Patent Application
20250172612
Embodiments according to the invention relate to a test arrangement for over-the-air testing, in particular using a device-under-test socket.
Embodiments according to the invention relate to a socket for over the air testing of L-shaped antenna in Package modules with automated test equipment.
Test arrangements can be used to test devices under test (e.g., an antenna in package device) that are capable of receiving and/or emitting electromagnetic radiation. Commonly the device under test has a flat shape with two opposite surfaces such that, for example, the device under test can be mounted in a device-under-test socket (e.g., an over the air (OTA) socket for radiating near field testing of antenna-in-package devices) such that one of the surfaces faces the device-under-test socket and the other surface faces away from the device-under-test socket. For example, one may orient the device under test such that a surface of the device under test with an antenna faces away from the device-under-test socket.
However, the shape of the device under test may not be planar. For example, the device under test may have an angular shape such as an L-shape. Furthermore, an angled device may be configured to emit and/or receive electromagnetic radiation at at least one outer surface. For example, an angular shaped device under test may have one or more antenna arrays (or other antennas) on one or two outer surfaces. As a result, the angular device under test may have a connector and/or die on an inner surface, which is commonly a less accessible surface.
An angled device under test poses challenges in regards to coupling to a socket, electrical contacting with a socket, and orientation of the device under test, which can all affect testing efficiency, accuracy and reproducibility.
Therefore, there is a need for a test arrangement that improves a compromise between testing efficiency, accuracy and reproducibility.
An embodiment may have a test arrangement for over-the-air testing an angled device under test, wherein the test arrangement has a carrier structure; wherein the test arrangement has a device-under-test socket which is coupled to the carrier structure, wherein the device-under-test socket is configured to establish an electrical contact with an inner surface of the angled device under test or with a connector which is arranged on the inner surface of the angled device under test.
Another embodiment may have a test arrangement for over-the-air testing an angled device under test, wherein the test arrangement has a carrier structure; wherein the test arrangement has a device-under-test socket which is coupled to the carrier structure, wherein the device-under-test socket is configured to establish an electrical contact with an inner surface of the angled device under test or with a connector which is arranged on the inner surface of the angled device under test, and wherein the device-under-test socket is configured to position the angled device-under-test
An embodiment of the invention is directed at a test arrangement for over-the-air testing an angled (e.g. L-shaped) device under test (e.g. a L-shape Antenna-in-package device under test), wherein the test arrangement comprises a carrier structure (e.g. a PCB test fixture or a loadboard), wherein the test arrangement comprises a device-under-test socket which is coupled to the carrier structure (e.g. the PCB test fixture or the load board) (e.g. directly or with an extender assembly and/or a PCB interposer in between the carrier structure and the device-under-test socket), wherein the device-under-test socket is configured to establish an electrical contact with an inner surface of the angled (e.g. L-shaped) device under test (e.g. with an inner surface of the angled device under test which is opposite to a second outer surface of the angled device under test) or with a connector which is arranged on the inner surface of the angled (e.g. L-shaped) device under test.
The device-under-test socket allows coupling the angled device under test with the test arrangement. Furthermore, the electrical contact allows transmission (unidirectional or bidirectional) of at least one of electrical power, one or more control signals, a measurement signal, or signals between the test arrangement and the device under test coupled to the device-under-test socket. Since the electrical contact is established with the inner surface of the angled device under test, outer surfaces can be arranged to face away from the device-under-test socket. Such an orientation allows testing the angled device under test by itself (e.g., testing its energy consumption during emission or interaction between antenna arrays of the angled device under test) and also allows testing the angled device using one or more external antenna structures (e.g. using a measurement antenna which wirelessly receives a signal transmitted by the angled device under test, and/or using a test antenna which transmits a signal that is wirelessly received by the angled device under test). The design of the device-under-test socket allows advantageously arranging one or more antenna arrays (or one or more other antennas, such as one or more single antennas), which are included on one more of the outer surfaces of the angled device under test, relative to such one or more external antenna structures (e.g. one or more test antenna structures). As a result, the one or more external antenna structures (e.g., for testing one or more antennas or antenna arrays of the device under test, or one or more transmit paths of the device under test, or one or more receive paths of the device under test) can be arranged such that the angled antenna device is between the device-under-test socket and the one or more external antenna structures. Furthermore, the outer surfaces of the angled device under test can therefore be mechanically contacted in order to hold the angled device under test coupled to the device-under-test socket (e.g. by pressing the angled device under test into the device under test socket).
According to an embodiment, the device-under-test socket is configured to position the angled device-under-test such that a first outer surface of the angled (e.g. L-shaped) device under test (e.g. a surface comprising a radiating structure) is spaced apart from a surface (e.g. a main surface) of the carrier structure (e.g., of the loadboard), and such that a surface normal of the first outer surface of the angled (e.g. L-shaped) device-under-test is parallel, within a tolerance of +/−15 degrees, to the surface (e.g. main surface) of the carrier structure (e.g., of the loadboard).
It has been recognized that the design of the device under test socket allows to carry a device under test such that a surface normal of the first outer surface of the device under test may be substantially parallel to the surface of the carrier structure. Consequently one or more antennas, or an antenna array, that may be arranged on the first outer surface of the device under test can have a transmission direction (e.g., of a main lobe) which is at least substantially parallel to the surface of the carrier structure. As a result, a position of an antenna structure (e.g. of a test antenna for testing the device under test) can be selected along the surface of the carrier structure. Such a placement of the antenna structure (e.g. of the test antenna) can be mechanically advantageous, since the carrier structure may serve as a carrier for the antenna structure. For example, the surface of the carrier structure can be used as a guide for determining a position and/or an orientation of the antenna structure.
Since the first outer surface is arranged spaced apart from the surface of the carrier, interaction with a carrier surface (e.g. a surface of the carrier structure) can be reduced or eliminated, such as short circuiting, reflection, and interferences.
According to an embodiment, the device-under-test socket is configured to position the angled device-under-test such that a second outer surface of the angled (e.g. L-shaped) device under test (e.g. a surface comprising a radiating structure) is facing away from the carrier structure, and such that a surface normal of the second outer surface of the angled (e.g. L-shaped) device-under-test is perpendicular, within a tolerance of +/−15 degrees, to the surface of the carrier structure (e.g., of the loadboard).
Such a design of the device-under-test socket allows for an efficient testing of devices under test comprising antenna structures on two outer surfaces. It has been recognized that the design of the device under test socket allows to carry a device under test such that a surface normal of the second outer surface of the device under test may be substantially perpendicular to the surface of the carrier structure. Consequently one or more antennas, or an antenna array, that may be arranged on the second outer surface of the device under test can have a transmission direction (e.g., of a main lobe) which is at least substantially perpendicular to the surface of the carrier structure. However, it has been recognized it is possible with reasonable effort to place an external antenna (e.g. a test antenna) in such a manner that it is well aligned to the antenna structure on the second outer surface of the device under test.
