System and method for removing foreign particles from semiconductor device

Abstract

A vibration device separates foreign particles from a semiconductor device, and a suction interface of a suction device covers an opening portion of the semiconductor device. A space connected with a vacuum passage and a communication passage is formed between the semiconductor device and the suction interface. The suction device suctions the space, and fresh air is introduced into the space through the communication passage. As a result, a current of air is generated from the communication passage to the vacuum passage, and foreign particles are suctioned and removed from the space.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1 is an illustration of semiconductor device manufacturing equipment including a foreign particle removal system according to an exemplary embodiment;

FIGS. 2A and 2B are components of the foreign particle removal system of FIG. 1 in more detail;

FIG. 3 shows operation of the foreign particle removal system during a vibration mode;

FIG. 4 is a graph showing a relationship between vibration and foreign particle removal of the foreign particle removal system;

FIG. 5 shows operation of the foreign particle removal system during a suction mode;

FIG. 6 shows operation of the foreign particle removal system according to an alternative exemplary embodiment; and

FIGS. 7A and 7B show schematic view showing a position of the communication hole.

Claims

1. A system for removing foreign particles from a semiconductor device, comprising; vibration means for vibrating the semiconductor device to separate the foreign particles from a surface of the semiconductor device;suction means for suctioning foreign particles separated from the semiconductor device by the vibration means; andan exhaust pump for switchably creating a vacuum between the vibration means and the semiconductor device, and between the suction means and the semiconductor device, whereinthe suction means further includes a communication passage connected to a fresh air source and a vacuum passage connected to the exhaust pump, and defines a space by covering the semiconductor device, the communication passage and the vacuum passage for generating a current of air from the communication passage through the space to the vacuum passage to remove the foreign particles separated from the semiconductor device from the space.

2. The system according to claim 1, wherein the vibration means vibrates the semiconductor device in a direction that is parallel to the surface of the semiconductor device.

3. The system according to claim 1, wherein the suction means covers the semiconductor device without touching the surface of the semiconductor device to hold the semiconductor device.

4. The system according to claim 1, wherein the vibration means simultaneously vibrates a plurality of semiconductor devices.

5. The system according to claim 4, wherein the suction means forms a plurality of spaces corresponding to the plurality of semiconductor device respectively to simultaneously suction the plurality of spaces.

6. The system according to claim 1, wherein the vibration means vibrates at a frequency equal to or less than 1 KHz.

7. The system according to claim 1, wherein the vibration means vibrates at a vibration acceleration of more than 1.1 G.

8. The system according to claim 1, wherein the vibration means vibrates the semiconductor device in a direction that is parallel to a surface of the semiconductor device.

9. The system according to claim 1, wherein the suction means suctions at a rate of approximately 3 liters per minute in the space.

10. The system according to claim 1, wherein a communication passage angled so that air flow does not directly impinge on the device surface.

11. A method of removing foreign particles from a semiconductor device comprising: covering the semiconductor device to define a space, the space being in communication with both an air communication passage and a vacuum passage;vibrating the semiconductor device to separate the foreign particles from the semiconductor device;suctioning the foreign particles from the semiconductor device by generating a current of air from the communication passage to the vacuum passage to remove the foreign particles separated from the semiconductor device during the vibrating from the space.

12. The method according to claim 11, wherein the vibrating comprises vibrating the semiconductor device in a direction that is parallel to the surface of the semiconductor device.

13. The method according to claim 11, wherein the suctioning comprises suctioning the space by covering the semiconductor device without touching a surface of the semiconductor device so that the semiconductor device is held in place.

14. The method according to claim 11, wherein the vibrating comprises simultaneously vibrating a plurality of semiconductor devices.

15. The method according to claim 14, wherein the suctioning comprises simultaneously suctioning a plurality of spaces respectively corresponding to a plurality of semiconductor devices.

16. A method of removing foreign particles from a semiconductor device comprising: covering the semiconductor device to define a space, the space being in communication with both an air communication passage and a vacuum passage;vibrating the semiconductor device to separate the foreign particles from the semiconductor device, and suctioning the foreign particles from the semiconductor device by generating a current of air from the communication passage to the vacuum passage to remove the foreign particles separated from the semiconductor device during the vibrating from the space simultaneously.