Solder masks

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CPC
H05K3/3452

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3452Solder masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tombstone prevention for a surface mount device
- Patent number 11,917,761
- Issue date Feb 27, 2024
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with solder mask on internal copper pad
- Patent number 11,910,540
- Issue date Feb 20, 2024
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible inlay and manufacturing method thereof
- Patent number 11,895,777
- Issue date Feb 6, 2024
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, semiconductor device and method of manufacturing cir...
- Patent number 11,792,920
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic device
- Patent number 11,765,832
- Issue date Sep 19, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate device
- Patent number 11,749,590
- Issue date Sep 5, 2023
- Shinko Electric Industries Co., Ltd.
- Tatsuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board
- Patent number 11,744,014
- Issue date Aug 29, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hard disk drive suspension pad pre-solder formation and guiding
- Patent number 11,705,153
- Issue date Jul 18, 2023
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board
- Patent number 11,678,439
- Issue date Jun 13, 2023
- Macronix International Co., Ltd.
- Pei-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing composite circuit board
- Patent number 11,672,083
- Issue date Jun 6, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,647,593
- Issue date May 9, 2023
- Sony Interactive Entertainment Inc.
- Kazuki Sasao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 11,647,594
- Issue date May 9, 2023
- PulseForge, Inc.
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposure system, circuit board, and method for making circuit board
- Patent number 11,647,592
- Issue date May 9, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ching-Lung Chuang
- G02 - OPTICS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,641,720
- Issue date May 2, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 11,589,487
- Issue date Feb 21, 2023
- Jabil Inc.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fiber optics printed circuit board assembly surface cleaning and ro...
- Patent number 11,555,973
- Issue date Jan 17, 2023
- II-VI DELAWARE, INC.
- Tao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen printer having mask pressing device for determining tension...
- Patent number 11,511,535
- Issue date Nov 29, 2022
- FUJI CORPORATION
- Atsushi Torii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuits for use with gaskets in electronic equipment and...
- Patent number 11,510,322
- Issue date Nov 22, 2022
- Sensus Spectrum, LLC
- Eric Frazee
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method for formation of patterned solder mask
- Patent number 11,477,894
- Issue date Oct 18, 2022
- Picosun Oy
- Marko Pudas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board module
- Patent number 11,460,015
- Issue date Oct 4, 2022
- ebm-papst St. Georgen GmbH & Co. KG
- Volker Ehlers
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Solder mask inkjet inks for manufacturing printed circuit boards
- Patent number 11,441,046
- Issue date Sep 13, 2022
- Agfa-Gevaert N.V.
- Christopher Wall
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin, photosensitive resin composition, electronic component and d...
- Patent number 11,333,976
- Issue date May 17, 2022
- Toray Industries, Inc.
- Tomoyuki Yuba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240381530
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240314939
- Publication date Sep 19, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276642
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Keesu Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240260178
- Publication date Aug 1, 2024
- KIOXIA Corporation
- Motoshi SETO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240237228
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...
- Publication number 20240206072
- Publication date Jun 20, 2024
- Lumileds LLC
- Say Chun OOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Terminal Device
- Publication number 20240172367
- Publication date May 23, 2024
- Honor Device Co., Ltd.
- Yihe Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164026
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240138074
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240114620
- Publication date Apr 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...
- Publication number 20240057265
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20230345632
- Publication date Oct 26, 2023
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD
- Publication number 20230328896
- Publication date Oct 12, 2023
- DSBJ PTE. LTD.
- Pui Yin YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE
- Publication number 20230284388
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH MOLD ADHESION BOUNDARY FOR DIE ATTACH PAD
- Publication number 20230262901
- Publication date Aug 17, 2023
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230180394
- Publication date Jun 8, 2023
- LG Innotek Co., Ltd.
- Se Woong NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inkjet Ink for Printed Circuit Boards
- Publication number 20230174805
- Publication date Jun 8, 2023
- AGFA-GEVAERT N.V.
- Marion Sauvageot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20230101831
- Publication date Mar 30, 2023
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREEN MASK INSPECTION DEVICE, SOLDER PRINTING INSPECTION DEVICE, A...
- Publication number 20230014796
- Publication date Jan 19, 2023
- CKD CORPORATION
- Kazuyoshi Kikuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS
- Publication number 20220386468
- Publication date Dec 1, 2022
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING CIR...
- Publication number 20220369454
- Publication date Nov 17, 2022
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS

Solder masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder mask arrangement for a component carrier

Flexible circuit board

Pre-plating of solder layer on solderable elements for diffusion so...

On-demand method of making PCB pallets using additive manufacturing

Tombstone prevention for a surface mount device

Circuit board with solder mask on internal copper pad

Flexible inlay and manufacturing method thereof

Printed wiring board and method for manufacturing printed wiring board

Semiconductor module and electronic apparatus

Circuit board, semiconductor device and method of manufacturing cir...

Printed circuit board and electronic device

Wiring substrate device

Flexible circuit board

Hard disk drive suspension pad pre-solder formation and guiding

Circuit board

Method of manufacturing composite circuit board

Semiconductor device manufacturing method

Method for curing solder paste on a thermally fragile substrate

Exposure system, circuit board, and method for making circuit board

Circuit board and manufacturing method thereof

Circuit board and method for manufacturing the same

On-demand method of making PCB pallets using additive manufacturing

Fiber optics printed circuit board assembly surface cleaning and ro...

Reduced capacitance land pad

Screen printer having mask pressing device for determining tension...

Flexible circuits for use with gaskets in electronic equipment and...

Method for formation of patterned solder mask

Printed circuit board module

Solder mask inkjet inks for manufacturing printed circuit boards

Resin, photosensitive resin composition, electronic component and d...

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

METHOD OF BONDING COLUMN TYPE DEPOSITS

Printed Circuit Board And Method For Soldering A Chip Housing In A...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

WIRING SUBSTRATE

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...

Terminal Device

PRINTED CIRCUIT BOARD

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

PRINTED CIRCUIT BOARD

STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD

PACKAGE SUBSTRATE MANUFACTURING METHOD

TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE

PRINTED CIRCUIT BOARD WITH MOLD ADHESION BOUNDARY FOR DIE ATTACH PAD

CIRCUIT BOARD

CIRCUIT BOARD

Inkjet Ink for Printed Circuit Boards

FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF

SCREEN MASK INSPECTION DEVICE, SOLDER PRINTING INSPECTION DEVICE, A...

SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS

CIRCUIT BOARD, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING CIR...