Moreover, it has been recognized that the above mentioned design of the device under test socket allows applying a force onto the second outer surface (e.g., for holding the angled device under test) that is orientated at least essentially perpendicular to the surface of the carrier structure.
According to an embodiment, an area of the carrier structure (e.g. loadboard) which is adjacent (e.g. with spacing in between) to the first outer surface of the angled device-under-test (e.g. an area of the carrier structure, e.g. loadboard, which is adjacent to projection of an outward (outbound) surface normal of the first outer surface of the angled device under test onto the loadboard) is free from power planes and/or free from ground planes. The adjacent area may be arranged in a half space through the device-under-test socket or device under test that comprises the first outer surface. The adjacent area may be adjacent (e.g. with a spacing in between) to the first outer surface of the angled device-under-test (e.g. in an area which is adjacent to a projection of an outward (outbound) surface normal of the first outer surface of the angled device under test onto the carrier structure, e.g. loadboard)
It has been recognized that power planes and/or ground planes can negatively impact reception and/or transmission of electromagnetic radiation by the device under test (e.g., beam forming). Since the adjacent area is free from power planes and/or free from ground planes, the effect on the electromagnetic radiation may be reduced and accuracy of the testing of the angled device under may be improved (e.g. in the case that an antenna structure is arranged on the first outer surface).
According to an embodiment, an area of the carrier structure (e.g. loadboard) which is adjacent (e.g. with a spacing in between) to the first outer surface of the angled device-under test (e.g. an area of the carrier structure, e.g. loadboard, which is adjacent to a projection of an outward (outbound) surface normal of the first outer surface of the angled device under test onto the carrier structure, e.g. loadboard) is free from metallization.
It has been recognized that metallization of the adjacent area can negatively impact transmission and/or reception of electromagnetic radiation (e.g., beam forming), e.g., in the case that an antenna structure is arranged on the first outer surface. Since the adjacent area is free from metallization, the effect on the electromagnetic radiation may be reduced and accuracy of the testing of the angled device under may be improved.
According to an embodiment, an absorber material is arranged on the carrier structure (e.g. loadboard) in an area which is adjacent (e.g. with a spacing in between) to the first outer surface of the angled device-under-test (e.g. in an area which is adjacent to a projection of an outward (outbound) surface normal of the first outer surface of the angled device under test onto the carrier structure, e.g. loadboard). The absorber material may comprise a radio frequency absorber material (e.g., rubberized foam material impregnated with carbon and/or iron).
The absorber material reduces reflection and/or interferences. As a result, accuracy of the testing of the angled device under may be improved, e.g. in the case that an antenna structure is arranged on the first outer surface.
According to an embodiment, the device-under-test socket is configured to position the angled device-under-test such that a spacing between the first outer surface of the angled device under test and the carrier structure (e.g. loadboard) is at least 2 wavelengths (e.g. free-space wavelengths, or wavelengths in a medium between the first outer surface of the angled device under test and the carrier structure) at a lowest frequency of operation of the angled device under test (e.g. at a lowest frequency of operation of an Antenna-in-Package (AiP) module that makes up the device under test or that is included in the device under test).
It has been recognized effects on emission and/or reception (e.g., beamforming, reflections, formation of standing waves, and interferences) of one or more antenna arrays that may be arranged on the first outer surface and that may be caused by the carrier structure are significantly reduced at such distance.
According to an embodiment, the device-under-test socket is attached to (e.g. arranged on) a daughter board, which is mounted to the carrier structure (e.g. test fixture PCB or load board), with a spacing between the daughter board and the load board (e.g., wherein the spacing between the daughter board and the load board is, for example, provided using a stiffener, and, wherein, for example, an electrical connection between the daughter board and the load board is provided using an electrical connector (e.g. using an array connector for digital/power signals and optionally also for IF RF signals).
A daughter board allows easier upgrading of older testing arrangement and changing between different device-under-test sockets by using different daughter boards. Furthermore, the spacing between the daughter board and the load board establishes a spacing between the angled device under test and the carrier structure (e.g., of at least two wavelengths at a lowest frequency of operation of the angled device under test). For example, the spacing can be established particularly reliable by using a stiffener. The daughterboard can further support electrical wiring, auxiliary circuits and connectors. For example, the daughterboard may support a coaxial connector that may be electrically connected to the device-under-test socket for enabling an electrical connection to the device under test when coupled to the device-under-test socket.
According to an embodiment, the test arrangement comprises a first antenna or antenna structure (e.g. a single aperture antenna (e.g. dual linear polarized or circular polarized)) configured to receive a signal radiated from the first outer surface of the angled device under test and/or configured to emit a signal to be received at the first outer surface of the angled device.
The first antenna or antenna device allows establishing an over the air connection with a device under test in the device-under-test socket. Therefore, the first antenna or antenna structure allows testing the device under test. The device-under-test socket allows orienting the device under test in a defined way such that the first antenna or antenna structure can be accurately oriented relative to the angled device under test (or such that an accurate alignment between the first antenna or antenna structure and the angled device under test can be achieved).
According to an embodiment, the test arrangement comprises a first antenna or antenna structure (e.g. a single aperture antenna (e.g. dual linear polarized or circular polarized)), wherein an aperture of the first antenna or antenna structure is arranged at a distance from the first outer surface of the angled device under test, such that a surface normal of the first outer surface of the angled device under test extends through the aperture of the first antenna or antenna structure (e.g., at least when the second antenna or antenna structure is placed at an operation position).
The first outer surface may have or be configured to emit and/or receive (e.g., by beamforming) a main lobe in a direction perpendicular to the first outer surface. By arranging the surface normal of the first outer surface through the aperture of the first antenna or antenna structure (or, in other words, by placing the first antenna such that the surface normal extends through the aperture of the first antenna), reception and/or emission of the first antenna or antenna structure may be improved and a good electromagnetic coupling between the first antenna or antenna structure and an antenna of the device under test can be achieved.
According to an embodiment, the first antenna or antenna structure is mounted to have a fixed position with respect to the device-under-test socket.
Such a fixed position allows repeated coupling and testing of a plurality of angled device under tests, wherein accuracy and reproducibility of the testing may be improved. Moreover, it should be noted that using the mentioned arrangement, the first antenna or antenna structure may, in some cases, not be in a handler path and consequently does not need to be removed when the device under test is exchanged by a handler.
