The disclosure relates to a liquid cooling device, particularly to a temperature controlling method of a liquid cooling device.
A liquid cooling device utilizes cooling liquid (such as water or coolant) to perform liquid cooling to an electronic heat-generating component.
A liquid cooling device includes an evaporator, a condenser, a cold water tube, a hot water tube, a pump and a cooling fan, which are connected with each other. The evaporator is adhered on an electronic heat-generating component. The cooling fan is disposed on the condenser. Thus, the liquid is driven by the pump to circularly flow between the evaporator, the condenser and the cold and hot water tubes to remove heat from the electronic heat-generating component and the heated liquid is cooled down in the condenser. As a result, the electronic heat-generating component can be cooled down by the liquid.
An electronic heat-generating component does not keep at the same temperature. In fact, heat from an electronic heat-generating component may be varied high and low in temperature due to operation or other reasons. The related-art liquid cooling device may be provided with one or more temperature sensors for responsively controlling both the thrust of the pump and the rotation speed of the cooling fan when the heat generated from an electronic heat-generating component are varied.
However, the temperature sensor is disposed at some specific positions of the liquid cooling device, so the temperature sensed is not an actual temperature. This affects the accuracy of measurement, and further affects the sensitivity and the response time of sensing. Thus, it cannot be applied in electronic products requiring high accuracy, high sensitivity and short response time.
Further, in the temperature control of the related-art liquid cooling device, the temperature sensors are connected to a central processing unit (CPU) to use the CPU for additionally processing and controlling thrust of the pump and the rotation speed of the cooling fan. The temperature control can be implemented, but the installing and uninstalling of the liquid cooling device involve the CPU. It is troublesome and inconvenient.
An object of the disclosure is to provide a temperature controlling method of a liquid cooling device, which possesses high accuracy, high sensitivity and short response time to perform the temperature control accurately.
To accomplish the above object, the disclosure provides a temperature controlling method of a liquid cooling device used for cooling by a liquid, which includes the steps of: providing a microprocessor and multiple flexible micro sensors; disposing the microprocessor on the liquid cooling device, wherein the liquid cooling device comprises an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor; and disposing each of the micro sensors in the cold water tube and the hot water tube respectively to directly contact with the liquid; and receiving, by the microprocessor, data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controlling the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.
In comparison with the related art, the disclosure has the effects of high accuracy, high sensitivity and short response time for performing the temperature control accurately.
In view of this, the inventors have devoted themselves to the above-mentioned related art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems. Finally, the disclosure which is reasonable and effective to overcome the above drawbacks is provided.
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
Please refer to
The temperature controlling method of the liquid cooling device of the disclosure includes a providing step S101, a disposing step S103 and a processing and controlling step S105.
In the providing step S101, a temperature control structure is provided. The temperature control structure includes a microprocessor 1 and multiple micro sensors 2. The micro sensors 2 are flexible. The micro sensor 2, as shown in
In the disposing step S103, the microprocessor 1 is disposed to the liquid cooling device. For example, the temperature control structure further includes a circuit board (not shown in figures). The microprocessor 1 is disposed on the circuit board. Thus, in the disposing step S103, the circuit board and the microprocessor 1 may be collectively disposed in the condenser 52 and isolated from the liquid in the condenser 52. The micro sensors 2, whose sizes are considerably small and thin, are disposed in the cold water tube 53 and the hot water tube 54 (as shown in
All inner walls of the evaporator 51, the condenser 52, the cold water tube 53 and the hot water tube 54 are non-flat or non-planar surfaces, but because the flexible sheet 21 of the micro sensor 2 is bendable and foldable, the flexible sheet 21 can be firmly adhered on the non-flat or non-planar inner walls. For example, as shown in
In the processing and controlling step S105, the microprocessor 1 receives actual data sensed in the cold water tube 53 and the hot water tube 54 by the micro sensors 2 to calculate after data is received as shown in
It is noted that the component used to receive and process (calculate) the sensed data in the disclosure is the microprocessor 1 disposed in the liquid cooling device. Therefore, the authority of the temperature control is changed from the CPU of the electronic product to the microprocessor 1 of the liquid cooling device. As a result, the design of a liquid cooling device may be completely and fully implemented by manufactures without being limited by the CPUs with different specifications.
In detail, as shown in
The micro sensing units includes at least one micro temperature sensing unit 2a, at least one micro voltage sensing unit 2b and at least one micro humidity sensing unit 2c. In other words, the micro sensor 2 may sense the temperature, the voltage and the humidity. In some embodiments, the micro sensor 2 further includes a micro heating unit 3 arranged correspondingly to at least one micro humidity sensing unit 2c. The micro heating unit 3 may shorten the response time of the micro humidity sensing unit 2c from 30 minutes to a few seconds.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.