Patent Application
20150225230
MEMS (Micro Electrical Mechanical System) devices are used in more and more applications and systems nowadays. MEMS devices include for example MEMS oscillators, MEMS accelerometers etc. MEMS devices are encapsulated in cavities to protect the moving MEMS element from external influences such as air, moisture etc.
According to one aspect, a MEMS structure is arranged within a sealed cavity. A support structure is arranged within the cavity, the support structure being laterally elongated and extending in a vertical direction from a bottom of the cavity to a top of the cavity.
According to one aspect, a MEMS device comprises a cavity with top, bottom and side walls wherein a MEMS structure is provided to be movable within the cavity. The MEMS device further comprises a support structure, wherein the support structure is spaced apart from the MEMS structure and laterally surrounded by the MEMS structure.
According to one aspect, a method of manufacturing a MEMS device comprises the removing of material of a substrate such that a MEMS structure and a support structure with a laterally elongated shape are formed and the forming of a cover such that the support structure provides mechanical support for the cover.
The following detailed description explains exemplary embodiments. The description is not to be taken in a limiting sense, but is made only for the purpose of illustrating the general principles of embodiments while the scope of protection is only determined by the appended claims.
It is to be understood that the features of the various exemplary embodiments described herein may be combined with each other, unless specifically noted otherwise.
In the various figures, identical or similar entities, modules, devices etc. may have assigned the same reference number. Example embodiments will now be described more fully with reference to the accompanying drawings. Embodiments, however, may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.
In the described embodiments, various specific views or schematic views of elements, devices, features, etc. are shown and described for a better understanding of embodiments. It is to be understood that such views may not be drawn to scale. Furthermore, such embodiments may not show all features, elements etc. contained in one or more figures with a same scale, i.e. some features, elements etc. may be shown oversized such that in a same figure some features, elements, etc. are shown with an increased or decreased scale compared to other features, elements etc.
It will be understood that when an element is referred to as being “on,” “connected to,” “electrically connected to,” or “coupled to” to another component, it may be directly on, connected to, electrically connected to, or coupled to the other component or intervening components may be present. In contrast, when a component is referred to as being “directly on,” “directly connected to,” “directly electrically connected to,” or “directly coupled to” another component, there are no intervening components present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like may be used herein for ease of description to describe the relationship of one component and/or feature to another component and/or feature, or other component(s) and/or feature(s), as illustrated in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
Embodiments described herein are directed to a new support concept in MEMS devices. Typically, MEMS devices include MEMS structures of micro-size or nano-size which are formed in or on a substrate such as a semiconductor chip. Such MEMS structures may be covered with a cover to encapsulate the MEMS structures in order to prevent the intrusion of dirt, humidity etc which may degrade or destroy the operation of the MEMS device. Some embodiments described herein provide a new concept for a cover to encapsulate a MEMS structure in which the cover is mechanically supported by an intermediate support structure of lateral elongated shape. Some embodiments described herein provide a support structure to support a cover wherein the support structure is laterally completely surrounded by a movable MEMS structure in a spaced apart relationship to the movable MEMS structure.
The MEMS structure 102 is provided freely movable compared for example to the non-movable side wall portions 106. In the embodiment of
Electrode portions 110 are provided on two lateral sides for generating resonating oscillation for the MEMS structure 102. The MEMS device 100 may in some embodiments be a resonator device for providing clocking signals sometimes referred to as a silicon clock resonator. The MEMS structure 102 may therefore in some embodiments comprise a flexible resonating element. The MEMS structure 102 may for example comprise a flexible beam of a piezo-resistive Free-Free-Beam resonator.
The MEMS structure 102 may include a flexural beam which is electro-statically coupled to two symmetrical electrodes, wherein one of the symmetrical electrodes is used to drive the beam into resonance and the other one is used to collect the output signal. In some embodiments, a free-free condition resonating operation is provided by suspending the resonating beam of the MEMS structure 102 at the anchor points 108 which are joined to a resonating beam in two points which correspond to the nodes of the free-free mode to be excited in the MEMS structure 102. The length of the anchor beams connected with the resonating MEMS structure 102 may in some embodiments be designed to resonate on a second clamped-clamped mode at the same frequency of the MEMS structure. In some embodiments, the anchor beams may not exert a bending moment on the resonating MEMS structure, so that the MEMS structure 102 is minimally affected by the anchor beams. Thus, the MEMS structure 102 can be provided decoupled from the anchor points.
In some embodiments, the MEMS structure 102 is driven by the electrodes 110 to oscillate in resonance. In some embodiments, an electric feedback loop is provided to allow the MEMS structure 102 to oscillate. The electrodes are mechanically connected or formed integrally with the side wall portions 106 but are electrically insulated from the side wall portions 106. In some embodiments, the MEMS structure 102 oscillates with a frequency above 1 MHz. In some embodiments, the MEMS structure 102 oscillates with a frequency above 20 MHz. In some embodiments, the MEMS structure oscillates with a frequency above 50 MHz.
The operation of the MEMS structure 102 at high frequencies is provided in embodiments at an air pressure much lower than atmospheric pressure or substantially at vacuum. For example, according to some embodiments, the air pressure in the cavity may be 1% of the ambient air pressure or lower. According to some embodiments, the air pressure may be below 5×102 Pascal (compared to an ambient atmosphere of about 105 Pascal). In some embodiments the air pressure may be below 102 Pascal. The low air pressure in the cavity reduces adverse air effects which increase with increasing oscillation frequency.
