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B81B7/0058

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0058for protecting against damages due to external chemical or mechanical influences

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sound producing package structure including sound producing membran...
- Patent number 12,172,887
- Issue date Dec 24, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Drop resistant MEMS actuator-imager assembly package
- Patent number 12,145,839
- Issue date Nov 19, 2024
- Faez Ba-Tis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waterproof MEMS button device, input device comprising the MEMS but...
- Patent number 12,050,102
- Issue date Jul 30, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ingress protection mechanism
- Patent number 12,035,092
- Issue date Jul 9, 2024
- GM CRUISE HOLDINGS LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolated device package and method of manufacture
- Patent number 12,012,328
- Issue date Jun 18, 2024
- NXP USA, INC.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS nanotube based thermal neutron detector
- Patent number 11,994,635
- Issue date May 28, 2024
- The Government of the United States of America, as represented by the Secreta...
- Zishan Hameed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed, toughened glass package and method for produci...
- Patent number 11,993,511
- Issue date May 28, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 11,987,494
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with shock and vibration protection
- Patent number 11,975,961
- Issue date May 7, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed transparent cavity and package for same
- Patent number 11,975,962
- Issue date May 7, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Parasitic insensitive sampling in sensors
- Patent number 11,867,584
- Issue date Jan 9, 2024
- pSemi Corporation
- Vishnu Srinivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and forming method thereof
- Patent number 11,772,962
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Nang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated ultrasonic transducers
- Patent number 11,730,451
- Issue date Aug 22, 2023
- EXO IMAGING, INC.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures
- Patent number 11,736,866
- Issue date Aug 22, 2023
- Cirrus Logic Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged environmental sensor
- Patent number 11,718,519
- Issue date Aug 8, 2023
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detachable MEMS package top cover
- Patent number 11,673,795
- Issue date Jun 13, 2023
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,655,143
- Issue date May 23, 2023
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMs device and electronic device
- Patent number 11,594,670
- Issue date Feb 28, 2023
- Seiko Epson Corporation
- Chikara Kojima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a bondline structure and a diffusion barrier with...
- Patent number 11,505,451
- Issue date Nov 22, 2022
- Texas Instruments Incorporated
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic isolation system
- Patent number 11,459,231
- Issue date Oct 4, 2022
- United States Government as represented by the Secretary of the Army
- Clinton Blankenship
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin-film filter, thin-film filter substrate, method of manufacturi...
- Patent number 11,425,508
- Issue date Aug 23, 2022
- SAE Magnetics (H. K.) Ltd.
- Hiroshi Take
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor packages
- Patent number 11,401,158
- Issue date Aug 2, 2022
- ATLANTIC INERTIAL SYSTEMS, LIMITED
- Henry Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...
- Patent number 11,390,079
- Issue date Jul 19, 2022
- Seiko Epson Corporation
- Daisuke Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for bias suppression in a non-degenerate MEMS s...
- Patent number 11,390,517
- Issue date Jul 19, 2022
- Honeywell International Inc.
- Daniel Endean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and a manufacturing method thereof
- Patent number 11,388,525
- Issue date Jul 12, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibration isolator platform with electronic acceleration compensation
- Patent number 11,332,362
- Issue date May 17, 2022
- BLILEY TECHNOLOGIES, INC.
- Jay Mitchell
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Suspension for Resonators and MEMS Devices
- Publication number 20250011162
- Publication date Jan 9, 2025
- SiTime Corporation
- Nicholas MILLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROTATION RATE SENSOR WITH A MICROMECHANICAL STRUCTURE, AND METHOD F...
- Publication number 20250011163
- Publication date Jan 9, 2025
- ROBERT BOSCH GmbH
- Kaushik Krishna Rangharajan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE
- Publication number 20240351861
- Publication date Oct 24, 2024
- Japan Science and Technology Agency
- Osamu ISHITANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Parasitic Insensitive Sampling in Sensors
- Publication number 20240247991
- Publication date Jul 25, 2024
- MURATA MANUFACTURING CO., LTD.
- Vishnu Srinivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED ACOUSTIC COUPLER FOR MICRO-ELECTROMECHANICAL SYSTEMS MICROPH...
- Publication number 20240080631
- Publication date Mar 7, 2024
- GM Cruise Holdings LLC
- Anurup Guha
- B60 - VEHICLES IN GENERAL
Information Patent Application
MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF U...
- Publication number 20240051817
- Publication date Feb 15, 2024
- STMicroelectronics S.r.l.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20230389897
- Publication date Dec 7, 2023
- Exo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INGRESS PROTECTION MECHANISM
- Publication number 20230396908
- Publication date Dec 7, 2023
- GM Cruise Holdings LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20230382720
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE, MICROPHONE DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20230269543
- Publication date Aug 24, 2023
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...
- Publication number 20230146158
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Kaoru KISHIGUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Method of MEMS Transducer Element
- Publication number 20230146234
- Publication date May 11, 2023
- TE Connectivity Solutions GMBH
- Jean-Francois Le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING
- Publication number 20230100911
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...
- Publication number 20230084280
- Publication date Mar 16, 2023
- Meridian Innovation Pte Ltd
- Xintong ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20230067539
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Device with Cover Layer
- Publication number 20220396473
- Publication date Dec 15, 2022
- MEAS France
- Emilien Durupt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE...
- Publication number 20220380203
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l.
- Federico VERCESI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME
- Publication number 20220348457
- Publication date Nov 3, 2022
- SCHOTT AG
- Thomas Zetterer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20220348456
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION
- Publication number 20220234884
- Publication date Jul 28, 2022
- Bliley Technologies, Inc.
- Jay MITCHELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20220162058
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC ISOLATION SYSTEM
- Publication number 20220162057
- Publication date May 26, 2022
- United States Government as Represented by the Secretary of the Army
- CLINTON BLANKENSHIP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME
- Publication number 20220144627
- Publication date May 12, 2022
- SCHOTT AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DETACHABLE MEMS PACKAGE TOP COVER
- Publication number 20220144626
- Publication date May 12, 2022
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

