Derwent Abstract No. 95-183065 relating to JP 07-102095, Nisshin Electrical Co. Ltd., Apr. 18, 1994. |
Derwent Abstract No. 96-371391 relating to WO 96/23834, Schneider USA Inc. Aug. 8, 1996. |
Abstract of JP 6220231 (Fukui Ken Prefecture and Kurabo Ind. Ltd.) Nov. 2, 1994. |
Abstract of JP 05247198 (IBM Corp.) Jan. 11, 1994. |
Abstract of JP 3164246 (Shinetsu Chem. Ind.) Sep. 28, 1993. |
Abstract of JP 3064382 (Nippon Valqua Ind. Ltd. and Shinetsu Chem. Ind. Co. Ltd.) Sep. 28, 1993. |
Abstract of DE 3406637 (Leybald—Heraeus GMB) Sep. 25, 1993). |
N. Inayaki et al, J. Adhesion Sci. Technology, vol. 3, No. 8, pps. 637-649, Aug. 1989. |
L. Siperko et al, J. Adhesion Sci. Technology, vol. 3, No. 3, pps. 157-173 Mar. 1989. |
Kaplan et al, Surface and Interface Analysis, vol. 20, pps. 331-336, Dec., 1993. |
Liston et al, J. Adhesion Sci. Technology, vol. 7, pps. 1091-1127, Jul. 1993. |
Xie et al, J. Adhesion Sci. Technology, vol. 6, pps. 1411-1431, Jun. 1992. |