Treatments for controlling internal stress or strain in MEMS structures

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B81C1/00666

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

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B81C1/00666Treatments for controlling internal stress or strain in MEMS structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages having stress-relieving features
- Patent number 12,091,310
- Issue date Sep 17, 2024
- Apogee Semiconductor, Inc.
- David A. Grant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Damascene interconnect structure, actuator device, and method of ma...
- Patent number 11,987,493
- Issue date May 21, 2024
- Hamamatsu Photonics K.K.
- Daiki Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device manufacturing method, MEMS device, and shutter apparatu...
- Patent number 11,932,535
- Issue date Mar 19, 2024
- Sumitomo Precision Products Co., LTD
- Gen Matsuoka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Curved cantilever design to reduce stress in MEMS actuator
- Patent number 11,932,531
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS process power
- Patent number 11,716,906
- Issue date Aug 1, 2023
- QUALCOMM Technologies, Inc.
- Robert J. Littrell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,708,262
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical infrared sensing device and fabrication meth...
- Patent number 11,656,128
- Issue date May 23, 2023
- Industrial Technology Research Institute
- Chin-Jou Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microscale metallic CNT templated devices and related methods
- Patent number 11,542,156
- Issue date Jan 3, 2023
- CNT Holdings, LLC
- Robert C. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 11,505,450
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with a diaphragm having a slotted layer
- Patent number 11,323,823
- Issue date May 3, 2022
- Knowles Electronics, LLC
- Shubham Shubham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with suspension structure and method of making a MEMS d...
- Patent number 11,300,778
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Stephan Gerhard Albert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,267,693
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS process power
- Patent number 11,217,741
- Issue date Jan 4, 2022
- Vesper Technologies Inc.
- Robert Littrell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin film material transfer method
- Patent number 11,180,367
- Issue date Nov 23, 2021
- The University of Manchester
- Aravind Vijayaraghavan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,174,160
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity mems and related structures, methods of manufacture a...
- Patent number 11,111,138
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,111,139
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,104,572
- Issue date Aug 31, 2021
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,021,364
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Russell T. Herrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor that includes a stress decoupling structure
- Patent number 10,954,120
- Issue date Mar 23, 2021
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical z-inertial sensor
- Patent number 10,913,652
- Issue date Feb 9, 2021
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,906,803
- Issue date Feb 2, 2021
- International Business Machines Corporation
- Russell T. Herrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microscale metallic CNT templated devices and related methods
- Patent number 10,899,609
- Issue date Jan 26, 2021
- CNT Holdings, LLC
- Robert C. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 10,899,604
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temperature-compensated micro-electromechanical device, and method...
- Patent number 10,894,713
- Issue date Jan 19, 2021
- STMicroelectronics S.r.l.
- Ernesto Lasalandra
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Polycrystalline material having low mechanical strain; method for p...
- Patent number 10,766,778
- Issue date Sep 8, 2020
- Robert Bosch GmbH
- Andreas Hartlieb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,766,765
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microscale metallic CNT templated devices and related methods
- Patent number 10,745,272
- Issue date Aug 18, 2020
- Brigham Young University
- Robert C. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Devices with localized strain and stress tuning
- Patent number 10,723,614
- Issue date Jul 28, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
- Publication number 20240400377
- Publication date Dec 5, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRE...
- Publication number 20240300808
- Publication date Sep 12, 2024
- Analog Devices, Inc.
- Kemiao Jia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES
- Publication number 20240286890
- Publication date Aug 29, 2024
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MA...
- Publication number 20240279051
- Publication date Aug 22, 2024
- HAMAMATSU PHOTONICS K. K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR
- Publication number 20240182292
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FAILURE DETECTION METHOD, FAILURE DETECTION SYSTEM, AND ELECTROSPRA...
- Publication number 20240182291
- Publication date Jun 6, 2024
- Hitachi, Ltd
- Shun Kumano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240171918
- Publication date May 23, 2024
- Nisshinbo Micro Devices Inc.
- Takao FUKUTOME
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Support Device for One or More MEMS Components
- Publication number 20240101412
- Publication date Mar 28, 2024
- ROBERT BOSCH GmbH
- Joachim Friedl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) D...
- Publication number 20240067519
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Wesley Hamlin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MIRROR DEVICE
- Publication number 20240002219
- Publication date Jan 4, 2024
- Hamamatsu Photonics K.K.
- Tomoyuki IDE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PROCESS POWER
- Publication number 20230422623
- Publication date Dec 28, 2023
- QUALCOMM TECHNOLOGIES INC.
- Robert John LITTRELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device
- Publication number 20230294976
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Abhiraj Basavanna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR MEMS DEVICES
- Publication number 20230273423
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Toby Linder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MAKING MEMS MICROPHONE WITH AN ANCHOR
- Publication number 20230239641
- Publication date Jul 27, 2023
- Skyworks Solutions, Inc.
- Guofeng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION
- Publication number 20230234835
- Publication date Jul 27, 2023
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR
- Publication number 20230219806
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A MEMBRANE LAYER WITH SMOOTH STRESS-RE...
- Publication number 20230224657
- Publication date Jul 13, 2023
- INFINEON TECHNOLOGIES AG
- Alfons Dehe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD
- Publication number 20230166964
- Publication date Jun 1, 2023
- Rohm Co., Ltd.
- Nobuhisa YAMASHITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION OF MEMS STRUCTURES FROM FUSED SILICA FOR INERTIAL SENSORS
- Publication number 20230067030
- Publication date Mar 2, 2023
- Atlantic Inertial Systems Limited
- Christopher Paul Fell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL INFRARED SENSING DEVICE AND FABRICATION METH...
- Publication number 20230040320
- Publication date Feb 9, 2023
- Industrial Technology Research Institute
- Chin-Jou KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE
- Publication number 20220408196
- Publication date Dec 22, 2022
- DENSO CORPORATION
- Yuki OHARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BACKSIDE COATING OF SUSPENDED MEMS MIRROR ACTUATORS FOR STRESS MATC...
- Publication number 20220204338
- Publication date Jun 30, 2022
- Sae Won Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PROCESS POWER
- Publication number 20220199893
- Publication date Jun 23, 2022
- Vesper Technologies Inc.
- Robert J. Littrell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20220185656
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-HSIEN CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MA...
- Publication number 20210387852
- Publication date Dec 16, 2021
- Hamamatsu Photonics K.K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated circuit packages having stress-relieving features
- Publication number 20210371271
- Publication date Dec 2, 2021
- TallannQuest LLC DBA Apogee Semiconductor
- David A. Grant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES WITH SUPPORT STRUCTURES AND ASSOCIATED PRODUCTION METHODS
- Publication number 20210363001
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Treatments for controlling internal stress or strain in MEMS structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packages having stress-relieving features