According to an embodiment, the first antenna or antenna structure (or a second antenna or antenna structure) is mechanically attached to an arm of a handler (e.g., which is configured to insert the angled device under test into the device-under-test socket), such that the first antenna or antenna structure (or the second antenna or antenna structure) is moveable.
The arm allows the first antenna or antenna structure (or the second antenna or antenna structure) to be movable, which enables removal of the first antenna or antenna structure (or of the second antenna or antenna structure) (e.g., for easier coupling of the angled device under test to the device-under-test socket) or readjustment of the first antenna or antenna structures (or if the second antenna or antenna structure). In the case of the handler being configured to insert the angled device under test into the device-under-test socket, the handler may facilitate coupling and positioning the first antenna or antenna structure (or of the second antenna or antenna astructure) during or after coupling of the angled device under test to the device-under-test socket.
According to an embodiment, the first antenna or antenna structure (or the second antenna or antenna structure) is configured to be connected with a signal source and/or with a signal receiver via a blind-mating microwave connection (e.g. via a blind mating waveguide connection) when the handler has placed the first antenna or antenna structure (or the second antenna or antenna structure) in an operating position (or, equivalently, when the handler has inserted the angled device under test into the test socket, or when the handler pushes the device under test into the test socket).
The signal source and/or a signal receiver enables the first antenna or antenna structure (or the second antenna or antenna structure) to emit a signal (e.g., to be received by an antenna or antenna array of the angled device under test) and/or to receive a signal (e.g., emitted by an antenna or antenna array of the angled device under test), and therefore facilitates testing of the angled device under test. The blind-mating microwave connection facilitates (e.g., manual and/or automatic) coupling between the signal source and/or a signal receiver and the first antenna or antenna structure (or between the signal source and/or a signal receiver and the second antenna or antenna structure).
According to an embodiment, the test arrangement comprises a second antenna or antenna structure (e.g. a single aperture antenna (e.g. dual linear polarized or circular polarized)) configured to receive a signal radiated from the second outer surface of the angled device under test and/or to emit a signal to be received at the second outer surface of the angled device under test (e.g., at least when the second antenna or antenna structure is placed at an operation position) (e.g., or, equivalently, when the handler has inserted the angled device under test into the test socket, or when the handler pushes the device under test into the test socket).
The second antenna or antenna structure allows testing an antenna structure on the second outer surface and/or the device under test. The second antenna or antenna structure benefits from an orientation of the second outer surface defined by the device-under-test socket. The first and second antenna or antenna structure allow to test the device under test using signals emitted by and/or received by the first and second outer surface (e.g., simultaneously or successively) without having to recouple the angled device under test at a different orientation (e.g., or at a different device-under-test socket).
According to an embodiment, the test arrangement comprises a second antenna or antenna structure (e.g. a single aperture antenna (e.g. dual linear polarized or circular polarized)), wherein an aperture of the second antenna or antenna structure is arranged at a distance from the second outer surface of the angled device under test such that a surface normal of the second outer surface of the angled device under test extends through the aperture of the second antenna or antenna structure (e.g., at least when the second antenna or antenna structure is placed at an operation position) (e.g., or, equivalently, when the handler has inserted the angled device under test into the test socket, or when the handler pushes the device under test into the test socket).
The second outer surface may have or be configured to emit and/or receive (e.g., by beamforming) a main lobe in a direction perpendicular to the second outer surface. By arranging the surface normal of the second outer surface through the aperture of the second antenna or antenna structure (or, in other words, by placing the second antenna such that the surface normal extends through the aperture of the second antenna), reception and/or emission of the second antenna or antenna structure may be improved and a good electromagnetic coupling between the second antenna or antenna structure and an antenna of the device under test can be achieved.
According to an embodiment, the second antenna or antenna structure is mechanically attached to an arm of a handler (e.g., which is configured to insert the angled device under test into the device-under-test socket), such that the second antenna or antenna structure is moveable. The first and second antennas or antenna structures may, for example, be attached to the same/common arm or may each be attached an individual arm.
The arm allows the second antenna or antenna structure to be movable, which enables removal of the second antenna or antenna structures (e.g., for easier insertion/coupling of the angled device under test to the device-under-test socket) or readjustment of the second antenna or antenna structures. In the case of the handler being configured to insert the angled device under test into the device-under-test socket, the handler facilitates coupling and positioning the first antenna or antenna structure during coupling of the angled device under test to the device-under-test socket. In case of a common arm, the first and second antenna structures may be arranged in a pre-determined orientation for facilitating orientating the first and second antenna structures relative to the first and second outer surfaces. In case of separate arms, customized orientations of the first and second antenna structures are enabled.
According to an embodiment, the second antenna or antenna structure is part of a pusher for pushing the angled device under test into the device-under-test socket, or the second antenna or antenna structure is configured to be moveable together with a pusher for pushing the angled device under test into the device-under-test socket (wherein, for example, the pusher is arranged such that the pusher, or a part of the pusher, is in between the second antenna or antenna structure and the second outer surface of the angled device under test when the device under test in inserted into the device-under-test socket) (and/or wherein, for example, the pusher is arranged such that the pusher, or a part of the pusher, is in between the first antenna and the first outer surface of the angled device under test when the angled device under test is inserted into the device-under-test socket).
The second antenna or antenna structure is movable with the pusher and can therefore be moved (e.g., for easier coupling of the angled device under test to the device-under-test socket) or readjusted (e.g., by adapting an orientation thereof). Since the pusher is configured to push the angled device under test into the device-under-test socket, the pusher facilitates coupling and positioning the second antenna or antenna structure during coupling of the angled device under test to the device-under-test socket.
According to an embodiment, the second antenna or antenna structure is configured to be connected with a signal source and/or with a signal receiver via a blind-mating microwave connection (e.g. via a blind mating waveguide connection) when the handler has placed the second antenna or antenna structure in an operating position (e.g., or, equivalently, when the handler has inserted the angled device under test into the test socket, or when the handler pushes the device under test into the test socket).
The connection with the signal source and/or with the signal receiver enables the second antenna or antenna structure to emit a signal (e.g., to be received by an antenna or antenna array of the angled device under test) and/or to receive a signal (e.g., emitted by an antenna or antenna array of the angled device under test), and therefore facilitates testing of the angled device under test. The blind-mating microwave connection may facilitate (e.g., manual and/or automatic) coupling between the signal source and/or a signal receiver and the second antenna or antenna structure.
According to an embodiment, the device-under-test socket comprises an angled recess or an angled exemption, configured to support and/or align the angled device under test. The angled recess or the angled exemption may have a sidewall on one or both of its ends.
