The present invention relates to a system-level architecture of power distribution and optical signal distribution for high-bandwidth integrated circuits integrated with thermal cooling solutions.
A silicon photonics package utilizes silicon-based materials to construct optical components, such as waveguides, modulators, detectors, and filters, which are integrated on a single chip. The package consists of a substrate on which the photonic integrated circuit (PIC) is mounted and connected to input/output (I/O) pads. The I/O pads serve the purpose of providing power to the PIC and electrical signaling of data. The substrate may be made of various materials, such as silicon, glass, or ceramic, based on the application's needs. For multi-wavelength links, an external laser source or a laser device transferred to a cavity in the silicon generates the wavelengths. The light from these lasers is coupled into waveguides on the chip, modulated, and transferred into a shared output waveguide, which is then coupled to external optical fiber or other optical components. This tightly integrated multiplexing operation is not always power-efficient due to losses at each stage in the optical path.
A system provides an electrical signal and electrical power delivery subsystem, an optical engine, an electrical interposer between the electrical signal and electrical power delivery subsystem and the optical engine, and an optical element configured to exchange optical signals with the optical engine and to exchange optical signals and optical power with an optical interface. Electrical signals and electrical power from the electrical interposer to the optical engine and optical signal delivery from the optical element to the optical engine are provided through a common plane on the optical engine. Optical signal from the optical interface to the optical element may enter perpendicular to the common plane or parallel to it.
In some systems, the optical element adjoins the electrical interposer. A cooling system may be provided on the other side of the optical engine from the electrical interposer, for example in direct contact with a bare semiconductor die on the optical engine. The cooling system may use air cooling, liquid cooling or multiple methods.
The electrical interposer may include a cutout so optical signals can be delivered to the optical engine through the cutout. The optical element can be a detachable component. Optical signals and electrical signals and electrical power are delivered to the optical engine via a common substrate. The optical element is packaged in the common substrate.
The optical engine may adjoin the electrical interposer and deliver optical signals through the cutout. This allows that system to be very thin, for example the thickness of the optical engine, the electrical interposer, and the optical element all combined is under 5 mm.
An energy-efficient, high-bandwidth communication system is enabled by coupling optical fiber to opto-electronics which are integrated with a silicon digital logic process. This system describes methods to minimize misalignment between the optical fiber and the management of electrical power and signal delivery, cooling, while keeping mechanical tolerance loops small.
Transfer-printed multi-wavelength optical devices are disposed on the surface of an electrical integrated circuit (EIC) with a compact multiplexor stacked for wavelength combination. This allows for higher bandwidth density.
Table 1 lists elements of the present invention and their corresponding reference
Table 1 shows elements in the following drawings with their reference numbers.
High-Performance computing power density requirements have increased with the computation speed and power over the years. Computing chips with high power density (>50 W/cm2) have had to employ complex heat dissipation solutions like composite materials with high thermal conductivity, extra-long fins for air-cooled solutions, cold blocks and/or immersion of electronics in a liquid material. Additionally, metal cover lids and thermal interface material between the chip and the cooling solution increases the overall thermal resistance of the system. The figures discussed below relate to a high-performance communication system where optical elements (i.e. optical lenses, fiber optics etc.) are coupled to opto-electronic devices, integrated circuits and/or packages to enable high-bandwidth through the system (>1 Tb/sec per optical channel). Key components have been disaggregated to breakdown mechanical tolerance loops, increase mechanical tolerance, increase system serviceability and/or a combination of any of the above. The key advantages of this system include but not limited to: 1) Physical separation of system-driving electronic components from Optical components to minimize thermal disturbance on the optical components; 2) System-level management of stack-up coefficient of thermal expansion (CTE) by modularizing the compute electronics into its standalone package; and 3) Mechanical tolerance loops are reduced to a minimum for looser system alignment.
Subsystem 100 provides electrical signals, inputs and outputs (I/Os), and power 164 to optical engine 130 via the electrical interposer 110. The electrical interposer 110 is generally used as an intermediate component to pitch match electrical connections 164 between the optical engine 130, with a dense pitch, to the power delivery subsystem 100. The optical engine 130 includes integrated circuits (not shown) and optoelectronic devices (not shown) that can transmit or receive optical 166 and electrical signals 164.
The optical signals 166, in multiple wavelengths 170, are sent from optical engine 130 to an optical element 120 to wavelength multiplex them into a single optical fiber core 140. The multi-wavelength optical signals 170, 166, 168 enable >1 Tb/s of connectivity. The highest power density is concentrated within the optical engine 130 so a cooling subsystem 150 is provided for the module to operate within a desired temperature range. The cooling subsystem 150 is in direct contact with the bare semiconductor die of the optical engine 130. The heat exchange 162 between the optical engine 130 and the cooling subsystem 150 is through physical contact of the said components. The physical contact may be improved by using an interlayer such as thermal interface material (not shown). The cooling subsystem 150 efficiency helps the optical element 120 to not degrade its performance during normal operation.
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While the exemplary preferred embodiments of the present invention are described herein with particularity, those skilled in the art will appreciate various changes, additions, and applications other than those specifically mentioned, which are within the spirit of this invention.
This application claims the benefit of pat. app. Nos. 63/330,164, entitled “Electrical and Optical Power and Signal Delivery to Opto-Electronic Integrated Circuits,” filed 12 Apr. 2022; and 63/336,562, entitled “System-Level Power and Signal Distribution and Thermal Cooling” filed 29 Apr. 2022; and incorporates them herein by reference.
Number | Date | Country | |
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63330164 | Apr 2022 | US | |
63336562 | Apr 2022 | US |