Wafer level packaging of MEMS

Damascene interconnect structure, actuator device, and method of ma...

MEMS device manufacturing method, MEMS device, and shutter apparatu...

Curved cantilever design to reduce stress in MEMS actuator

MEMS process power

Manufacturing method of semiconductor structure

Microelectromechanical infrared sensing device and fabrication meth...

Microscale metallic CNT templated devices and related methods

Integration of stress decoupling and particle filter on a single wa...

MEMS device with a diaphragm having a slotted layer

MEMS device with suspension structure and method of making a MEMS d...

Manufacturing method of semiconductor structure

MEMS process power

Thin film material transfer method

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity mems and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Micromechanical sensor that includes a stress decoupling structure

Micromechanical z-inertial sensor

Planar cavity MEMS and related structures, methods of manufacture a...

Microscale metallic CNT templated devices and related methods

Integration of stress decoupling and particle filter on a single wa...

Temperature-compensated micro-electromechanical device, and method...

Polycrystalline material having low mechanical strain; method for p...

Planar cavity MEMS and related structures, methods of manufacture a...

Microscale metallic CNT templated devices and related methods

Devices with localized strain and stress tuning

Patents Applicationslast 30 patents

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRE...

DOUBLE LAYER MEMS DEVICES

DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MA...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR

FAILURE DETECTION METHOD, FAILURE DETECTION SYSTEM, AND ELECTROSPRA...

MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

Support Device for One or More MEMS Components

METHODS AND APPARATUS FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) D...

METHOD FOR MANUFACTURING MIRROR DEVICE

MEMS PROCESS POWER

Semiconductor Device

SYSTEM AND METHOD FOR MEMS DEVICES

METHOD OF MAKING MEMS MICROPHONE WITH AN ANCHOR

STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION

CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR

SEMICONDUCTOR DEVICES HAVING A MEMBRANE LAYER WITH SMOOTH STRESS-RE...

MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD

FABRICATION OF MEMS STRUCTURES FROM FUSED SILICA FOR INERTIAL SENSORS

MICROELECTROMECHANICAL INFRARED SENSING DEVICE AND FABRICATION METH...

MICROELECTROMECHANICAL SYSTEMS DEVICE

BACKSIDE COATING OF SUSPENDED MEMS MIRROR ACTUATORS FOR STRESS MATC...

MEMS PROCESS POWER

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MA...

Integrated circuit packages having stress-relieving features

MEMS DEVICES WITH SUPPORT STRUCTURES AND ASSOCIATED PRODUCTION METHODS