus, the attractive force between the mover components 222, 224 can continue to finely control the vertical positioning of the second stage 208 regardless of the distance between the second stage 208 and the first stage 206.
In
Moreover, by using two movers 231, 232 in series, one of the movers, e.g. the first mover 231, can be utilized as a coarse mover which can move the second stage 208 a relatively large vertical distance along the Z axis, while the second mover 232 can be used as a fine mover that moves the second stage 208 relatively small distances along the Z axis.
In this embodiment, the second position represents an upper end of the total vertical stroke of the first mover component 222. To reach the second position, the mover surface 242 movably contacts the support surface 238, causing an upward force on the component support 226 that raises the component support 226 and the first mover component 222 relative to the first stage 206.
Each of the first mover components 222 illustrated in
In the second position, the second mover component 224 can be maintained a gap distance G2 from the first mover component 222, which can generally be in the range of between approximately 0 and 500 micrometers or greater. Stated another way, regardless of vertical movement of the first mover component 222, the second mover component 224 can be controlled by the extent of the attractive force between the mover components 222, 224. In the embodiment illustrated in
Additionally, in the second position, the conductor of the first mover component 222 is positioned a first mover component distance D12 from the first stage 206, which can vary depending upon the design requirements of the second stage mover assembly 210. In the examples provided herein, D12>D11.
As a result of the positioning of the first mover component 222, in conjunction with the attractive force between the mover components 222, 224, the second mover component 224 is positioned a second mover component distance D22 from the first stage 206, which can vary depending upon the amount of the attractive force between the mover components 222, 224. In the example provided herein, D22>D21.
As used herein, the third position represents a lower end of the total vertical stroke of the first mover component 222. To reach the third position, the mover surface 242 moves towards the support mover motor 244, allowing the force of gravity to move the component support 226 substantially downward toward the stage base along the Z axis. This movement of the component support 226 lowers the first mover component 222 relative to the first stage 206 along the Z axis.
Each of the first mover components 222 illustrated in
In the third position, the second mover component 224 can be maintained a gap distance G3 from the first mover component 222, which can generally be in the range of between approximately 0 and 500 micrometers. Stated another way, regardless of vertical movement of the first mover component 222, the second mover component 224 can be controlled by the extent of the attractive force between the mover components 222, 224. In the embodiment illustrated in
Additionally, in the third position, the conductor of the first mover component 222 is positioned a first mover component distance D13 from the first stage 206, which can vary depending upon the design requirements of the second stage mover assembly 210. In the examples provided herein, D13<D11.
As a result of the positioning of the first mover component 222, in conjunction with the attractive force between the mover components 222, 224, the second mover component 224 is positioned a second mover component distance D23 from the first stage 206, which can vary depending upon the amount of the attractive force between the mover components 222, 224. In the example provided herein, D23<D21.
Moreover, the support mover 228 can be used to adjust the gap distance G1 in the event the gap distance G1 is approaching the outer limits of the usable range of movement. For example, if the gap distance G1 is near 500 micrometers (or any other applicable range limits), the support mover 228 can lower the component support 226, and thus the first mover component 222, toward the second mover component 224 to decrease the gap distance G1 without adversely impacting the position of the second stage 208 relative to the first stage 206. On the other hand, the gap distance G1 can be increased using the support mover 228 in instances when the gap distance G1 has become too small.
Further, the first, second and third positions illustrated in the Figures are merely representative of three positions of one of the first mover components 222 along a continuum of movement. In other words, there can be any number of positions between the second position and the third position for each of the first mover components 222.
In one embodiment, the measurement system 19 (illustrated in
In
The corrected CG signal is transformed to a value of force to be generated by the electromagnetic actuators of the vertical mover subassemblies s256. The force to be generated s256 and the gap distance (measured by E/I core gap sensors illustrated by arrow s258) for each vertical mover are then used during El commutation s260 to determine the current to be directed to the vertical mover subassemblies. The gap distances are measured by E/I core gap sensors s258, which can include one or more encoders, for example. The current is then directed to the vertical mover subassemblies and the vertical mover subassemblies move the second stage s262. The movement of the second stage is measured s250 and the sensor vector signal S is fed back and compared to the trajectory s248 and the cycle is repeated.
