The present invention relates generally to a substrate for fabricating a light emitting device and the light emitting device fabricated therefrom. More particularly, the present invention relates to a patterned substrate for fabricating a light emitting diode (LED) and the LED with high light extraction efficiency fabricated therefrom.
In recent years, a light emitting device, or a light emitting diode (LED), has been widely used in the applications such as back lights of displays or lighting, since LED has certain advantages of high luminance and “environmentally friendly”. However, for one skilled in the art, it is generally known that the poor quantum efficiency (external or internal) of LED may result in transferring the energy which has not been successfully converted into light into heat, and if the heat has not been properly dissipated from LED effectively, it may subsequently result in raising the temperature of LED and reducing the light emitting efficiency.
Generally, during the epitaxial growth of LED, if the epitaxial film contains large amount of dislocation, the internal quantum efficiency will be decreased. The internal quantum efficiency is proportional to light generated from the emitting layer, and the internal quantum efficiency is up to 100% for an ideal situation. The external quantum efficiency is the ratio of light outputting LED to light generated from the emitting layer.
To effectively enhance the external quantum efficiency, it is generally known for one skilled in the art to use a patterned substrate as a substrate for epitaxial growth. With reference to
However, as shown in
Besides, since light scattering caused by the increasing of the different scattering surfaces of the protruded areas so as to increase the refractive angles when light travels to the patterned substrate, if the protruded areas are increased, for example by connecting the protruded areas to increase the effective surface areas for refraction, the light extraction efficiency will also be increased.
Thus, a requirement still remains for a patterned substrate provided with one primary platform for epitaxial growth to prevent interval defects from generating and with increased the light extraction efficiency.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.
An objective of the present invention is to provide a substrate for fabricating a light emitting device having an improved surface structure provided with a major growth platform to prevent interval defects from generating and having increased effective surface areas of the protruded portions for enhancing the light extraction efficiency.
The present invention provides a patterned substrate for fabricating a light emitting device having an improved surface structure, comprising: at least one platform region having a first facet direction for epitaxial growth; and a plurality of directly adjacent protruded portions surrounding the at least one platform region to isolate the at least one platform region from another platform region, each directly adjacent protruded portion having a scattering surface and a vertex, wherein facet direction of each scattering surface of the plurality of directly adjacent protruded portions is substantially excluded from first facet direction, wherein at least one unit region is surrounded by the vertexs or lines between the adjacent vertexs of the plural directly adjacent protruded portions, an area of the unit region consists of an area of the protruded portions and an area of the platform region, the area of the protruded portion is larger than the area of the platform region.
Preferably, each vertex of the plurality of protruded portions has a shape of dot or line.
Preferably, the scattering surfaces are formed between the platform region and the vertexs or lines between the adjacent vertexs of the plurality of directly adjacent protruded portions.
Preferably, the ratio of the area of the platform region to the area of the unit region is less than or equal to 10%.
Preferably, the plurality of directly adjacent protruded portions have a curved surface or a flat surface.
Preferably, the first facet direction is (0001) facet direction for C-plane sapphire.
Preferably, the unit region has a shape of hexagon or triangle.
The present invention further provides a patterned substrate for fabricating a light emitting device having an improved surface structure, comprising: at least one platform region having a first facet direction for epitaxial growth; and a plurality of directly adjacent protruded portions surrounding the at least one platform region to isolate the at least one platform region from another platform region, each directly adjacent protruded portion having a scattering surface and a vertex, wherein each facet direction of the scattering surface of the plurality of directly adjacent protruded portions is substantially excluded from first facet direction, wherein in top view of the area of the directly adjacent protruded portion for scattering light is larger than the area of the platform region for epitaxial growth.
Preferably, each vertex of the plurality of directly adjacent protruded portions has a shape of dot or line.
Preferably, the scattering surfaces are formed between the platform region and the vertexs or lines between the adjacent vertexs of the plurality of directly adjacent protruded portions.
The present invention further provides a patterned substrate for fabricating a light emitting device having an improved surface structure, comprising: at least one platform region serving as a primary platform for epitaxial growth; and a plurality of directly adjacent protruded portions surrounding the at least one platform region to isolate the at least one platform region from another platform region so as to enhance light extraction efficiency, each directly adjacent protruded portion having a scattering surface and a vertex, wherein at least one unit region is surrounded by the vertexs or lines between the adjacent vertexs of the plural directly adjacent protruded portions, an area of the unit region consists of an area of the protruded portions and an area of the platform region, the area of the protruded portion is larger than the area of the platform region.
Preferably, each vertex of the plurality of directly adjacent protruded portions has a shape of dot or line.
Preferably, the scattering surfaces are formed between the platform region and the vertexs or lines between the adjacent vertexs of the plurality of directly adjacent protruded portions.
