SUBSTRATE PROCESSING APPARATUS, SUBSTRATE ATTRACTING METHOD, AND STORAGE MEDIUM

Abstract

A substrate processing apparatus carrying out processing on a substrate, which enables attachment of particles to a surface of a substrate to be prevented. A substrate processing apparatus comprises a housing chamber in which the substrate is housed, and a stage that is disposed in the housing chamber and on which the substrate is mounted. The stage having in an upper portion thereof an electrostatic chuck comprising an insulating member having an electrode plate therein, and the electrode plate having a DC power source connected thereto. The DC power source applies a negative voltage to the electrode plate when the substrate is to be attracted by the electrostatic chuck.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate an embodiment of the present invention and, together with the description, serve to explain the principles of the present invention.

FIG. 1 is a sectional view of a substrate processing apparatus according to an embodiment of the present invention;

FIG. 2 is a graph showing the relationship between the value of a positive voltage applied to an electrode plate of the substrate processing apparatus shown in FIG. 1, and a number of particles counted; and

FIG. 3 is a diagram showing a high frequency electrical power and DC electrical power application sequence in a substrate attracting method according to the present embodiment.

Claims

1. A substrate processing apparatus that carries out processing on a substrate, comprising a housing chamber in which the substrate is housed, and a stage that is disposed in said housing chamber and on which the substrate is mounted, said stage having in an upper portion thereof an electrostatic chuck comprising an insulating member having an electrode plate therein, and said electrode plate having a DC power source connected thereto, wherein said DC power source applies a negative voltage to said electrode plate when the substrate is to be attracted by said electrostatic chuck.

2. A substrate processing apparatus as claimed in claim 1, wherein said DC power source applies a positive voltage to said electrode plate when the substrate is to be detached by said electrostatic chuck, a value of the positive voltage being not more than 1500 V.

3. A substrate processing apparatus as claimed in claim 1, wherein a high frequency power source is connected to said stage, and said high frequency power source applies high frequency electrical power to said stage before said DC power source applies the negative voltage to said electrode plate.

4. A substrate processing apparatus as claimed in claim 2, wherein a high frequency power source is connected to said stage, and said high frequency power source applies high frequency electrical power to said stage before said DC power source applies the negative voltage to said electrode plate.

5. A substrate processing apparatus as claimed in claim 1, wherein the substrate has a polysilicon layer formed on a front surface thereof, and the processing is etching processing.

6. A substrate processing apparatus as claimed in claim 2, wherein the substrate has a polysilicon layer formed on a front surface thereof, and the processing is etching processing.

7. A substrate processing apparatus as claimed in claim 3, wherein the substrate has a polysilicon layer formed on a front surface thereof, and the processing is etching processing.

8. A substrate processing apparatus as claimed in claim 4, wherein the substrate has a polysilicon layer formed on a front surface thereof, and the processing is etching processing.

9. A substrate attracting method for a substrate processing apparatus comprising a housing chamber in which a substrate is housed, and a stage that is disposed in the housing chamber and on which the substrate is mounted, the stage having in an upper portion thereof an electrostatic chuck comprising an insulating member having an electrode plate therein, and the electrode plate having a DC power source connected thereto, the substrate attracting method having a negative voltage application step of the DC power source applying a negative voltage to the electrode plate when the substrate is to be attracted by the electrostatic chuck.

10. A substrate attracting method as claimed in claim 9, having a positive voltage application step of the DC power source applying a positive voltage to the electrode plate when the substrate is to be detached by the electrostatic chuck, a value of the positive voltage being not more than 1500 V.

11. A substrate attracting method as claimed in claim 9, having a high frequency electrical power application step of a high frequency power source connected to the stage applying high frequency electrical power to the stage before the DC power source applies the negative voltage to the electrode plate.

12. A substrate attracting method as claimed in claim 10, having a high frequency electrical power application step of a high frequency power source connected to the stage applying high frequency electrical power to the stage before the DC power source applies the negative voltage to the electrode plate.

13. A computer-readable storage medium storing a program for causing a computer to implement a substrate attracting method for a substrate processing apparatus comprising a housing chamber in which a substrate is housed, and a stage that is disposed in the housing chamber and on which the substrate is mounted, the stage having in an upper portion thereof an electrostatic chuck comprising an insulating member having an electrode plate therein, and the electrode plate having a DC power source connected thereto, the program having a negative voltage application module for the DC power source applying a negative voltage to the electrode plate when the substrate is to be attracted by the electrostatic chuck.