Additionally, one or more EI core gap sensors s258 feed information regarding the gap distances to the support mover sensor for coordinate transformation s264. This transforms the gap distances to a value of force to be generated by the support mover for moving the support mover carriage, and thus the component support and the first mover component. The control law s266 prescribes the current to be directed to the support mover s268. The control law s266 may be in the form of a PID (proportional integral derivative) controller, proportional gain controller or a lead-lag filter, or other commonly known law in the art of control. The current is directed to the support mover s268, and the support mover is positioned s270. The position of one or more components of the support mover is monitored by the support mover sensor s272 and can be continually fed back prior to applying the control law s266.
In the embodiment illustrated in
Alternatively, the voice coil motors 374 can be used to preload the second stage 308, while the E/I core actuator(s) 374 can be utilized to precisely position the second stage 308 along the Z axis, about the X axis and/or about the Y axis.
In the embodiment illustrated in
In the embodiment illustrated in
As a result of the positioning of the first mover component 322, in conjunction with the attractive force between the mover components 322, 324, the second mover component 324 is positioned a second mover component distance D21 from the first stage 306, which can vary depending upon the amount of the attractive force between the mover components 322, 324.
The second stage mover assembly 310 provided herein allows the mover components 322, 324 to remain relatively close together, without unduly limiting the stroke of the second stage 308 in a direction along the Z axis, or rotation about the X axis and/or about the Y axis. Thus, the attractive force between the mover components 322, 324 can continue to finely control the vertical positioning of the second stage 308 regardless of the distance between the second stage 308 and the first stage 306.
As used herein, the second position represents an upper end of the total vertical stroke of the first mover component 322. To reach the second position, the mover surface 342 movably contacts the support surface 338, causing an upward force on the component support 326 that raises the component support 326 and the first mover component 322 relative to the first stage 306.
As a result of the positioning of the first mover component 322, in conjunction with the attractive force between the mover components 322, 324, the second mover component 324 is positioned a second mover component distance D22 from the first stage 306, which can vary depending upon the amount of the attractive force between the mover components 322, 324. In the example provided herein, D22>D21.
As used herein, the third position represents a lower end of the total vertical stroke of the first mover component 322. To reach the third position, the mover surface 342 moves towards the support mover motor 344, allowing the force of gravity to move the component support 326 substantially downward toward the stage base 302 along the Z axis. This movement of the component support 326 lowers the first mover component 322 relative to the first stage 306 along the Z axis.
As a result of the positioning of the first mover component 322, in conjunction with the attractive force between the mover components 322, 324, the second mover component 324 is positioned a second mover component distance D23 from the first stage 306, which can vary depending upon the amount of the attractive force between the mover components 322, 324. In the example provided herein, D23<D21.
In
The corrective action as determined by the control law s352 is converted through coordinate transformation to the force required by the voice coil motors to vertically move the first stage as required s354. This transforms the CG signal to a current that is to be directed to the voice coil motors of the vertical mover subassemblies s356. The current is then subject to a high-pass filter s357 which can attenuate the low-frequency influence on the second stage. The current is then directed to the vertical mover subassemblies and the vertical mover subassemblies move the second stage s358 to a second stage actual position s359. The movement of the second stage is measured s360 and the sensor vector signal S is fed back and compared to the trajectory s348 and the cycle is repeated.
Further, the measurement system includes one or more El core gap sensors that measure the gap distances between the first mover components and corresponding second mover components s362. A signal from one or more of the E/I core gap sensors is compared with a preset EI core gap s364 as prescribed by the control system, and a control law is applied s366. Application of the control law s366 determines the corrective action to be applied to the signal. The control law may be in the form of a PID (proportional integral derivative) controller, proportional gain controller or a lead-lag filter, or other commonly known law in the art of control, for example.
During EI commutation s368, the required force to be applied by one or more of the E/I core actuators to properly position the second stage, or to properly preload the second stage relative to the force of gravity is determined. In one embodiment, the E/I core actuators can be responsible for the low-frequency spectrum of the force acting on the second stage. The control system then determines the amount of current necessary to achieve the required force s370. The current can also be subject to a low-pass filter s372. By adding a low-pass filter s372 to the force output, the effect of the high-frequency force of the E/I core actuators on the second stage can be greatly attenuated. The current is then directed to the E/I core actuators to move the second stage relative to the first stage s373. The measured gap distances s362 are then fed back and compared to the preset El core gap s364. Further, the measured gap distances s362 are fed back s374 for determining the force required to position the second stage.
