Patent Application
20100091447
This disclosure generally relates to memory devices, and more particularly relates to a system and method for providing liquid cooling of memory devices.
As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements can vary between different applications, information handling systems can also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information can be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems can include a variety of hardware and software components that can be configured to process, store, and communicate information and can include one or more computer systems, data storage systems, and networking systems.
Memory modules and hard disk drives for workstations and desktops are sometimes placed in thermally restricting locations, such that it is difficult to obtain proper air flow to cool the memory modules and the hard disk drives. Thus, to provide proper amounts of thermal cooling to the memory module and hard disk drive, fans on the workstations and the desktops need to run at higher speeds or more fans need to be added to the workstations and the desktops. With an increase in either the fan speed or the number of fans, the acoustic level of the workstation and the desktop is also increased.
It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the Figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the drawings presented herein, in which:
The use of the same reference symbols in different drawings indicates similar or identical items.
The following description in combination with the Figures is provided to assist in understanding the teachings disclosed herein. The following discussion will focus on specific implementations and embodiments of the teachings. This focus is provided to assist in describing the teachings and should not be interpreted as a limitation on the scope or applicability of the teachings. However, other teachings can certainly be utilized in this application.
The micro-channel heat exchanger system 100 comprises an input channel 102, a plurality of micro-channel cold plates 104, and an output channel 106. The micro-channel cold plates 104 can be arranged in six parallel sections of two micro-channel cold plates each. Each section of micro-channel cold plates 104 is placed in physical communication with a dual sided circuit board 108 having a plurality of memory modules 110. The micro-channel cold plates 104 can extend the entire length of the memory modules 110. In different embodiments, the memory modules 110 can also be hard disk drives and the like.
In an embodiment, the micro-channel cold plates 104 are preferably predominantly aluminum, such that the micro-channel cold plates can be thermally efficient in removing heat from each of the memory modules 110. The micro-channel cold plates 104 can remove the heat produced by the memory modules 110 through physical communication with the memory modules, and/or via a thermal interface material (TIM) placed between the micro-channel cold plate and the memory module as described below with respect to
As the memory modules 110 operate, heat is produced which needs to be removed so that damage is not caused to the memory modules. The TIMs 202 are preferably thermally conductive such that the heat produced by the memory modules 110 can be transferred to the micro-channel cold plates 104 via the TIMs. In different embodiments, based on the topology of the circuit board 108 and the memory module 110, the composition of the TIMs 202 can be a thin gap pad of filler material, a layer of grease, a phase change material, and/or any other material capable of transferring heat from the memory module to the micro-channel cold plate 104. The input channel 102 preferably provides the fluid flow through each of the micro-channels 204, such that the same amount of fluid is provided to each of the micro-channels.
Thus, the micro-channel heat exchanger system 100 can provide even heat transfer from each of the memory modules 110 to the micro-channel cold plates 104, and out of the liquid cooling heat exchanger system via the fluid flow through the input channel 102, the micro-channel cold plates, and the output channel 104. The fluid also preferably increases the thermal performance of the micro-channel cold plates 104 by continually removing the heat produced by the memory module 110 and transferred to the micro-channel cold plates. The fluid can also reduce an amount of noise produced by the computer system to cool the memory modules 110, hard disk drives, and the like as compared to only using cooling fans to remove this heat. For example, the fluid and the micro-channel cold plates 104 can allow the cooling fans to be run at lower speeds, such that the noise produced by the cooling fans is reduced.
The micro-channel heat exchanger system 300 can provide ample thermal margin to reduce idle level acoustics without compromising thermal performance. For example, the ample thermal margin can differ based on the embodiment of the micro-channel heat exchanger system 300, such that the fluid can be cooled a proper amount so when the fluid re-enters the micro-channel cold plate 302 the necessary amount of heat can be transfer from the micro-channel cold plate to the fluid. Additionally, the micro-channel heat exchanger system 300 can reduce the noise produced while cooling the computer system by reducing fan noise, while maintaining the required thermal performance or amount of heat transfer from the memory modules 110, hard disk drive, and the like.
Additionally, the reliability of the hard disk drive can be increased through consistent drive temperatures created by the fluid flow through the micro-channels 306. The fluid is preferably water based, such that it has a relative high heat capacity, which allows for very stable temperatures over periods of transient loading. Thus, based on the fluid flow through the micro-channels 204 and 308, the micro-channel heat exchanger 100 and the single hard disk drive micro-channel heat exchanger system 300 can provide stable operating temperatures for the memory modules 110, the spindle and printed circuit board components 306, and the like.
Although only a few exemplary embodiments have been described in detail above, those skilled in the art will readily appreciate that many modifications are possible in the exemplary embodiments without materially departing from the novel teachings and advantages of the embodiments of the present disclosure. Accordingly, all such modifications are intended to be included within the scope of the embodiments of the present disclosure as defined in the following claims. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents, but also equivalent structures.
