SURFACE ACOUSTIC WAVE DEVICE

Abstract

A SAW device includes one or more surface acoustic wave element which comprises an interdigital transducer on a single crystal piezo-electric substrate and is flip-chip mounted on a base substrate through metal bumps. The IDT transducer is formed of a laminate film including an underlying layer made of titanium nitride or titanium and an aluminum layer. The underlying layer and Al layer are laminated sequentially on the single crystal piezo-electric substrate. The single crystal piezo-electric substrate is a 46°- or more rotation Y-cut X-propagation lithium tantalate substrate. The single crystal piezo-electric substrate may be a 64°-rotation Y-cut X-propagation lithium niobate substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a (111) pole diagram of an epitaxial aluminum layer deposited on 36°-rotation Y-X propagation LiTaO₃ single crystal piezo-electric substrate;

FIG. 2 is a (111) pole diagram of an epitaxial aluminum layer deposited on 39°-rotation Y-X propagation LiTaO₃ single crystal piezo-electric substrate;

FIG. 3 is a (111) pole diagram of an epitaxial aluminum layer deposited on 46°-rotation Y-X propagation LiTaO₃ single crystal piezo-electric substrate;

FIG. 4 is a (111) pole diagram of an epitaxial aluminum layer deposited on 48°-rotation Y-X propagation LiTaO₃ single crystal piezo-electric substrate;

FIG. 5 is a (111) pole diagram of an epitaxial aluminum layer deposited on 52°-rotation Y-X propagation LiTaO₃ single crystal piezo-electric substrate;

FIG. 6 is a (111) pole diagram of an epitaxial aluminum layer deposited on 64°-rotation Y-X propagation LiNbO₃ single crystal piezo-electric substrate; and

FIG. 7 is a conceptual diagram illustrating a SAW device according to one embodiment of the present invention.

Claims

1. A surface acoustic wave device including one or more surface acoustic wave element which comprises an interdigital transducer on a single crystal piezo-electric substrate and is flip-chip mounted on a base substrate through metal bumps, wherein: said interdigital transducer is formed of a laminate film including an underlying layer made of titanium nitride or titanium and an aluminum layer, said underlying layer and said aluminum layer being laminated sequentially on said single crystal piezo-electric substrate, andsaid single crystal piezo-electric substrate is a 46°- or more rotation Y-cut X-propagation lithium tantalate substrate.

2. A surface acoustic wave device including one or more surface acoustic wave element which comprises an interdigital transducer on a single crystal piezo-electric substrate and is flip-chip mounted on a base substrate through metal bumps, wherein: said interdigital transducer is formed of a laminate film including an underlying layer made of titanium nitride or titanium and an aluminum layer, said underlying layer and said aluminum layer being laminated sequentially on said single crystal piezo-electric substrate, andsaid single crystal piezo-electric substrate is a 64°-rotation Y-cut X-propagation lithium niobate substrate.

3. A surface acoustic wave device according to claim 1, wherein: said aluminum layer of said interdigital transducer is in a single crystal structure.

4. A surface acoustic wave device according to claim 2, wherein: said aluminum layer of said interdigital transducer is in a single crystal structure.

5. A surface acoustic wave device according to claim 1, wherein said aluminum layer of said interdigital transducer is in a twin structure.

6. A surface acoustic wave device according to claim 2, wherein said aluminum layer of said interdigital transducer is in a twin structure.