Additionally, the measured gap distances s362 are transformed by coordinate transformation to a signal indicating the distance that the component support is required to move to properly position the first mover component relative to the second mover component s376. The control law s378 then determines a corrective action to be applied to the signal. The control law s378 may be in the form of a PID (proportional integral derivative) controller, proportional gain controller or a lead-lag filter, or other commonly known law in the art of control, for example.
Following application of the control law s378, the control system determines a force to be generated by the support mover for moving the support mover carriage, and thus the component support and the first mover component, and the appropriate amount of current is determined s380. The current is applied to move the support mover, and thus the component support and the first mover component. The position of one or more components of the support mover is monitored by the support mover sensor s382 and the position can be fed back and compared with the signal indicating the distance that the component support is required to move to properly position the first mover component relative to the second mover component s376.
The stage mover assembly 410 controls and moves the first stage 406 and/or the second stage 408 relative to the stage base 402. For example, the stage mover assembly 410 can move the second stage 408 with three degrees of freedom, less than three degrees of freedom, or six degrees of freedom relative to the stage base 402. The stage mover assembly 410 includes one or more electromagnetic movers 432 (one electromagnetic mover 432 is illustrated in
In
The design of each stage mover 476L, 476R, 480 can be varied to suit the movement requirements of the stage assembly 420. For example, each of the stage movers 476L, 476R, 480 can include one or more rotary motors, voice coil motors, linear motors utilizing a Lorentz force to generate drive force, electromagnetic movers, or some other force movers. In the embodiment illustrated in
The guide bar 478 guides the movement of the first stage 406 along the Y axis. In
In
Further, the first stage 406 is maintained apart from the guide bar 478 with opposed bearings (not shown) that allow for motion of the first stage 406 along the Y axis relative to the guide bar 478, while inhibiting motion of the first stage 406 relative to the guide bar 478 along the X axis and about the Z axis. Each bearing can be a fluid bearing that maintains the first stage 406 spaced apart from the guide bar 478 in a non-contact manner. Alternatively, for example, a magnetic type bearing or a ball bearing type assembly could be utilized that allows for motion of the first stage 406 relative to the guide bar 478.
In the embodiment illustrated in the
In the embodiment illustrated in
Further, in this embodiment, one or more of the first mover components 422U, 422L can be secured to and supported by one or more component supports 426. The second mover component 424 can be secured to one or more second stage supports 482. The second stage supports 482 are coupled to and support the second stage 408 (illustrated in
In addition, the support mover 428 can position the component supports 426 by moving the component supports 426 vertically relative to the first stage (illustrated in
The control system 418 (illustrated in
Movement of the support mover carriage 440 substantially along the Z axis results in movement of the component supports 426 and the first mover components 422U, 422L also substantially along the Z axis. Because movement of the second mover component 424 (illustrated in
By utilizing the support mover 428 to raise and lower the E/I core actuator pair 430 (illustrated in
In this embodiment, the second mover 532 includes an E/I core actuator having a first mover component 522 and a second mover component 524. The first mover component 522 is secured to and supported by a component support 526, which can be fixedly secured to the first stage 506. The second mover component 524 is secured to the first mover 531. With this design, one of the movers 531, 532 can be utilized as a coarse mover that can move the second stage 508 along the Z axis, about the X axis and/or about the Y axis a relatively large distance, and the remaining mover can be used as a fine mover for fine-tuning the position of the second stage 508 along the Z axis, about the. X axis and/or about the Y axis.
Semiconductor devices can be fabricated using the above described systems, by the process shown generally in
At each stage of wafer processing, when the above-mentioned preprocessing steps have been completed, the following post-processing steps are implemented. During post-processing, first, in step 615 (photoresist formation step), photoresist is applied to a wafer. Next, in step 616 (exposure step), the above-mentioned exposure device is used to transfer the circuit pattern of a mask (reticle) to a wafer. Then in step 617 (developing step), the exposed wafer is developed, and in step 618 (etching step), parts other than residual photoresist (exposed material surface) are removed by etching. In step 619 (photoresist removal step), unnecessary photoresist remaining after etching is removed. Multiple circuit patterns are formed by repetition of these preprocessing and post- processing steps.
While the particular stage assembly 220 and precision assembly 10 as shown and disclosed herein is fully capable of obtaining the objects and providing the advantages herein before stated, it is to be understood that it is merely illustrative of the presently preferred embodiments of the invention and that no limitations are intended to the details of construction or design herein shown other than as described in the appended claims.