SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Abstract

A processing fluid is prepared by mixing purified water and methanol as a solvent with SCCO2, and the processing fluid is brought into contact with a surface of a substrate so as to form oxide film on the surface of the substrate. In this processing fluid, SCCO2 functions as a carrier medium while —OH functional group (hydroxyl group) disperse in the SCCO2 as active chemical species. Such the highly motile and highly concentrated SCCO2 is used as a carrier medium, while the active chemical species are mixed with carrier medium. Because of this, excessive presence of active chemical species is prevented in the atmosphere in contact with the surface of the substrate. The active chemical species demonstrates superior diffusiveness, and moreover, even a small amount of solvent contains large amount of active chemical species. Therefore, the fresh active chemical species are constantly supplied to the surface of the substrate, reacting excellently with the surface of the substrate, thereby forming oxide film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a drawing which shows a substrate processing apparatus which is able to implement a first embodiment of a substrate processing method according to the invention;

FIG. 2 is a block diagram which shows an electric structure for controlling the substrate processing apparatus of FIG. 1;

FIG. 3 is a flow chart which shows the first embodiment of the substrate processing method according to the invention;

FIG. 4 is a diagram showing a substrate processing system, capable of performing a second embodiment;

FIG. 5 is a flow chart showing the substrate processing method of the second embodiment related to this invention;

FIG. 6 is a diagram showing a substrate processing system, capable of performing a third embodiment;

FIG. 7 is a flowchart showing the third embodiment of the substrate processing method related to this invention;

FIG. 8 is a diagram showing a substrate processing system, capable of performing a fourth embodiment;

FIG. 9 is a flowchart showing the fourth embodiment of the substrate processing method;

FIG. 10 is a diagram showing a substrate processing system, capable of performing a fifth embodiment;

FIG. 11 is a flowchart showing the fifth embodiment of the substrate processing method related to this invention;

FIG. 12 is a diagram showing a substrate processing system, capable of performing a sixth embodiment;

FIG. 13 is a chart showing the film forming apparatus installed in the substrate processing system of FIG. 12;

FIG. 14 is a diagram showing a substrate processing system, capable of performing a seventh embodiment; and

FIGS. 15 and 16 are flow charts showing the seventh embodiment of the substrate processing method related to this invention.

Claims

1. A substrate processing method, comprising the steps of: preparing a processing fluid by means of mixing a solvent with high-pressure carbon dioxide, the solvent being a chemical compound having an —OH function group; andforming an oxide film onto a dry surface of a substrate by means of bringing the substrate into contact with the processing fluid.

2. The substrate processing method of claim 1, further comprising the step of removing a naturally-oxide film adhering to the surface of the substrate, preceding to the oxide film forming step.

3. The substrate processing method of claim 2, wherein the oxide film removing step is a step of bringing a processing fluid that is a mixture of high-pressure carbon dioxide and an etchant for removal of the oxide film into contact with the surface of the substrate, to thereby remove a naturally-oxide film from the surface of the substrate, andthe oxide film removing step and the oxide film forming step are performed continuously within one processing chamber.

4. The substrate processing method of claim 1, wherein the oxide film forming step is a step of adjusting film thickness of the oxide film by means of controlling a processing condition for the oxide film forming on the surface of the substrate.

5. The substrate processing method of claim 1, further comprising the step of adjusting film thickness of the oxide film by means of removing a surface layer of the oxide film using an etching process after performing the oxide film forming step.

6. The substrate film processing method of claim 5, wherein the film thickness adjusting step is a step of supplying a processing liquid that includes an etchant for etching removal of the oxide film to the surface of the substrate, to thereby remove the surface layer of the oxide film.

7. The substrate processing method of claim 5, wherein the film thickness adjusting step is a step of bringing a processing fluid that is a mixture of an etchant for etching removal of the oxide film and high-pressure carbon dioxide into contact with the surface of the substrate, to thereby remove the surface layer of the oxide film.