The angled recess or the angled exemption has two (or more) abutment surfaces (e.g., at an angle) that can abut against the first and second inner surface respectively. Such abutment surfaces may realize (at least partly) a pre-determined orientation and/or position of the angled device under test. A pre-determined orientation and/or position of the angled device under test may facilitate establishing an electrical connection and improve reproducibility and accuracy of testing. The optional one or more sidewalls may further limit lateral movement of the angled device under test.
According to an embodiment, the device-under-test socket is arranged such that a second inner surface of the angled device under test, which is opposite to the second outer surface of the angled device under test, is spaced from the carrier structure (e.g. loadboard) by at least 10 mm, or by at least 30 mm, or by at least 45 mm or by at least 2 wavelengths or by at least 3 wavelengths or by at least by 4 wavelengths (e.g. free-space wavelengths, or wavelengths in a medium between the first outer surface of the angled device under test and the carrier structure) at a lowest frequency of operation of the angled device under test (e.g. at a lowest frequency of operation of an Antenna-in-Package (AiP) module that makes up the device under test or that is included in the device under test) (e.g., and such that, advantgeously, an edge of the first outer surface is spaced from the loadboard by at least 10 mm, or by at least 20 mm or by at least 2 wavelengths or by at least 3 wavelengths or by at least by 4 wavelengths, e.g. free-space wavelengths, or wavelengths in a medium between the first outer surface of the angled device under test and the carrier structure, at a lowest frequency of operation of the angled device under test, e.g. at a lowest frequency of operation of an Antenna-in-Package (AiP) module that makes up the device under test or that is included in the device under test).
It has been recognized that such a spacing significantly reduces effects (e.g., reflection, beamforming, and interferences) of the carrier structure onto characteristics of one or more antenna structures of the device under test, or, generally speaking, onto circuitry (e.g., antenna structures, circuitry for signal transmission, or a silicon die for conversion of signals such as conversion of intermediate frequency signals to mmWave signals and vice versa) on the second inner surface and/or the second outer surface.
According to an embodiment, the device-under-test socket comprises a socket height of at least 10 mm, or of at least 30 mm, or of at least 45 mm, such that a second inner surface of the angled device under test, which is opposite to the second outer surface of the angled device under test, is spaced from the carrier structure (e.g., loadboard) by at least 10 mm, or by at least 30 mm, or by at least 45 mm or by at least 2 wavelengths or by at least 3 wavelengths or by at least by 4 wavelengths (e.g. free-space wavelengths, or wavelengths in a medium between the first outer surface of the angled device under test and the carrier structure) at a lowest frequency of operation of the angled device under test (e.g. at a lowest frequency of operation of an Antenna-in-Package (AiP) module that makes up the device under test or that is included in the device under test) (e.g., and such that, advantgeously, an edge of the first outer surface is spaced from the loadboard by at least 10 mm, or by at least 20 mm or by at least 2 wavelengths or by at least 3 wavelengths or by at least by 4 wavelengths, e.g. free-space wavelengths, or wavelengths in a medium between the first outer surface of the angled device under test and the carrier structure, at a lowest frequency of operation of the angled device under test, e.g. at a lowest frequency of operation of an Antenna-in-Package (AiP) module that makes up the device under test or that is included in the device under test).
It has been recognized that such a spacing significantly reduces effects (e.g., reflection, beamforming, and interferences) of the carrier structure onto characteristics of one or more antenna structures of the device under test, or, generally speaking, onto circuitry (e.g., antenna structures, circuitry for signal transmission, or a silicon die for conversion of signals such as conversion of intermediate frequency signals to mmWave signals and vice versa) on the second inner surface and/or the second outer surface.
According to an embodiment, the device-under-test socket comprises one or more coaxial pogo pins (which may, for example, extend from a lower surface of the device-under-test socket which is in contact with the load board, to an upper surface of the device-under-test socket, which is in contact with the second inner surface of the angled device under test), in order to establish an electrical connection between the carrier structure (e.g., loadboard) and the angled device under test (wherein, for example, a first end of the coaxial pogo pin may be in contact with a pad on the load board, and wherein, for example, a second end of the coaxial pogo pin may be in contact with a pad on the angled device under test).
Pogo pins are commonly depressible and allow the device-under-test socket to establish a reliable electrical contact with the device under test upon the device under test being coupled to the device-under-test socket (e.g., when being pushed by a handler/pusher into the device-under-test socket). For example, the coaxial springs enable a high frequency interconnect to the device-under-test socket.
According to an embodiment, an extender structure (e.g. comprising an extender and a PCB interposer) is arranged between the carrier structure (e.g. the loadboard or the PCB test fixture) and the device-under-test socket.
The extender allows separation of the functions of establishing an electrical connection to the device under test and realizing a space between the carrier structure and the device under test. Therefore, for example, the same device-under-test socket can be used in combination with a plurality of extenders having a different height. Structures (or circuitry) for establishing the electrical contact with the device under test can mostly or entirely be realized in the device-under-test socket, allowing for a simpler design of the extender. The optional PCB interposer may, for example, allow for a rerouting between different geometries of electrical contacts of the device-under-test socket and the extender.
According to an embodiment, the extender structure comprises an extender assembly,
The extender assembly provides a spacing between the device-under-test socket and the carrier structure, wherein the coaxial pogo pins provide electrical contacts that may cover a distance across the space provided by the extender. The coaxial pogo pins furthermore provide an electrical interface compatible with a device-under-test socket configured to receive the device under test being pushed inside, improving the compatibility with other/older carrier structures.
According to an embodiment, the test arrangement comprises at least two device-under-test sockets configured to carry respective angled devices under test (e.g. two equal devices under test), wherein the at least two device-under-test sockets are arranged (e.g. back-to-back) to position respective angled devices under test such that respective first outer surfaces of the respective angled devices under test are aligned in opposite (averted) directions.
A test arrangement with at least two device-under-test sockets allows testing more than one device under test at once (e.g., simultaneously or successively; e.g. within one cycle of a handler placing the devices under test in the device under test sockets). Furthermore, with the respective first outer surfaces of the respective angled devices under test being aligned in opposite (averted) directions, interferences between signals emitted by and/or received at the respective first outer surfaces are reduced.
According to an embodiment, the test arrangement comprises at least two rows (e.g. parallel rows) of device-under-test sockets, wherein the device-under-test sockets are configured to carry respective angled devices under test, wherein the at least two rows of device-under-test sockets are arranged (e.g. back-to-back; e.g. with sides of the device-under-test sockets where the first outer surfaces of the devices under test are located, averted with respect to each other) to position respective angled devices under test such that respective first outer surfaces of the respective angled devices under test are aligned in opposite (averted) directions.
