This application claims the benefit of Korean Patent Application No. 10-2007-0001183, filed on Jan. 4, 2007, in the Korean Intellectual Property Office, the contents of which are incorporated herein in their entirety by reference.
1. Field of the Invention
The present invention relates to a system and method for testing a semiconductor integrated circuit (IC) and, more particularly, to a system and method for testing a semiconductor integrated circuit (IC) in parallel.
2. Description of the Related Art
In general, a semiconductor device formed on a semiconductor substrate made of silicon, for example, is manufactured using a sequence of unit processes including a process of stacking layers, a process of doping an impurity, and photolithography and etching processes for patterning the layers. In order to determine whether each of the individual steps is properly performed to manufacture a semiconductor device having target design parameters, devices such as transistors, capacitors, resistors, and inductors, are inspected for defects or to evaluate the parameter characteristics after performing each of the unit processes.
In order to evaluate the characteristics of such devices, a semiconductor IC testing system for testing a semiconductor integrated circuit (IC) may be used. The semiconductor IC testing system applies electric signals to each of a plurality of semiconductor devices formed on a wafer and senses electric signals generated from the semiconductor devices. The semiconductor IC testing system can be a single type semiconductor IC testing system for probing a single test module at a time or a parallel type semiconductor IC testing system for testing a plurality of test modules in test module groups arranged at different locations on a wafer, simultaneously.
Referring to
In a conventional parallel type semiconductor IC testing system as illustrated in
The transistor tests S10 are performed by a transistor test program P10 loaded on the parallel type semiconductor IC, testing system, and the resistor tests S20 are performed by a resistor test program P20. In each of the tests S10 and S20, the tests can be performed in different test locations, at the same time.
As described above, in a conventional parallel type semiconductor IC testing system as illustrated in
The present invention provides a semiconductor IC testing system having an increased test speed and a high test throughput by testing a plurality of different types of semiconductor DUTs (device under test) in parallel.
The present invention also provides a semiconductor IC testing system that optimally uses its resources by testing semiconductor DUTs using all the resources of the system.
The present invention also provides a semiconductor IC test method for providing an increased test speed and a high test throughput by testing a plurality of different types of semiconductor DUTs in parallel.
The present invention also provides a semiconductor IC test method that optimally uses resources of an expensive testing system by testing semiconductor DUTs using all the resources of the system.
According to an aspect of the present invention, there is provided a system for testing semiconductor devices in parallel. The system includes a probe chuck for loading a plurality of different types of semiconductor DUTs. A test head provides a plurality of circuit sites to independently and simultaneously test the different types of semiconductor DUTs. A test controller controls the test head and the probe chuck.
The test head may include a probe card having a needle unit arranged to contact contact pads of the semiconductor DUTs; a pin board mounted on the probe card for inputting and outputting signals to the needle unit selected by a relay of a switching metric circuit; and a plurality of source monitor units connected to the pin board for generating and detecting the signals.
Each of the circuit sites may include a microprocessor.
Different types of test programs may be allocated to the circuit sites and may run independently. Different resources may be provided to each of the circuit sites. The controller may provide an operator interface for creating a test map.
The semiconductor DUTs may be one or more of a transistor, a capacitor and a resistor. The semiconductor DUTs may be formed on a scribe line disposed between dies on a wafer.
Since different types of test programs may be allocated to the circuit sites and run independently, the system according to the present embodiment can test different test items in parallel. Therefore, testing time is shortened, and throughput is increased.
According to another aspect of the present invention, there is provided a system for testing semiconductor devices in parallel. The system includes a probe chuck that can be loaded with different types of semiconductor DUTs. A test head provides two or more circuit sites that can be used as a single circuit site by combining allocated resources. A test controller controls the test head and the probe chuck.
The test head may include: a probe card having a needle unit arranged to contact contact pads of the semiconductor DUTs; a pin board mounted on the probe card for inputting and outputting signals to the needle unit selected by a relay of a switching metric circuit; and a plurality of source monitor units connected to the pin board for generating and detecting the signals.
