for integrated circuit devices

Industry

CPC
H01L23/50

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/50for integrated circuit devices

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Backside interconnect structures for semiconductor devices and meth...
- Patent number 12,159,869
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a back-side power rail
- Patent number 12,142,557
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header layout design including backside power rail
- Patent number 12,136,466
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haruki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical metal splitting using helmets and wrap-around dielectric s...
- Patent number 12,131,989
- Issue date Oct 29, 2024
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cell having stacked pick-up region
- Patent number 12,125,781
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device including a power supply line and method...
- Patent number 12,113,066
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having smart power stage and E-fuse solution
- Patent number 12,113,016
- Issue date Oct 8, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Prabal Upadhyaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of bus bars intersecting a plurality electrode
- Patent number 12,113,010
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Shigeto Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,113,011
- Issue date Oct 8, 2024
- Fuji Electric Co., Ltd.
- Hiroto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for operating an electric vehicle drive with improved...
- Patent number 12,107,027
- Issue date Oct 1, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power component configured for improving partial discharge performa...
- Patent number 12,107,039
- Issue date Oct 1, 2024
- Wolfspeed, Inc.
- Zach Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct power delivery to integrated circui...
- Patent number 12,107,047
- Issue date Oct 1, 2024
- Cisco Technology, Inc.
- Stephen Aubrey Scearce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-forwarding bridge for inter-chip data signal transfer
- Patent number 12,100,662
- Issue date Sep 24, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply device for avoiding data transmission conflict
- Patent number 12,086,002
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Takumi Yamada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 12,080,630
- Issue date Sep 3, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter module and inverter
- Patent number 12,081,136
- Issue date Sep 3, 2024
- SUNGROW POWER SUPPLY CO., LTD.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management integrated circuit with bleed circuit control
- Patent number 12,081,113
- Issue date Sep 3, 2024
- Lodestar Licensing Group LLC
- Matthew David Rowley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and integrated circuit in hybrid row height st...
- Patent number 12,074,069
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and semiconductor package s...
- Patent number 12,068,288
- Issue date Aug 20, 2024
- SOCIONEXT INC.
- Atsushi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,315
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Jungho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power grid, IC and method for placing power grid
- Patent number 12,067,337
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module
- Patent number 12,068,236
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL
- Publication number 20240421699
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Matthew David Rowley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Publication number 20240421101
- Publication date Dec 19, 2024
- Intel Corporation
- Sunny CHUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413151
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jungho DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL
- Publication number 20240404566
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haruki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240395622
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING STACKED PICK-UP REGIONS
- Publication number 20240395693
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Backside Interconnect Structures for Semiconductor Devices and Meth...
- Publication number 20240387529
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD...
- Publication number 20240387530
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH EMBEDDED TRACES
- Publication number 20240387350
- Publication date Nov 21, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Chip (SOC) Current Profile Model for Integrated Voltage R...
- Publication number 20240386170
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haohua Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CHIP HAVING A BACK-SIDE POWER RAIL
- Publication number 20240379527
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS
- Publication number 20240379624
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240379555
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-HSIANG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...
- Publication number 20240379738
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240363521
- Publication date Oct 31, 2024
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS
- Publication number 20240363522
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE S...
- Publication number 20240355786
- Publication date Oct 24, 2024
- SOCIONEXT INC.
- Atsushi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SYSTEM AND ELECTRICAL CONNECTOR FOR CHIP MODULE
- Publication number 20240356254
- Publication date Oct 24, 2024
- FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- CHIA-YEN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKS...
- Publication number 20240355819
- Publication date Oct 24, 2024
- Intel Corporation
- Quan SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
- Publication number 20240347386
- Publication date Oct 17, 2024
- Honeywell International Inc.
- James L. Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER AND UNDER INTERCONNECTS
- Publication number 20240347443
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347544
- Publication date Oct 17, 2024
- ULTRA DISPLAY TECHNOLOGY CORP.
- Hsien-Te CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Die Substrate with Edge-Mounted Capacitors
- Publication number 20240332223
- Publication date Oct 3, 2024
- NVIDIA Corporation
- Tracy Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240332083
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20240332174
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu LIN
- G06 - COMPUTING CALCULATING COUNTING

for integrated circuit devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside interconnect structures for semiconductor devices and meth...

Semiconductor device with spaced apart containers

Semiconductor device

Stiffener ring combined with ASIC power delivery

Power amplifier modules including semiconductor resistor and tantal...

Integrated chip having a back-side power rail

3D chip with shared clock distribution network

Header layout design including backside power rail

Vertical metal splitting using helmets and wrap-around dielectric s...

Cell having stacked pick-up region

Integrated circuit device including a power supply line and method...

Semiconductor package having smart power stage and E-fuse solution

Plurality of bus bars intersecting a plurality electrode

Semiconductor device and method of manufacturing the same

Power module for operating an electric vehicle drive with improved...

Power component configured for improving partial discharge performa...

Apparatus and method for direct power delivery to integrated circui...

Power-forwarding bridge for inter-chip data signal transfer

Power supply device for avoiding data transmission conflict

Power delivery structures

3D semiconductor device and structure with metal layers and a conne...

Inverter module and inverter

Power management integrated circuit with bleed circuit control

Structural elements for application specific electronic device pack...

Semiconductor device and integrated circuit in hybrid row height st...

Semiconductor integrated circuit device and semiconductor package s...

Multi-die fine grain integrated voltage regulation

Semiconductor device

Power grid, IC and method for placing power grid

Electronic module

Patents Applicationslast 30 patents

POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL

MIM Capacitor in IC Heterogenous Integration

BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS

SEMICONDUCTOR DEVICE

HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

INTEGRATED CIRCUIT HAVING STACKED PICK-UP REGIONS

Backside Interconnect Structures for Semiconductor Devices and Meth...

INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD...

PACKAGE WITH EMBEDDED TRACES

System on Chip (SOC) Current Profile Model for Integrated Voltage R...

INTEGRATED CHIP HAVING A BACK-SIDE POWER RAIL

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH CONNECTION PATHS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUITS WITH BACKSIDE POWER RAILS

POWER DELIVERY STRUCTURES

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE S...

CONNECTING SYSTEM AND ELECTRICAL CONNECTOR FOR CHIP MODULE

INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKS...

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

OVER AND UNDER INTERCONNECTS

ELECTRONIC DEVICE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

Chip Die Substrate with Edge-Mounted Capacitors

SEMICONDUCTOR DEVICE IN HYBRID ROW HEIGHT STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DEVICE AND METHOD