Substrate polishing method and method of manufacturing semiconductor device

Abstract

The substrate polishing method of the present invention can be used, in a substrate polishing apparatus having multiple carriers for one polishing pad, for determining a polishing time necessary to obtain a specific amount of polishing in polishing substrates using only some of the carriers among multiple carriers. In the present method, a correction coefficient indicating the correlation between the polishing time in polishing substrates using all the carriers and the polishing time in polishing substrates using only a part of the carriers is obtained in advance. The polishing time necessary for the specific amount of polishing in polishing substrates using only a part of the carriers is calculated based on the correction coefficient and the polishing time necessary for polishing the specific amount of polishing in polishing substrates using all of the carriers. By this, the amount of polishing of a factional number of substrates can be easily made to coincide with the amount of polishing of other substrates polished using all of the carriers.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart showing the fractional number polishing that relates to an embodiment of the present invention.

FIG. 2 is a plot showing the dependency of the polishing rate ratio on the polishing time that relates to an embodiment of the present invention.

FIG. 3 is a plot showing the dependency of the polishing rate ratio on the polishing pressure that relates to an embodiment of the present invention.

FIG. 4 is a plot showing the dependency of the polishing rate ratio on the relative velocity of polishing that relates to an embodiment of the present invention.

FIG. 5 is a plot showing the dependency of the polishing rate ratio on the slurry flow rate that relates to an embodiment of the present invention.

FIG. 6 is a plot showing the dependency of the polishing rate ratio on the accumulated number of substrates that relates to an embodiment of the present invention.

FIG. 7 is a perspective view of the CMP polishing apparatus.

FIG. 8 is a flow chart showing a lot processing including a fractional number polishing in a polishing process.

Claims

1. A substrate polishing method used in a substrate polishing apparatus which has multiple carriers for one polishing pad and which can simultaneously polish multiple substrates by pressing substrates held by the multiple carriers onto the polishing pad, comprising the steps of: obtaining a polishing time necessary for a specific amount of polishing in polishing substrates using all the carriers;calculating a polishing time necessary for the specific amount of polishing in polishing substrates using only a part of the carriers based on the obtained polishing time and a correction coefficient indicating the correlation between a polishing time in polishing substrates using all the carriers and a polishing time in polishing substrates using only a part of the carriers; andpolishing substrates using only a part of the carriers according to the calculated polishing time.

2. A substrate polishing method according to claim 1, wherein the correction coefficient is a value corresponding to the number of carriers used for polishing substrates.

3. A substrate polishing method according to claim 1, wherein the correction coefficient is a value corresponding to the accumulated amount of polishing of polished substrates on the same polishing pad.

4. A substrate polishing method according to claim 2, wherein the correction coefficient is a value corresponding to the accumulated amount of polishing of polished substrates on the same polishing pad.

5. A substrate polishing method according to claim 1, wherein the correction coefficient is a value set stepwise corresponding to the accumulated amount of polishing of substrates.

6. A substrate polishing method according to claim 2, wherein the correction coefficient is a value set stepwise corresponding to the accumulated amount of polishing of substrates.

7. A substrate polishing method according to claim 1, wherein a relative velocity of polishing between the polishing pad and the carriers is set to a velocity by which the dependency of the correction coefficient on the accumulated amount of polishing is suppressed, and the correction coefficient is given a fixed value.

8. A substrate polishing method according to claim 2, wherein a relative velocity of polishing between the polishing pad and the carriers is set to a velocity by which the dependency of the correction coefficient on the accumulated amount of polishing is suppressed, and the correction coefficient is given a fixed value.

9. A semiconductor device manufacturing method including a process in which planarization of substrate surface is performed by a substrate polishing apparatus which has multiple carriers for one polishing pad and which can simultaneously polish multiple substrates by pressing substrates held by the multiple carriers onto the polishing pad, comprising the steps of: obtaining a polishing time necessary for a specific amount of polishing in polishing substrates using all the carriers;calculating a polishing time necessary for the specific amount of polishing in polishing substrates using only a part of the carriers based on the obtained polishing time and a correction coefficient indicating the correlation between a polishing time in polishing substrates using all the carriers and a polishing time in polishing substrates using only a part of the carriers; andpolishing substrates using only a part of the carriers according to the calculated polishing time.

10. A semiconductor device manufacturing method according to claim 9, wherein the correction coefficient is a value corresponding to the number of carriers used for polishing substrates.

11. A semiconductor device manufacturing method according to claim 9, wherein the correction coefficient is a value corresponding to the accumulated amount of polishing of polished substrates on the same polishing pad.

12. A semiconductor device manufacturing method according to claim 10, wherein the correction coefficient is a value corresponding to the accumulated amount of polishing of polished substrates on the same polishing pad.

13. A semiconductor device manufacturing method according to claim 9, wherein the correction coefficient is a value set stepwise corresponding to the accumulated amount of polishing of substrates.

14. A semiconductor device manufacturing method according to claim 10, wherein the correction coefficient is a value set stepwise corresponding to the accumulated amount of polishing of substrates.

15. A semiconductor device manufacturing method according to claim 9, wherein a relative velocity of polishing between the polishing pad and the carriers is set to a velocity by which the dependency of the correction coefficient on the accumulated amount of polishing is suppressed, and the correction coefficient is given a fixed value.

16. A semiconductor device manufacturing method according to claim 10, wherein a relative velocity of polishing between the polishing pad and the carriers is set to a velocity by which the dependency of the correction coefficient on the accumulated amount of polishing is suppressed, and the correction coefficient is given a fixed value.