Such an arrangement improves a compromise between arranging a plurality of devices under test in an increased density and reducing interferences between signals emitted by and/or received at the respective first outer surfaces.
According to an embodiment, a test arrangement for over-the-air testing an angled (e.g. L-shaped) device under test (e.g. a L-shape Antenna-in-package device under test), comprises a carrier structure (e.g. a PCB test fixture or a loadboard). The test arrangement also comprises a device-under-test socket which is coupled to the carrier structure (e.g. the PCB test fixture or the load board) (e.g. directly or with an extender assembly and/or a PCB interposer in between the carrier structure and the device-under-test socket), wherein the device-under-test socket is configured to establish an electrical contact with an inner surface of the angled (e.g. L-shaped) device under test (e.g. with an inner surface of the angled device under test which is opposite to a second outer surface of the angled device under test) or with a connector which is arranged on the inner surface of the angled (e.g. L-shaped) device under test, and wherein the device-under-test socket is configured to position the angled device-under-test such that a first outer surface of the angled (e.g. L-shaped) device under test (e.g. a surface comprising a radiating structure) is spaced apart from a surface (e.g. a main surface) of the loadboard, and such that a surface normal of the first outer surface of the angled (e.g. L-shaped) device-under-test is parallel, within a tolerance of +/−15 degrees, to the surface (e.g. main surface) of the loadboard, and such that a second outer surface of the angled (e.g. L-shaped) device under test (e.g. a surface comprising a radiating structure) is facing away from the loadboard, and such that a surface normal of the second outer surface of the angled (e.g. L-shaped) device-under-test is perpendicular, within a tolerance of +/−15 degrees, to the surface of the loadboard.
It has been recognized that such an arrangement of the first and second outer surfaces improves a compromise between accessibility of antenna structures for testing and reducing influences of the surface of the carrier structure.
The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments of the invention are described with reference to the following drawings, in which:
Equal or equivalent elements or elements with equal or equivalent functionality are denoted in the following description by equal or equivalent reference numerals even if occurring in different figures.
In the following description, a plurality of details is set forth to provide a more throughout explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form rather than in detail in order to avoid obscuring embodiments of the present invention. In addition, features of the different embodiments described herein after may optionally be combined with each other, unless specifically noted otherwise.
The carrier structure 110 may be a printed circuit board (PCB) test fixture or a loadboard. The carrier structure 110 may, for example, be or comprise at least one region with a flat surface. The device-under-test-socket 130 may be arranged on top of the carrier structure 110 (e.g., on the flat surface) or may be coupled to the carrier structure 110 via one or more intermediate devices or structures. An area of the carrier structure 110 (e.g. loadboard) which is adjacent (e.g. with spacing in between) to the first outer surface 144a of the angled device-under-test 140 is free from power planes and/or free from ground planes. The area may be in a half space that is separated by a plane through the device-under-test socket 130 or the device under test 140 (e.g., defined by the first outer surface 144a or first inner surface 142a when the device under test is coupled to the device-under-test socket 130), e.g., in
The test arrangement 100 shown in
Since the device-under-test socket 130 is configured to contact an inner surface 142 of the device under test, outer surfaces of the device under test 140 completely (or at least mostly) face away from the device-under-test socket 130 and the carrier 110. Therefore, an effect of the device-under-test socket 130 and/or the carrier structure 110 on a radiation emitted (and/or received) by the outer surfaces of the device under test 140 (and on a testing thereof) is reduced.
The angled device under test 140 may be (or comprise) an Antenna-in-package (AiP) device. The angled device under test 140 may have an L-shape (as indicated abstractly in
The device-under-test socket 130 may be configured to position the angled device-under-test 140 such that the second outer surface 144b of the angled device under test 140 is facing away from the carrier structure 110. The device-under-test socket 130 may be configured to position the angled device-under-test 140 such that a surface normal of the second outer surface 144b of the angled device-under-test is perpendicular, within a tolerance of +/−15 degrees, to the surface 112 of the carrier structure 110. The second outer surface 144b may be arranged parallel to the surface 112 of the carrier structure 110.
The device under test 240 comprises a first plate 241a and a second plate 241b, which are angled relative to each other at a 90 degree angle (e.g. within a tolerance of +/−15 degrees). The first plate 241a comprises a first outer surface 244a and a first inner surface 242a and the second plate 241b comprises a second outer surface 244b and a second inner surface 242b.
In the example shown in
The device under test 240 may further comprise a connector 248, e.g. an array connector. In the example shown in
The first antenna array 246a may be directly electrically connected with the (array) connector 248 or may be indirectly coupled with the (array) connector 248, e.g. with further electrical components in between. For example, the further electrical components may comprise at least one of an amplifier, a filter, a switch, a resistor, a capacitor, and an integrated circuit. In the example shown in
The second example of the angled device under test 240a essentially corresponds to the first example of the angled device under test 240 as shown in
The device-under-test socket 130 may be configured to position the angled device-under-test 140 (e.g. the angled device under test 240 or the angled device under test 240a) such that the first outer surface 144a of the angled device under test 140 (e.g., the first outer surface 244a) is spaced apart from a surface 112 of the carrier structure 110.
The device-under-test socket 130 may be configured to position the angled device-under-test 140 such that a spacing (e.g., the first distance 114) between the first outer surface 144a of the angled device under test 140 and the carrier structure 110 (e.g., the surface 112 thereof) is at least two wavelengths at a lowest frequency of operation of the angled device under test. The angled device under test 140 may be operated in a frequency band of the 5G standard, for example within the range of 24 GHz to 53 GHZ (e.g., the frequency range 2). In such a case, the lowest frequency of operation may be 24 GHz with a wavelength of 12.5 mm. The space between the first our surface 144a and the surface 112 of the carrier structure 110 may, for example, be 25 mm or larger (i.e. two times 12.5 mm).
The spacing may be defined by a different surface of the device under test 140. The device-under-test 130 socket may be arranged such that the second inner surface 142b of the angled device under test 140 (e.g. the second inner surface 242b of the angled device under test 240), which is opposite to the second outer surface 114b of the angled device under test 140, is spaced from the carrier structure 110 (e.g., from the surface 112) by at least 10 mm, or by at least 30 mm, or by at least 45 mm or by at least 2 wavelengths or by at least 3 wavelengths or by at least by 4 wavelengths at a lowest frequency of operation of the angled device under test.
