As shown in
The slip potential increases at high temperature, as the clamping force decreases and shear stress between the reed and the magnetic circuit increases.
The coefficient of thermal expansion (CTE) (α) of the excitation ring 13 is higher than a of the attached reed 16. As the excitation ring 13 is also considerably stronger, it will pull mounting points 18 radially, which will also cause a compression or tensile stress as the excitation ring 13 attempts to move the mounting points 18 to a smaller or larger radius.
Because the fused silica (commonly referred to as quartz) of the reed 16 is a highly elastic material, the reed 16 does not plastically deform to accommodate the metal of the excitation ring 13. Instead, some other mechanism of stress accommodation occurs, Possibilities are: a) slip of the mounting points 18; b) local yielding of metal part; and c) the rim of the reed 16 becomes an oval shape, which forces the paddle 19 out of plane. Any one of these, or a combination thereof, will cause sensor error that is made worse by temperature extremes.
The reed has an overall disk-like shape, and includes annular support ring and paddle connected to one another via a pair of flexures between Which an opening is farmed. For most of its perimeter, the paddle is separated from the support ring by a circular gap. Raised mounting pads 18 are located at approximately equally spaced positions around support ring.
The present invention reduces stress on the sensor resulting from temperature extremes and multiple coefficients of thermal expansion and also to assist in maintaining co-axiality between sense elements and the return path. The present invention is particularly useful for down hole use Where the environment requires use of materials with non-ideal coefficient of thermal expansion match. The present invention reduces the stress on the sense element, increasing accuracy over temperature by including flexure(s) for the mounting points between the sense element and the return path of a quartz flexure accelerometer. The arrangement of the flexures not only reduces stress but assists in maintaining co-axiality between the sense element and the return path.
An exemplary accelerometer device includes upper and lower stators and a reed. The inwardly facing surface of a least one stator includes a bore within which is positioned a permanent magnet capped by a pole piece. The reed includes a support ring and a paddle that is flexibly connected to the support ring via flexures that are compliant out of plane. The support ring includes a ring section and at least two mounting devices. The mounting devices are at least partially mechanically isolated from the ring section.
In one aspect of the invention, the mounting devices include a pad area and a neck area that connect the pad area to the ring section. The neck area includes a width dimension that is narrower than a diameter dimension of the pad area.
In another aspect of the invention, the pad area and the neck area are defined by an outer edge of the reed and a cavity linking the first and second sides.
In still another aspect of the invention, the pad area and the neck area are defined by an outer edge of the reed, a first cavity linking the first and second sides and a second cavity linking the first and second sides. The first and second cavities are at least partially circular.
Preferred and alternative embodiments of the present invention are described in detail below with reference to the following drawings:
The present invention provides stress isolation/reduction features for avoiding plastic deformation, slip, or bending of a reed of an accelerometer e.g., Q-Flex made by Honeywell, Inc.).
A capacitor plate is deposited on the upper surface of the paddle 36, and a similar capacitor plate (not shown) is deposited on the lower surface of the paddle. The capacitor plates cooperate with the inwardly facing surfaces of upper and lower stators 20 and 22 to provide a capacitive pick-off system. Also mounted on either side of the paddle 36 are coil forms on which force-rebalance coils are mounted. As is well understood in the served instrument art, coils cooperate with the permanent magnets in the stators and with a suitable feedback circuit to retain the paddle 36 at a predetermined position with respect to the support ring 32. Thin film pick-off leads, and similar leads (not shown) on the lower surface of the reed, provide electrical connections to the capacitor pick-off plates and force-rebalance coils.
In the design of an accelerometer of the type shown in
The coil forms are typically mounted directly to the paddle 36 with a compliant elastomer. The mismatch in CTE between aluminum and fused quartz is large, and the compliant elastomer layer does not relieve all of the stress at this interface. The remaining stresses that are not cancelled by the opposing coil can deform the capacitor pick-off plates or the flexures. Either of these deformations can cause a bias in the accelerometer's output. In addition, distortions that change the position of the coil windings can cause scale-factor errors. These error sources are even more significant in a design in which only a single force-rebalance coil is used, because of the asymmetry of the resulting stress applied to the paddle.
As shown in
Mounting devices 52 and 54 are located along the support ring 32-1 approximately equidistant from the first mounting device 50.
As shown in
As shown in
As shown in
In an alternate embodiment, a second cavity 110 is etched below the pillar 104 from an exterior side of the stator 100. The second cavity 110 provides more flexibility of the pillar 104.
In one embodiment, the pillars 92, 104 are used at all mounting locations.
While the preferred embodiment of the invention has been illustrated and described, as noted above, many changes can be made without departing from the spirit and scope of the invention. Accordingly, the scope of the invention is not limited by the disclosure of the preferred embodiment. Instead, the invention should be determined entirely by reference to the claims that follow.
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows.
This application is a continuation of U.S. patent application Ser. No. 13/656,600 by Roehnelt et al., filed Oct. 19, 2012 and entitled, “STRESS REDUCTION COMPONENTS FOR SENSORS,” the entire content of which is hereby incorporated by reference.
Number | Name | Date | Kind |
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3702073 | Jacobs | Nov 1972 | A |
4182187 | Hanson | Jan 1980 | A |
4250757 | Hanson | Feb 1981 | A |
4766768 | Norling | Aug 1988 | A |
4872342 | Hanson | Oct 1989 | A |
4932258 | Norling | Jun 1990 | A |
5024089 | Norling | Jun 1991 | A |
5085079 | Holdren | Feb 1992 | A |
5090243 | Holdren | Feb 1992 | A |
5289719 | Egley | Mar 1994 | A |
5644083 | Newell | Jul 1997 | A |
5763779 | Foote | Jun 1998 | A |
9164117 | Roehnelt | Oct 2015 | B2 |
20090205424 | Roehnelt | Aug 2009 | A1 |
20090235745 | Dwyer | Sep 2009 | A1 |
20090293616 | Lin et al. | Dec 2009 | A1 |
20090321857 | Foster et al. | Dec 2009 | A1 |
20140109673 | Roehnelt et al. | Apr 2014 | A1 |
Number | Date | Country |
---|---|---|
2090892 | Aug 2009 | EP |
9119988 | Dec 1991 | WO |
9624853 | Aug 1996 | WO |
Entry |
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Search Report from counterpart European application No. 13188400.9, dated Dec. 16, 2013, 3 pp. |
Examination Report from counterpart European Application No. 13188400.9. dated Jan. 13, 2014, 5 pp. |
Response to Article 94(3) EPC Communication dated Jan. 13, 2014, from counterpart European Application No. 13188400.9, dated May 6, 2014, 7 pp. |
Prosecution History from U.S. Appl. No. 13/656,600, dated Feb. 13, 2015 through Jun. 19, 2015, 24 pp. |
Number | Date | Country | |
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20160011227 A1 | Jan 2016 | US |
Number | Date | Country | |
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Parent | 13656600 | Oct 2012 | US |
Child | 14861936 | US |