Each of the circuit sites may include a microprocessor. Different types of test programs may be allocated to the circuit sites and may run independently. The test controller may provide an operator interface for creating a test map. Semiconductor DUTs may include a flash memory device. The semiconductor DUTs may be formed on a scribe line disposed between dies on a wafer.
The system according to the present embodiment includes at least two circuit sites that can be used as single circuit site by combining allocated resources. Since the semiconductor devices are tested using redundant test resources, the resources of such expensive test system are optimally utilized not to remain idle.
According to still another aspect of the present invention, there is provided a method of testing semiconductor devices in parallel. The method includes: providing a plurality of different types of semiconductor DUTs; selecting at least two different types of test items; selecting the different types of semiconductor DUTs arranged at different locations in order to test the test items; and testing the different types of semiconductor DUTs independently and simultaneously.
The semiconductor DUTs may be test devices formed at a scribe line arranged between dies of a semiconductor substrate.
In the testing of the different types of semiconductor DUTs, test resources allocated to the different types of semiconductor DUTs may be independently used. The method further include combining test resources allocated to the semiconductor DUTs, allocating and using the combined test resources for a large semiconductor DUT when the different types of semiconductor DUTs comprise the large semiconductor DUT requiring expanded test resources.
The foregoing and other objects, features and advantages of the invention will be apparent from the more particular description of preferred aspects of the invention, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.
In the specification, although terms “a first” and “a second” may be used to describe various members, parts, regions, and/or portions, it is obvious to those skilled in the art that members, parts, regions, and/or portions are not limited by the terms. The terms are used only to identify one member, part, region, or portion. Therefore, a first member, part, region, or portion may designate a second member, part, region, or portion.
Referring to
The test head 200 includes a probe card 202 including a plurality of needle units 201 arranged to contact a contact pad of one of the semiconductor DUTs on the wafer W, a pin board 204 mounted on the probe card 202 for inputting and outputting signals to a selected needle unit 201 by the relay of a switching metric circuit 203, and a plurality of source monitor units 205 connected to the pin board 204 for generating and detecting signals.
The probe card 202, the pin board 204, and the source monitor units 205 of the test head 200 can provide multiple circuit sites, for example, 36 independent circuit sites, in order to simultaneously test the plurality of semiconductor DUTs. Also, the test head 200 can provide a single circuit site formed by combining at least two circuit sites to share test resources.
A circuit site denotes a predetermined set of test resources for testing each of the semiconductor DUTs. A test resource may denote the number of contact pads of a semiconductor DUT, which is generally referred to as channels. The semiconductor DUTs arranged at the circuit site may include different test modules, each of which includes one type of predetermined test item, such as transistors, capacitors, and resistors. The different test modules may form one test module group, respectively or collectively. One test module group may be allocated to each die formed on the wafer W. Therefore, the circuit sites can be allocated to different test module groups according to an embodiment of the present invention, and the circuit sites can also be allocated to different test modules in one test module group according to another embodiment of the present invention.
The test controller 300 may be a computer such as a work station or a personal computer (PC), which can run a program for controlling the testing system. The circuit sites may be connected to the test controller 300 through a system bus. The test controller 300 may provide an operator interface in order to create a test map.
As described above, the circuit sites of the parallel type semiconductor IC testing system according to the embodiments of the present invention can independently perform different tests in order to test different test items or at least two circuit sites may be combined to function as one circuit site. The control program of the test controller 300 can address and control the circuit sites through the system bus in order to independently use test resources allocated to the circuit sites or in order to collectively use test resources allocated to the circuit sites by combining them into a single circuit site. Also, the test controller 300 can load an individual test program to each of the circuit sites. Therefore, the parallel type semiconductor IC testing system according to the embodiments of the present invention can effectively use test resources because it is possible to expand and concentrate the test resources of a parallel type semiconductor IC testing system.