The device-under-test socket 130 may comprise a socket height 115 (indicated as a dashed imaginary line) of at least 10 mm, or of at least 30 mm, or of at least 45 mm, such that the second inner surface 142b of the angled device under test 140, which is opposite to the second outer surface 144b of the angled device under test 140, is spaced from the carrier structure by at least 10 mm, or by at least 30 mm, or by at least 45 mm or by at least 2 wavelengths or by at least 3 wavelengths or by at least by 4 wave-lengths at a lowest frequency of operation of the angled device under test.
The device under test 340 comprises a first outer surface 344a having a first antenna array with four antenna elements and a second outer surface 344b having a second antenna array with four antenna elements. At least one antenna element may comprise at least one parasitic patch. In the example shown in
Therefore, a spacing such as described above (e.g., at least two wavelengths, or at least 10 mm, or of at least 30 mm, or of at least 45 mm) can improve the accuracy and/or reproducibility of the test.
The device under test 1340 comprises a first inner surface 1342a and a second inner surface 1342b. In the example shown in
The device under test 1340 comprises a connector1348 (e.g. an array connector) and a silicon die 1349 (or any other antenna circuitry) on the second inner surface 1342b. The silicon die 1349 may be electrically contacted indirectly via the array connector 1348 or directly via electrical contacts of the silicon die 1349 itself (not shown in
The test arrangement 700 may comprise an extender structure 732 that is arranged between the carrier structure 710 (e.g. the loadboard or the PCB test fixture) and the device-under-test socket 730. The extender structure 732 may comprise an extender 733 and a PCB interposer 734. The extender forms a structure allowing the device-under-test socket 730 to be arranged elevated relative to the carrier structure 710 (e.g. spaced from the carrier structure 710). The extender 733 may be configured to receive the device-under-test socket 730 directly or indirectly, e.g., via the PCB interposer 734 and/or other components. The PCB interposer may be configured to form an adapter (e.g., structurally and/or in regards to locations of electrical connections) between the extender 733 and the device-under-test socket 730. For example, the PCB interposer 734 may allow for a rerouting between different geometries of electrical contacts of the device-under-test socket 730 and the extender 733, increasing compatibility there between. The PCB interposer 734 may, for example, (optionally) comprise one or more decoupling capacitors.
In the example shown in
In the following, it will be discussed how the characteristics of the test arrangement can be improved by designing different spatial regions. For example, a so-called “adjacent area” can be designed to be free from power planes or ground planes. Alternatively or in addition, a so-called “first designated region” can be designed to be completely free from metallization.
An adjacent area 716 of the carrier structure 710 (e.g. loadboard), which is adjacent (e.g. with spacing in between) to the first outer surface 744a of the angled device-under-test 740 (e.g. an area of the carrier structure 710, e.g. loadboard, which is adjacent to projection of an outward (outbound) surface normal of the first outer surface 744a of the angled device under test 740 onto the carrier structure 710 or loadboard) is free from power planes and/or free from ground planes. The adjacent area may be arranged in a half space through the device-under-test socket 730 that comprises the first outer surface 734a. The adjacent area may be adjacent (e.g. with a spacing in between) to the first outer surface 744a of the angled device-under-test 740 (e.g. in an area which is adjacent to a projection of an outward (outbound) surface normal of the first outer surface 744a of the angled device under test 740 onto the carrier structure 710, e.g. loadboard). In the example shown in
A first designated area 718 of the carrier structure 710 (e.g. loadboard) which is adjacent (e.g. with a spacing in between) to the first outer surface 742a of the angled device-under test 740 is free from metallization. The first designated area 718 of the carrier structure 710, e.g. loadboard, may be adjacent to a projection of an outward (outbound) surface normal of the first outer surface 744a of the angled device under test 740 onto the carrier structure 710, e.g. loadboard). The first designated area 718 may be identical to, intersect with or compromise the adjacent area 716.
The test arrangement 700 may comprise an absorber material 717 that is arranged on the carrier structure 710 (e.g. loadboard) in a second designated area which is adjacent (e.g. with a spacing in between) to the first outer surface 744a of the angled device-under-test 740 (e.g. in a second designated area which is adjacent to a projection of an outward (outbound) surface normal of the first outer surface of the angled device under test onto the carrier structure, e.g. loadboard). The absorber material may comprise a radio frequency absorber material (e.g., rubberized foam material impregnated with carbon and/or iron). The second designated area may be identical to, intersect with or compromise the adjacent area 716 (and/or the first designated area 718). However, the second designated area may advantgeously be neighboring to the so-called “adjacent area 716” of the carrier structure 710. In the example shown in
The device-under-test socket 730 is configured to establish an electrical contact with a connector (e.g. an array connector) 748 of the device under test 740. Alternatively, the device-under-test socket 730 may be configured to establish an electrical contact with at least one of the first and second inner surfaces 742a, b.
The test arrangement 700 shown in
The first antenna or antenna structure 750 (e.g. a single aperture antenna (e.g. dual linear polarized or circular polarized)) is configured to receive a signal radiated from the first outer surface 744a of the angled device under test 740 and/or configured to emit a signal to be received at the first outer surface 744a of the angled device 740. To this end, the first antenna or antenna structure 750 is arranged at a distance from the first outer surface 744a of the angled device under test 740, e.g. such that a surface normal of the first outer surface 744a of the angled device under test 740 extends through an aperture of the first antenna or antenna structure 750. The first antenna or antenna structure 750 may be placeable at an operation position. A surface normal of the first outer surface 744a of the angled device under test 740 (which may, for example, be coaxial to a main lobe (e.g., by beamforming) of an antenna structure on the first outer surface, and/or which may extend through a geometric center of one or more antenna arrays of the first outer surface 744a) may extend through the aperture (e.g. through the center of the aperture) of the first antenna or antenna structure 750. The first antenna or antenna structure 750 may be mechanically attached to an arm of a handler (or pusher) 754, such that the first antenna or antenna structure 750 is moveable. The handler 754 may be configured to insert the angled device under test 740 into the device-under-test socket 730.
The first antenna or antenna structure 750 may be configured to be connected with a signal source and/or with a signal receiver (not shown in
The second antenna or antenna structure 752 (e.g. a single aperture antenna (e.g. dual linear polarized or circular polarized)) may be configured to receive a signal radiated from the second outer surface 744b of the angled device under test 740 and/or to emit a signal to be received at the second outer surface 744b of the angled device under test 740 (at least when the second antenna or antenna structure 752 is placed at an operation position) (or, equivalently, when the handler 754 has inserted the angled device under test 744b into the device-under-test socket 730, or when the handler 754 pushes the device under test 740 into the device-under-test socket 730).
