BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a sectional view schematically showing the construction of a substrate processing apparatus according to a first embodiment of the present invention;
FIG. 2 is a view which is useful in explaining a particle removal method for the substrate processing apparatus according to the above embodiment;
FIGS. 3A and 3B are sequence diagrams showing the timing of application of a DC voltage to an upper electrode layer and a lower electrode layer of a deposit shield appearing in FIG. 1, FIG. 3A showing an example of the timing of the DC voltage application, and FIG. 3B showing another example of the timing of the DC voltage application;
FIG. 4 is a sequence diagram which is useful in explaining a deposit removal method carried out in the substrate processing apparatus shown in FIG. 1; and
FIG. 5 is a sectional view schematically showing the construction of a substrate processing apparatus according to a second embodiment of the present invention.