Hereinafter, circuit sites according to various embodiments of the present invention will be described in detail.
Referring to
In order to simultaneously test different types of semiconductor devices DUT1, DUT2, . . . , DUTi, and DUTj, each of the circuit sites SITE1, SITE2, . . . , SITE N−1, and SITE N can be loaded with different types of test programs which can be run independently. For example, the semiconductor devices DUT1, DUT2, . . . , DUTi, and DUTj may be different types of test items such as a transistor, a capacitor, a resistor, and an inductor. In order to simultaneously test the semiconductor devices DUT1, DUT2, . . . , DUTi, and DUTj, different test programs may be loaded at the circuit sites SITE1, SITE2, . . . , SITE N−1, and SITE N and may run independently. Accordingly, test resources allocated to each of the circuit sites SITE1, SITE2, . . . , SITE N−1, and SITE N can be independently used.
According to some embodiments of the present invention, the circuit sites SITE1, SITE2, . . . , SITE N−1, and SITE N may have different test resources in order to test the different types of semiconductor devices DUT1, DUT2, . . . , DUTi, and DUTj. For example, one circuit site SITE1 may have 36 channels, and the other circuit sites SITE2, . . . , SITE N−1, and SITE N may each have 68 channels.
Referring to
For example, the semiconductor device DUT1 may be a transistor, the semiconductor device DUT2 may be a diode, the semiconductor device DUT3 may be a dielectric device, and the semiconductor device DUT4 may be a resistor. The semiconductor devices DUT1, DUT2, DUT3, and DUT4 may be dummy semiconductor devices for test, and may be formed on a scribe line between dies of a wafer.
The parallel type semiconductor IC testing system 100 arranges the semiconductor devices DUT1, DUT2, DUT3, and DUT4 formed on the semiconductor substrate W at circuit sites of the test head 200 using a probe chuck based on the defined test map. Then, the different types of the semiconductor devices DUT1, DUT2, DUT3, and DUT4 are simultaneously and independently tested by test programs P100, P200, P300, and P400, loaded on each of the circuit sites, thereby testing all of determined test items in test locations. As described above, the test result data for the different types of test items can be obtained through a single test according to the present embodiment. Therefore, the overall testing time can be shortened, and the testing throughput can be increased.
Referring to
As described above, the parallel type semiconductor IC testing system 2000 according to the present embodiment can provide one large circuit site having expanded resources by combining the resources of existing equipment. The parallel type semiconductor IC testing system 2000 can be effectively used under the current situation that semiconductor devices have become more complicated and their parameters have become more diversified. Also, the circuit sites SITE1, SITEx, and SITE N can also be loaded with different types of test programs which can be run independently and simultaneously in order to test different types of semiconductor devices DUT1, DUTx, and DUTj at the same time. Accordingly, the test resources allocated to each of the circuit sites can be independently used.
Referring to
In the parallel type semiconductor IC testing system 2000, the semiconductor device DUT1 can be tested by the circuit site SITE1 illustrated in
As described above, the parallel type semiconductor IC testing system according to the present invention includes a plurality of circuit sites for testing different types of semiconductor devices DUT simultaneously and independently. That is, different types of test items can be tested at the same time. Therefore, the overall testing time can be shortened and the test throughput can be increased.
The parallel type semiconductor IC testing system according to the present invention includes two or more circuit sites that can be used as a single circuit site by combining allocated resources. Since the semiconductor devices are tested using redundant test resources, the resources of such an expensive test system are optimally utilized not to remain idle.
In the parallel type semiconductor IC testing method according to the present invention, different types of semiconductor devices DUT can be tested independently and simultaneously. That is, by testing different types of test items in parallel, the overall testing time can be reduced and the test throughput can be increased.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Number | Date | Country | Kind |
---|---|---|---|
10-2007-0001183 | Jan 2007 | KR | national |