8. The substrate processing method of claim 7, wherein the film thickness adjusting step and the oxide film forming step are performed continuously within one processing chamber.

9. The substrate processing method of claim 4, further comprising the step of forming a high-permittivity film on the oxide film that is adjusted the film thickness thereof.

10. The substrate processing method of claim 1, wherein the solvent includes at least one element selected from an alcohol group, a diol group, a carboxylic acid group, a glycol group and water.

11. The substrate processing method of either claim 1, wherein the solvent includes at least one element selected from methanol, ethanol and isopropyl alcohol.

12. The substrate processing method of claim 11, wherein the solvent is methanol.

13. The substrate processing method of claim 1, wherein the solvent is water.

14. The substrate processing method of claim 1, wherein the solvent is a mixture of water and a chemical compound containing at least one element selected from methanol, ethanol and isopropyl alcohol.

15. The substrate processing method of claim 14, wherein the solvent is a mixture of methanol and water.

16. A substrate processing method, comprising the steps of: preparing a processing fluid by means of mixing a solvent with high-pressure carbon dioxide, the solvent being a chemical compound having an —OH function group; andimproving film quality of an oxide film that is formed onto a dry surface of a substrate as well as promoting incremental growth of the oxide film by means of bringing the substrate into contact with the processing fluid.

17. The substrate processing method of claim 16, wherein the oxide film that is formed onto the surface of the substrate prior to the execution of the film quality improving step is either a thermally oxide film, a vapor oxide film, a chemically oxide film or a vapor deposition film.

18. The substrate processing method of claim 16, further comprising the step of adjusting film thickness of the oxide film by means of removing a surface layer of the oxide film using an etching process after performing the film quality improving step.

19. The substrate processing method of claim 18, wherein the film thickness adjusting step is a step of supplying a processing liquid that includes an etchant for etching removal of the oxide film to the surface of the substrate, to thereby remove the surface layer of the oxide film.

20. The substrate processing method of claim 18, wherein the film thickness adjusting step is a step of bringing a processing fluid that is a mixture of an etchant for etching removal of the oxide film and high-pressure carbon dioxide into contact with the surface of the substrate, to thereby remove the surface layer of the oxide film.

21. The substrate processing method of claim 20, wherein the film thickness adjusting step and the film quality improving step are performed continuously within one processing chamber.

22. The substrate processing method of claim 18, further comprising the step of forming a high-permittivity film on the oxide film with film thickness adjusted thereto.

23. The substrate processing method of claim 18, wherein the solvent includes at least one element selected from an alcohol group, a diol group, a carboxylic acid group, a glycol group and water.

24. The substrate processing method of either claim 18, wherein the solvent includes at least one element selected from methanol, ethanol and isopropyl alcohol.

25. The substrate processing method of claim 24, wherein the solvent is methanol.

26. The substrate processing method of claim 18, wherein the solvent is water.

27. The substrate processing method of claim 18, wherein the solvent is a mixture of water and a chemical compound containing at least one element selected from methanol, ethanol and isopropyl alcohol.

28. The substrate processing method of claim 27, wherein the solvent is a mixture of methanol and water.

29. A substrate processing apparatus, comprising: a pressure container that has a processing chamber in which a substrate having a dry surface is held; anda processing fluid supplying unit that prepares a processing fluid by means of mixing a solvent with high-pressure carbon dioxide and supplies the same to the processing chamber, so as to form an oxide film onto the dry surface, the solvent being a chemical compound having an —OH function group.

30. A substrate processing apparatus, comprising: a pressure container that has a processing chamber in which a substrate is held, the substrate being a dry surface onto which an oxide film is formed; anda processing fluid supplying unit that prepares a processing fluid by mixing a solvent with high-pressure carbon dioxide and supplies the same to the processing chamber, so as to improve film quality of the oxide film as well as promote incremental growth of the oxide film, the solvent being a chemical compound having an —OH function group.