An aperture of the second antenna or antenna structure 752 may be arranged at a distance from the second outer surface 744b of the angled device under test 740 such that a surface normal of the second outer surface 744b of the angled device under test 740 extends through the aperture of the second antenna or antenna structure 752 (at least when the second antenna or antenna structure 752 is placed at an operation position) (or, equivalently, when the handler has inserted the angled device under test into the test socket, or when the handler pushes the device under test into the test socket). A surface normal of the second outer surface 744b of the angled device under test 740 coaxial to a main lobe of an antenna structure on the second outer surface, and/or a surface normal extending through a geometric center of one or more antenna arrays of the first outer surface 744a may extend through the aperture of the first antenna or antenna structure 750 (e.g. through a center of the aperture of the first antenna or antenna structure).
The second antenna or antenna structure 752 may be mechanically attached to an arm of the handler (e.g., a pusher) 754, such that the second antenna or antenna structure 752 is moveable.
The second antenna or antenna structure 752 may be part of a pusher 754 for pushing the angled device under test 740 into the device-under-test socket 730, or the second antenna or antenna structure 752 may be configured to be moveable together with a pusher 754 for pushing the angled device under test 740 into the device-under-test socket 730. The pusher 754 may be arranged such that the pusher 754, or a part of the pusher 754, is in between the second antenna or antenna structure 752 and the second outer surface 744b of the angled device under test 740 when the device under test 740 is inserted into the device-under-test socket 730. The pusher 754 may be arranged such that the pusher 754, or a part of the pusher 754, is in between the first antenna or antenna structure 750 and the first outer surface 744a of the angled device under test 740 when the angled device under test 740 is inserted into the device-under-test socket 730. It should be noted that, in some cases, a force to push the device under test may act in two directions, e.g. in order to push both the first inner surface of the device under test and the second inner surface of the device under test towards the device under test socket. Accordingly, the pusher may be angled, to be in (pushing) contact both with the first outer surface of the device under test and with the second outer surface of the device under test. Consequently, the pusher may be moved both in a direction along the surface normal of the first outer surface of the device under test and in a direction along the surface normal of the second outer surface of the device under test.
The second antenna or antenna structure 752 may be configured to be connected with a signal source and/or with a signal receiver (not depicted in
The device-under-test socket 830 may be configured to receive any device under test described herein and be part of any test arrangement described herein. The device-under-test socket 830 comprises an angled recess or an angled exemption 860, configured to support and/or align the angled device under test. The angled recess or the angled exemption 860 comprises a first abutment surface 862a configured to abut against the first inner surface of the device under test (e.g., first inner surfaces 142a, 242a, or 742a) and a second abutment surface 862b configured to abut against the second inner surface of the device under test (e.g., second inner surface 142b, 242b, or 742b). The first abutment surface 862a and the second abutment surface 862b may be arranged at an abutment surface angle, wherein a sum of the abutment surface angle (e.g. 270 degree) and of the angle between the first and second inner surface of the device under test (e.g. 90 degree) is at least essentially 360 degrees. For example, if the first and second inner surface of the device under test may be arranged at an angle of 90 degrees, the abutment surface angle may be 270 degrees (with the sum of 90 degrees and 270 degrees being 360 degrees).
Any surface of the device-under-test socket 830 may be configured to establish an electrical contact with the inner surface of the device under test. For example, the first and/or second abutment surface 862a, b may be configured to establish an electrical contact with the inner surface of the device under test, and/or to provide a ground plane for an antenna structure of the device under test. To this end, the first and/or second abutment surface 862a, b may comprise or may be formed of an electrically conducting material (e.g., at least one of gold, cupper, iron, and nickel). Alternatively, the first and/or second abutment surface may comprise, or may be formed of, a dielectric (non-conducting) material (e.g. a wear-resistant material). Optionally, the first and/or second abutment surface 862a, b may comprise one or more (local) socket connectors 865 (or other contacting structures for contacting the device under test, like conductive pads, pogo pins, spring-loaded contacts, or the like). The socket connector 865 is arranged such that when the device under test is arranged in the device-under-test socket 860, the connector 865 establishes an electrical connection with the inner surface of the device under test or a connector thereof (e.g., array connectors 248, 748).
The device-under-test socket 830 comprises a support body 864 comprising a main socket structure 864a and a leg socket structure 864b. The main socket structure 864a and the leg socket structure 864b both have a rectangular cuboid outer shape (optionally with rounded edges), wherein at least two edges of the leg socket structure 864b are smaller (shorter) than two edges (e.g. corresponding edges) of the main socket structure 864a. The main socket structure 864a and the leg socket structure 864b may, for example, have the same height. A side surface 861 of the leg socket structure 864b is arranged flush with a side surface of the main socket structure 864a, and three other side surfaces of the leg socket structure 864b are recessed relative to three other (corresponding) side surfaces of the main socket structure 864a. The leg socket structure 864b may therefore, for example, be received by an opening in the carrier structure or the extender structure such that, for example, lateral movement of the device-under-test socket 830 is limited by side surfaces of the leg socket structure 864b. However, the device-under-test socket may also be attached on top of an extender structure (e.g. on top of the extender structure 732), wherein the main socket structure 864a may be arranged on a top surface of the extender structure, and wherein the leg socket structure 864b may be adjacent to a side wall of the extender structure.
The device-under-test socket 830 may further or alternatively comprise one or more protrusions 866 extending from the support body 864 (e.g., from the main socket structure 864a) in a direction towards the carrier structure. The protrusion 866 may be or comprise a shaft (e.g., with a cylinder shape). The protrusion 866 may be received by a recess of the carrier structure or the extender structure 732.
Alternatively or additionally, the device-under-test socket 830 may comprise one or more through holes configured to receive an attachment element such as a pin or screw.
In the example shown in
The angled recess or the angled exemption 860 may have a respective sidewall 868a, b at both of its ends (only one of which is directly visible in
The angled recess or the angled exemption 860 may comprise at least one tapering, e.g., such that a cross section (e.g., parallel to the first or second abutment surface 862a, b) decreases in a direction from outside towards the first or second abutment surface 862b. In the example shown in
The device-under-test socket 830 may have adjacent openings 869 that intersect the angled recess or the angled exemption 860. In the example shown in
The angled recess or the angled exemption 860 may comprise additional recesses or elevations, e.g., in order to conform to a shape of the device under test. For example, the angled recess or the angled exemption 860 shown in
The device-under-test socket 830 may comprise a blind mating interface. In the example shown in
To conclude, the socket 830 may receive an angled device under test and may establish an electrical contact with the angled device under test. The device under test may be positioned (aligned) within the angled recess or angled exemption 860, such that an over-the-air test of the device under test is possible using antenna structures or antennas on both outer surfaces of the angled device under test. The device under test is well aligned in the socket, while distortions of radiation characteristics of the antennas or antenna structures of the device under test by the socket can be kept reasonably small. The socket can be easily attached to a carrier structure and can be used in any of the embodiments disclosed herein.
