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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/50for integrated circuit devices

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit in hybrid row height structure
- Patent number 12,369,389
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side power rail design and method of making same
- Patent number 12,368,078
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with connection paths
- Patent number 12,362,330
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for polishing and integrated circuit
- Patent number 12,359,090
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Organic light emitting diode display device
- Patent number 12,356,819
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Minsu Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Vertically integrated semiconductor device
- Patent number 12,349,445
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell having stacked pick-up region
- Patent number 12,334,428
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cell structures and power routing for integrated circuits
- Patent number 12,334,179
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 12,334,427
- Issue date Jun 17, 2025
- Mitsubishi Electric Corporation
- Masaomi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,327,807
- Issue date Jun 10, 2025
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 12,321,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 12,293,970
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices
- Patent number 12,288,788
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Inyeal Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform power integrity design including package standard power in...
- Patent number 12,278,175
- Issue date Apr 15, 2025
- Intel Corporation
- Xing Jian Cai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power distribution method
- Patent number 12,278,185
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on chip (SOC) current profile model for integrated voltage r...
- Patent number 12,271,667
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haohua Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-level power module
- Patent number 12,261,543
- Issue date Mar 25, 2025
- Danfoss Silicon Power GmbH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 12,255,129
- Issue date Mar 18, 2025
- Google LLC
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution structure and method
- Patent number 12,255,148
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating voltage regulators and passive circuit elements with to...
- Patent number 12,242,290
- Issue date Mar 4, 2025
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components for soft, flexible circuitry layers and metho...
- Patent number 12,230,579
- Issue date Feb 18, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 12,218,059
- Issue date Feb 4, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250218941
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250221011
- Publication date Jul 3, 2025
- BYD COMPANY LIMITED
- Rui HU
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT PACKAGE POWER STRUCTURE
- Publication number 20250218970
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY
- Publication number 20250218878
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM ARCHITECTURE HAVING EFFICIENT BUS CONNECTIONS
- Publication number 20250201769
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Seong Ju LEE
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20250204031
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Inyeal LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-LEVEL POWER MODULE
- Publication number 20250192691
- Publication date Jun 12, 2025
- DANFOSS SILICON POWER GMBH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING INDUCTOR DEVICES
- Publication number 20250194255
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Jason GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20250174561
- Publication date May 29, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING
- Publication number 20250167184
- Publication date May 22, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHO...
- Publication number 20250167127
- Publication date May 22, 2025
- LOOMIA Technologies, Inc.
- Madison Thea MAXEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device
- Publication number 20250157914
- Publication date May 15, 2025
- IMEC vzw
- James Edward Myers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
- Publication number 20250142942
- Publication date May 1, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE
- Publication number 20250133779
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Adinath Shantinath Narasgond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250132259
- Publication date Apr 24, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118673
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...
- Publication number 20250105175
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer and Inverter Transistors Embedded in Interconnect Metal Layers
- Publication number 20250105134
- Publication date Mar 27, 2025
- Apple Inc.
- Xin Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096069
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250089335
- Publication date Mar 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Yuji KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081625
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masato KITSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...
- Publication number 20250029915
- Publication date Jan 23, 2025
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS

for integrated circuit devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit in hybrid row height structure

Dual-side power rail design and method of making same

3D semiconductor device and structure with connection paths

Composition and method for polishing and integrated circuit

Semiconductor module with external power sensor

Organic light emitting diode display device

Vertically integrated semiconductor device

Cell having stacked pick-up region

Cell structures and power routing for integrated circuits

Semiconductor device

Semiconductor device with discrete blocks

High density substrate routing in package

Semiconductor device

Integrated circuit, system and method of forming the same

Photonic wafer communication systems and related packages

Die interconnect substrate, an electrical device and a method for f...

Semiconductor structure and method for manufacturing thereof

3D chip sharing data bus

Integrated circuit devices

Platform power integrity design including package standard power in...

Power distribution method

System on chip (SOC) current profile model for integrated voltage r...

Three-level power module

Signal routing in integrated circuit packaging

Power distribution structure and method

Integrating voltage regulators and passive circuit elements with to...

Electronic components for soft, flexible circuitry layers and metho...

Stacked semiconductor device assembly in computer system

Stacked IC structure with orthogonal interconnect layers

Microelectronic assemblies having topside power delivery structures

Patents Applicationslast 30 patents

POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

INTEGRATED CIRCUIT PACKAGE POWER STRUCTURE

LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY

COMPUTING SYSTEM ARCHITECTURE HAVING EFFICIENT BUS CONNECTIONS

INTEGRATED CIRCUIT DEVICES

THREE-LEVEL POWER MODULE

INTERPOSER INCLUDING INDUCTOR DEVICES

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING

Stacked Semiconductor Device Assembly in Computer System

ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHO...

Wafer Level Integration of Passive Devices

Integrated Circuit Device

Multi-Die Fine Grain Integrated Voltage Regulation

3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK

SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...

Buffer and Inverter Transistors Embedded in Interconnect Metal Layers

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

POWER MODULE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

Multi-Die Fine Grain Integrated Voltage Regulation