Claims
- 1. A method for cleaning a process chamber for semiconductor and/or flat panel display manufacturing, comprising the steps of: converting a feed gas to a cleaning gas in a remote location, wherein said feed gas does not clean the process chamber; and delivering said cleaning gas to the process chamber.
- 2. The method of claim 1, further comprising the step of: activating said cleaning gas outside the chamber prior to delivering said cleaning gas to the process chamber.
- 3. The method of claim 2, wherein said step of activating is performed through a means selected from the group consisting of a remote plasma source, a heat source, and an electrical source.
- 4. The method of claim 3, wherein said remote plasma source is selected from the group consisting of a microwave energy source and a radiofrequency energy source.
- 5. The method of claim 1, wherein said feed gas is HF.
- 6. The method of claim 5, wherein the cleaning gas is F.sub.2.
- 7. The method of claim 6, wherein the conversion is done by electrolysis.
- 8. A method for cleaning a process chamber for semiconductor and/or flat panel display manufacturing, comprising the steps of: converting a feed gas to a cleaning gas in a remote location, wherein the resulting gas is a mixture of the feed gas and the cleaning gas; transferring the resulting gas mixture to a trap, wherein the feed gas is converted into a liquid form, and the cleaning gas remains in a gaseous form; and delivering said cleaning gas to the process chamber.
- 9. The method of claim 8, prior to said step of delivering the cleaning gas to the process chamber, further comprising the step of: pumping the cleaning gas into a storage unit.
- 10. The method of claim 9, after the step of pumping the cleaning gas into a storage unit, further comprising the step of: activating the cleaning gas outside the chamber before delivering the cleaning gas to the chamber.
- 11. The method of claim 10, wherein said step of activating is performed through a means selected from the group consisting of a remote plasma source, a heat source, and an electrical source.
- 12. The method of claim 11, wherein said remote plasma source is is selected from the group consisting of a microwave energy source and a radiofrequency energy source.
- 13. The method of claim 8, wherein said feed gas is HF.
- 14. The method of claim 13, wherein the cleaning gas is F.sub.2.
- 15. The method of claim 14, wherein the conversion is done by electrolysis.
RELATED APPLICATIONS
[0001] This application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application No. 60/333,405, filed Nov. 26, 2001, entitled “System and Method for Generating a Non-Ozone Depleting Material,” which is hereby fully incorporated by reference and is related to United States Patent Application No. 10/038,745, filed Jan. 2, 2002, entitled “Method and System for On-Site Generation and Distribution of a Process Gas,” which is hereby fully incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60333405 |
Nov 2001 |
US |