Preferably, the unit region has a shape of hexagon or triangle. Preferably, the ratio of the area of the platform region to the area of the unit region is less than or equal to 10%
Certain embodiments of the invention have other aspects in addition to or in place of those mentioned above. The aspects will become apparent to those skilled in the art from a reading of the following description when taken with reference to the accompanying drawings.
Relevant embodiments of the present invention will be described in detail below with reference to the accompanying drawings, in which:
The following embodiments are described in sufficient detail to enable those skilled in the art to make and use the invention. It is to be understood that other embodiments would be evident based on the present disclosure, and that process and mechanical changes may be made without departing from the scope of the present invention.
In the following description, numerous specific details are given to provide a thorough understanding of the invention. However, it will be apparent that the invention may be practiced without these specific details. In order to avoid obscuring the present invention, some well-known configurations and process steps are not disclosed in detail.
In the following description, several examples are given to provide a thorough understanding of the patterned substrate of the invention.
With reference to
As shown in the sectional views
In this embodiment, if each length of side of the outer hexagon is about 3 (μm), and each length of side of the inner hexagon is about 0.3 (μm). The area of the unit region (the area of the outer hexagon) A is about 23.383 (μm2), the area of the platform region (the area of the inner hexagon) A1 is about 0.234 (μm2), and the area of the protruded portions A-A1 is about 23.149 (μm2).
According to the calculation above, the area of the protruded portions A-A1 is larger than that of the platform region A1, and the ratio of the area of the platform region A1 to the area of the outer hexagon A is about 1%. In this embodiment, the area of the platform region (the major growth platform) is decreased to prevent interval defects from generating, and the area of the protruded portions (the effective area for refraction) is increased for enhancing the light extraction efficiency. Besides, for better epitaxial growth and better light extraction efficiency, the range of the length of side of the outer hexagon is about 3 (μm)˜15 (μm), and the range of the length of side of the inner hexagon is about 0.3 (μm)˜1.5 (μm). But the lengths of side of the outer hexagon and the inner hexagon are not limited thereto.
With reference to
As shown in the sectional views
Further,
In this embodiment, if the radius of circle is about 0.3 (μm), the area of the unit region A is about 0.156 (μm2), the area of the protruded portions A-A1 (the effective area for refraction) is about 0.141 (μm2), and the area of the platform region (the major growth platform) A1 is about 0.048 (μ2). Therefore, the area of the protruded portions A-A1 is larger than the area of the platform region A1, and the ratio of the area of the platform region A1 to the area of the unit region A is about 9.31%. For better epitaxial growth and better light extraction efficiency, the range of the radius of circle is about 0.3 (μm)˜4 (μm), but the radius of circle is not limited thereto.
In this embodiment, the area of the platform region (the major growth platform) is decreased to prevent interval defects from generating, and the area of the protruded portions (the effective area for refraction) is increased for enhancing the light extraction efficiency.
In the embodiment of the patterned substrate of the present invention as shown in
The patterned substrate of the present invention can be formed by a dry etching process or an electron beam etching process. Alternatively, the patterned substrate of the present invention can be formed by a wet etching process with over etching performed. The dry etching, electron beam etching, and wet etching processes should be apparent to those skilled in the art without further explanation.
In the following description, several examples are given to provide a thorough understanding of the process of fabricating a light emitting device by the patterned substrate of the invention.
As shown in
Preferably, the first semiconductor layer 32 and the second semiconductor layer 34 are formed of GaN. More preferably, the first semiconductor layer 32 is formed of an n-type GaN and the second semiconductor layer 34 is formed of a p-type GaN.
Furthermore, though the embodiment stated above is illustrated by a flip-chip packaging method, the present invention can, however, deviate from the described manner, also be packaged by other LED packaging methods such as conventional wire-bonding method, as long as the effect of increasing external quantum efficiency by the patterned substrate is achieved.
Further, though the examples of the patterned substrate of the invention stated above use a sapphire substrate, the present invention is not limited by these examples. Suitable substrates for growing a Group III-V semiconductor material (for example, Group III nitride semiconductor material, GaN) include but are not limited to Si, SiC, and the like.
Besides, the Group III nitride semiconductor material is not limited to GaN material. As is well understood by those in this art, the Group III elements can combine with nitrogen to form binary compounds such as AlN or InN, tertiary compounds such as AlGaN, or quaternary compounds such as AlInGaN.
While the invention has been described in conjunction with a specific best mode, it is to be understood that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the included claims. All matters set forth herein or shown in the accompanying drawings are to be interpreted in an illustrative and non-limiting sense.
Number | Date | Country | Kind |
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097126565 | Jul 2008 | TW | national |
This application is a continuation-in-part of and claims the priority benefit of U.S. application Ser. No. 12/453,409, filed on May 11, 2009, now pending, which claims the priority benefit of Taiwan application serial no. 097126565, filed on Jul. 14, 2008. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
Number | Date | Country | |
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Parent | 12453409 | May 2009 | US |
Child | 13527598 | US |