for protecting against damages due to external chemical or mechanical influences

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sound producing package structure including sound producing membran...

Drop resistant MEMS actuator-imager assembly package

Waterproof MEMS button device, input device comprising the MEMS but...

Ingress protection mechanism

Stress isolated device package and method of manufacture

MEMS nanotube based thermal neutron detector

Hermetically sealed, toughened glass package and method for produci...

Wire-bond damper for shock absorption

MEMS package with shock and vibration protection

Hermetically sealed transparent cavity and package for same

Micromechanical sensor device having an ASIC chip integrated into a...

Parasitic insensitive sampling in sensors

Semiconductor package with built-in vibration isolation, thermal st...

MEMS package and forming method thereof

Integrated ultrasonic transducers

Semiconductor structures

Packaged environmental sensor

Microelectromechanical structure with bonded cover

Detachable MEMS package top cover

Semiconductor component and method for producing same

MEMs device and electronic device

Apparatus having a bondline structure and a diffusion barrier with...

Microelectronic isolation system

Thin-film filter, thin-film filter substrate, method of manufacturi...

Sensor packages

MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...

Systems and methods for bias suppression in a non-degenerate MEMS s...

MEMS microphone and a manufacturing method thereof

Bottom package exposed die MEMS pressure sensor integrated circuit...

Vibration isolator platform with electronic acceleration compensation

Patents Applicationslast 30 patents

Suspension for Resonators and MEMS Devices

ROTATION RATE SENSOR WITH A MICROMECHANICAL STRUCTURE, AND METHOD F...

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE

Parasitic Insensitive Sampling in Sensors

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEALED ACOUSTIC COUPLER FOR MICRO-ELECTROMECHANICAL SYSTEMS MICROPH...

MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF U...

MICROMECHANICAL STRUCTURE WITH BONDED COVER

INTEGRATED ULTRASONIC TRANSDUCERS

INGRESS PROTECTION MECHANISM

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

PACKAGE, MICROPHONE DEVICE, AND ELECTRONIC APPARATUS

PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...

Fabrication Method of MEMS Transducer Element

PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING

COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

PROTECTIVE BONDLINE CONTROL STRUCTURE

Sensor Device with Cover Layer

PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE...

HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME

STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

MICROELECTRONIC ISOLATION SYSTEM

HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME

DETACHABLE MEMS PACKAGE TOP COVER