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The fast pace of product life cycles in the electronics and computer industry results in large amounts of obsolete electronic products. These electronic products represent a landfill problem. These products often have heavy metals that can seep into ground water and contaminate water supplies. Recent legislation in Europe, China and several US states now mandate that in the near future electronics' manufactures must to take back their products at the end of the products life. In addition, the stringent rules of many landfills no longer allow these products to be thrown away. One of the main problems in recycling electrical and electronics products is the circuit boards. The circuit boards and their components have most of the heavy metals and may contain lead, mercury, cadmium and chromium. All of which are being strictly regulated. Presently, the only way to separate and extract these metals is to expose the circuit board to high temperatures until the metals vaporize and then the specific heavy metal can be separated and recovered. Unfortunately, this process is expensive, requires a tremendous amount of energy and introduces toxic off gasses into the atmosphere.
Thus there exists a need for a process for recycling circuit boards.
A process for recycling printed circuit boards includes pyrolyzing a number printed circuit boards to from an ash. Metals from the circuit boards are separated from the ash by density separation techniques. The metals are formed into a slurry electrode. The slurry electrode and a deposition electrode are placed in an electrolyte bath and the metals are electrorefined to form bars of metal.
A process for recycling printed circuit boards includes pyrolyzing a number printed circuit boards to from an ash. Metals form the circuit boards are separated from the ash by density separation techniques. The metals are formed into a slurry electrode. The slurry electrode and a deposition electrode are placed in an electrolyte bath and the metals are electrorefined to form bars of metal.
In operation, the slurry electrode will contain many metals, such as copper, zinc and silver. The deposition electrode will be formed of the metal that has the lowest oxidation reduction potential, for example copper. The voltage will be increased until a current starts to flow. This results in the copper in the slurry electrode 52 being plated onto the deposition electrode 58. Once all the copper in the slurry electrode 52 is removed, the copper deposition electrode will be removed. Next a zinc electrode will be used as the deposition electrode. This is because the oxidation reduction potential of zinc is less than that of silver. The voltage is increased until current starts to flow. This results in the zinc in the slurry electrode being plated onto the deposition electrode 58. Once all the zinc is removed, the process is repeated for the silver using a silver electrode.
While the invention has been described in conjunction with specific embodiments thereof, it is evident that many alterations, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alterations, modifications, and variations in the appended claims.
The present invention claims priority on provisional patent application, Ser. No. 61/128561, filed on May 22, 2008, entitled “Printed circuit board Recycling Process” and is hereby incorporated by reference.
This invention was made in the performance of a Cooperative Research and Development Agreement with the Department of the Air Force. The Government of the United States has certain rights to use the invention
Number | Date | Country | |
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61128561 | May 2008 | US |