Within the cavity 104, a support structure 112 is provided for mechanically supporting a cover 114 shown in
As shown in
The support structure 112 may have in a top view (perpendicular to the main surface 100A) an elongated shape as shown in
The support structure 112 provides in some embodiments an intermediate mechanical support for the cover 114 only in a vertical direction. The support structure 112 has in some embodiments no other function than supporting the cover. The support structure 112 provides in embodiments no mechanical support in lateral directions or has a mechanical connection in lateral directions. The support structure 112 is in embodiments not laterally connected to a MEMS structure such as the MEMS structure 114 and provides no lateral support to structures other than the cover.
The laterally elongated shape of the support structure 112 may for example allow in some embodiments arranging the support structure 112 within an opening of the movable MEMS structure 102 as shown in
The laterally elongated shape of the support structure 112 may provide support over certain distances in the direction in which the cover needs more support while minimizing the space consumed for the support structure 112 in directions in which the cover 114 needs less or no support. In embodiments, the support structure 112 may be arranged within an opening of the MEMS structure 102 such as a slit-shaped opening shown in
As will be explained below in more detail, the intermediate support structure 112 allows providing the cover 114 thinner. For example, if the MEMS device 102 is provided in the center of the cavity 104, the providing of an opening in the MEMS structure 102 allows arranging the support structure 112 in the center and providing support for the cover 114 at preferred locations. The continuous extension of the support structure 112 in the direction of maximum lateral extension (x-axis in
In an example calculation for a nitride cover of square shape, the effect of providing a support structure 112 as a wall extending through a center can be shown. Assuming a thickness of the cover 112 to be h=500 nm, the length and width of the cover to be a=32.5 μm a Young's Modulus to be 153GPA and a Poisson Ratio to be u=0.054 with an air pressure difference (air pressure on outer side of the cover−air pressure on inner side of cover) p=10 kPa, the flexural rigidity D and the center displacement (w1) without support wall and the center displacement (w2) with support wall can be calculated to be
Distances between the MEMS structure 102 and the cover 114 may in some practical applications be in a range between 200 and 400 nm. It can be seen that without the support wall, the minimal distance between the MEMS structure 102 and the cover 114 may be very short and may not allow safe operation of the MEMS structure 102.
The embodiments described above distinguish from a straight forward way to obtain a stable cover for large area MEMS devices by increasing the thickness h of the cover. Embodiments described herein avoid such thick MEMS cover by providing support structures 112 which are arranged intermediate between the side walls 106 which support the cover at the lateral ends. With the reduction of the thickness of the cover, the integration of the MEMS devices in other semiconductor processes is significantly improved. Furthermore electrical contact structures penetrating through the cover can be easier manufactured for thinner covers.
The flow diagram starts at 302 with removing material of a substrate such that a MEMS structure and a laterally elongated support structure (i.e. a support structure having in a topview an elongated shape). At 304 a cover is formed such that the support structure provides mechanical support for the cover.
The removing of material may include for example one etching step or multiple etching steps for forming the MEMS structure and the laterally elongated support structure. The MEMS structure and the laterally elongated support structure may in embodiments be formed concurrently. However in other embodiments, the MEMS structure and the laterally elongated support structure may be formed subsequently. It becomes apparent that between the steps 302 and 304 and after step 304 other manufacturing processes are performed including for example the forming of conductive structures penetrating the cover in order to supply electrical signals to and from the MEMS structure.
In the above description, embodiments have been shown and described herein enabling those skilled in the art in sufficient detail to practice the teachings disclosed herein. Other embodiments may be utilized and derived there from, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure.
This Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.
Such embodiments of the inventive subject matter may be referred to herein, individually and/or collectively, by the term “invention” merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Thus, although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement calculated to achieve the same purpose may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon re-viewing the above description.
It is further to be noted that specific terms used in the description and claims may be interpreted in a very broad sense. For example, the terms “circuit” or “circuitry” used herein are to be interpreted in a sense not only including hardware but also software, firmware or any combinations thereof.
It is further to be noted that embodiments described in combination with specific entities may in addition to an implementation in these entity also include one or more implementations in one or more sub-entities or sub-divisions of said described entity.
The accompanying drawings that form a part hereof show by way of illustration, and not of limitation, specific embodiments in which the subject matter may be practiced.
In the foregoing Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus the following claims are hereby incorporated into the Detailed Description, where each claim may stand on its own as a separate embodiment. While each claim may stand on its own as a separate embodiment, it is to be noted that—although a dependent claim may refer in the claims to a specific combination with one or more other claims—other embodiments may also include a combination of the dependent claim with the subject matter of each other dependent claim. Such combinations are proposed herein unless it is stated that a specific combination is not intended. Furthermore, it is intended to include also features of a claim to any other independent claim even if this claim is not directly made dependent to the independent claim.
Furthermore, it is intended to include in this detailed description also one or more of described features, elements etc. in a reversed or interchanged manner unless otherwise noted.
Further, it is to be understood that the disclosure of multiple steps or functions disclosed in the specification or claims may not be construed as to be within the specific order. Therefore, the disclosure of multiple steps or functions will not limit these to a particular order unless such steps or functions are not interchangeable for technical reasons.
Furthermore, in some embodiments a single step may include or may be broken into multiple sub steps. Such sub steps may be included and part of the disclosure of this single step unless explicitly excluded.
