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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/50for integrated circuit devices

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Patents Grantslast 30 patents

Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 12,293,970
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices
- Patent number 12,288,788
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Inyeal Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform power integrity design including package standard power in...
- Patent number 12,278,175
- Issue date Apr 15, 2025
- Intel Corporation
- Xing Jian Cai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power distribution method
- Patent number 12,278,185
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on chip (SOC) current profile model for integrated voltage r...
- Patent number 12,271,667
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haohua Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-level power module
- Patent number 12,261,543
- Issue date Mar 25, 2025
- Danfoss Silicon Power GmbH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 12,255,129
- Issue date Mar 18, 2025
- Google LLC
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution structure and method
- Patent number 12,255,148
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating voltage regulators and passive circuit elements with to...
- Patent number 12,242,290
- Issue date Mar 4, 2025
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components for soft, flexible circuitry layers and metho...
- Patent number 12,230,579
- Issue date Feb 18, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 12,218,059
- Issue date Feb 4, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,935
- Issue date Jan 21, 2025
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiling device including substrates and data driving circuit
- Patent number 12,190,767
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Yu-Hsin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including frontside power mesh and backside po...
- Patent number 12,176,288
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside interconnect structures for semiconductor devices and meth...
- Patent number 12,159,869
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a back-side power rail
- Patent number 12,142,557
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header layout design including backside power rail
- Patent number 12,136,466
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haruki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical metal splitting using helmets and wrap-around dielectric s...
- Patent number 12,131,989
- Issue date Oct 29, 2024
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cell having stacked pick-up region
- Patent number 12,125,781
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING
- Publication number 20250167184
- Publication date May 22, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHO...
- Publication number 20250167127
- Publication date May 22, 2025
- LOOMIA Technologies, Inc.
- Madison Thea MAXEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device
- Publication number 20250157914
- Publication date May 15, 2025
- IMEC vzw
- James Edward Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20250142942
- Publication date May 1, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE
- Publication number 20250133779
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Adinath Shantinath Narasgond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250132259
- Publication date Apr 24, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118673
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...
- Publication number 20250105175
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer and Inverter Transistors Embedded in Interconnect Metal Layers
- Publication number 20250105134
- Publication date Mar 27, 2025
- Apple Inc.
- Xin Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096069
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250089335
- Publication date Mar 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Yuji KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081625
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masato KITSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...
- Publication number 20250029915
- Publication date Jan 23, 2025
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE AND QUANTUM DEVICE MANUFACTURING METHOD
- Publication number 20240429309
- Publication date Dec 26, 2024
- NEC Corporation
- Kunihiko ISHIHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL
- Publication number 20240421699
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Matthew David Rowley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Publication number 20240421101
- Publication date Dec 19, 2024
- Intel Corporation
- Sunny CHUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413151
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jungho DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL
- Publication number 20240404566
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haruki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING STACKED PICK-UP REGIONS
- Publication number 20240395693
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hui CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240395622
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Interconnect Structures for Semiconductor Devices and Meth...
- Publication number 20240387529
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS

for integrated circuit devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photonic wafer communication systems and related packages

Die interconnect substrate, an electrical device and a method for f...

Semiconductor structure and method for manufacturing thereof

3D chip sharing data bus

Integrated circuit devices

Platform power integrity design including package standard power in...

Power distribution method

System on chip (SOC) current profile model for integrated voltage r...

Three-level power module

Signal routing in integrated circuit packaging

Power distribution structure and method

Integrating voltage regulators and passive circuit elements with to...

Electronic components for soft, flexible circuitry layers and metho...

Stacked semiconductor device assembly in computer system

Stacked IC structure with orthogonal interconnect layers

Microelectronic assemblies having topside power delivery structures

Semiconductor device

Tiling device including substrates and data driving circuit

Cantilevered power planes to provide a return current path for high...

Semiconductor device including frontside power mesh and backside po...

Backside interconnect structures for semiconductor devices and meth...

Semiconductor device with spaced apart containers

Semiconductor device

Stiffener ring combined with ASIC power delivery

Power amplifier modules including semiconductor resistor and tantal...

Integrated chip having a back-side power rail

3D chip with shared clock distribution network

Header layout design including backside power rail

Vertical metal splitting using helmets and wrap-around dielectric s...

Cell having stacked pick-up region

Patents Applicationslast 30 patents

Stacked Semiconductor Device Assembly in Computer System

ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING

ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHO...

Wafer Level Integration of Passive Devices

Integrated Circuit Device

Multi-Die Fine Grain Integrated Voltage Regulation

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...

Buffer and Inverter Transistors Embedded in Interconnect Metal Layers

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

POWER MODULE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

Multi-Die Fine Grain Integrated Voltage Regulation

QUANTUM DEVICE AND QUANTUM DEVICE MANUFACTURING METHOD

POWER MANAGEMENT INTEGRATED CIRCUIT WITH BLEED CIRCUIT CONTROL

MIM Capacitor in IC Heterogenous Integration

BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS

SEMICONDUCTOR DEVICE

HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL

INTEGRATED CIRCUIT HAVING STACKED PICK-UP REGIONS

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

Backside Interconnect Structures for Semiconductor Devices and Meth...