The example shown in
The device-under-test socket 930 is attached to (e.g. arranged on) the daughter board 970, which is mounted to the carrier structure 910 (e.g. test fixture PCB or load board), with a spacing between the daughter board 970 and the carrier structure 910. The spacing between the daughter board 970 and the carrier structure 910 may be, for example, provided using one or more stiffeners 972. The stiffener 972 may comprise at least one of a polymer, a resin, a glass, and a metal. The stiffener 972 may comprise one or more stiffener structures. At least one of the stiffener structures may comprise a step (e.g., in order to facilitate arranging the daughter board 970 on the stiffener and/or limit movement in a direction parallel to the surface of the carrier structure 910). The stiffener 972 may comprise one or more structures of at least essentially equal height or with surfaces arranged at at least essentially equal height (e.g., in the case of a stiffener structure with a step).
The stiffener 972 may form or be part of a socket guide. The socket guide may be configured to facilitate arranging the daughter board 970 on the stiffener 972 (e.g., for a user or an automated device).
Alternatively or additionally, an extender structure (e.g., similar to the extender structure 732) may be provided between the carrier structure 910 and the stiffener 972, or between the stiffener 972 and the daughter board 970, or between the carrier structure 910 and the daughter board 970, or between the daughter board 970 and the device-under-test socket 930.
The test arrangement 900 may comprise an electrical connection between the daughter board 970 and the carrier structure 910 using an electrical connector 974 (e.g. using a connector (e.g. an array connector) for digital/power signals and optionally also for high frequency signals or microwave signals, e.g. for IF RF signals). The electrical connector 974 may be configured to establish an electrical connection between the load board and the device under test 940 (e.g. by electrically connecting the carrier structure 910 with the device under test 940. The electrical connector 974 may be configured to transmit IF RF signals or microwave signals. A high performance electrical connector 974 such as a high performance array connector may be provided.
The daughter board 970 may comprise one or more mounted electrical connectors 976 that are electrically connected (or connectable) to the device-under-test socket 930 (e.g., to contacts of the device-under-test socket 930 that are configured to establish an electrical connection with the device under test 940). Alternatively, the one or more electrical connectors 976 may be configured to establish an electrical connection to an automated test equipment, or to external signal generation and/or measurement equipment which may, for example, be controlled by the automated test equipment. In the example shown in
The device-under-test socket 930 and/or the daughter board 970 may comprise one or more coaxial pogo pins (e.g., spring pins). In the example shown in
To conclude, the test arrangement 900 allows for the testing of one or more devices under test, which may be placed in the device-under-test socket 930. The device under test may be placed at a spacing from the carrier structure 910, wherein the daughter board 970 is in between the carrier structure (e.g. load board) 910 and the device-under-test socket. The daughter board may, for example, be a printed circuit board and may, for example, comprise electrical routes which establish an electrical connection between connectors, that connect the carrier structure and the daughter board and the device under test socket. Accordingly, the device under test socket may, for example, be attached (or connected) directly (or closely) to the daughter board using a conventional technology, and the daughter board may be coupled to the carrier structure (e.g. load board) using a “long range” connection, which is suitable to cover a spacing, for example, in a range between 5 mm and 50 mm. Accordingly, a proper placement of the device under test can be achieved with good mechanical stability and good electrical characteristics of the connection between the support structure and the device under test.
The test arrangement comprises a first antenna or antenna structure 1050 configured to receive a signal radiated from a first outer surface 1044a of the angled device 1140 under test and/or configured to emit a signal to be received at the first outer surface 1044a of the angled device under test1040. In the example shown in
The first antenna or antenna structure 1050 is, for example, mounted to have a fixed position with respect to a device-under-test socket 1030. The first antenna or antenna structure 1050 may be mounted to a carrier structure 1010. The signal transmission between the first antenna or antenna structure 1044a may be performed in a direction parallel to a surface of the carrier structure 1010 (e.g., due to the positioning of the angled device under test 1140 in the device-under-test socket 1140) such that the angled device under test 1140 can be inserted into the device-under-test socket 1030 from above (e.g., in a direction perpendicular, or at least approximately perpendicular, to the surface of the carrier structure 1010) without requiring removal of the first antenna or antenna structure 1050.
The first antenna or antenna structure 1050 may comprise (or be part of) a housing with a waveguide, wherein an aperture of the waveguide forms (or is part of, or transitions into) the aperture of the first antenna or antenna structure 1050. The waveguide of the first antenna or antenna structure 1050 may, for example, be coupled to a coaxial connector or to a coaxial cable.
The first antenna or antenna structure 1050 may be connected (or connectable) with a signal source and/or with a signal receiver 1056a. In the example shown in
The first antenna or antenna structure 1050 may be configured to be connected (e.g., via the first coaxial cable 1053a) with the first signal source and/or with a signal receiver 1056a via a blind-mating microwave connection (e.g. via a blind mating waveguide connection) when the first antenna or antenna structure 1050 is placed in an operating position (e.g., by a handler). In this case, the first antenna or antenna structure may, for example, be moved by a handler.
The test arrangement 1000 may comprise a second antenna or antenna structure 1152 (as exemplarily depicted in
The second antenna or antenna structure 1052 and/or an antenna carrier structure 1054 (which may, for example, mechanically carry the antenna structure 1052 and comprise one or more feed lines which are coupled to the antenna or antenna structure 1052) is, for example, mechanically attached (or attachable) to an arm of a handler, such that the second antenna or antenna structure 1052 and/or the antenna carrier structure 1054 is moveable. The handler may be movable (e.g., detachable), e.g., in order to give access to the device-under-test socket 1030, for example, to allow insertion and/or removal of the device under test 1140. In the example shown in
It is noted that the test arrangement 1000 shown in
An aperture of the second antenna or antenna structure 1052 may be arranged at a distance from the second outer surface 1044b of the angled device under test 1040 such that a surface normal 1092 of the second outer surface 1044b of the angled device under test 1040 extends through the aperture of the second antenna or antenna structure 1040 (e.g., at least when the second antenna or antenna structure 1052 is placed at an operation position).
In the example shown in
The second antenna or antenna structure 1052 may comprise (or be part of) a housing with a waveguide, wherein an aperture of the waveguide forms (or is part of) the aperture of the second antenna or antenna structure 1052. The waveguide of the second antenna or antenna structure 1052 or a waveguide of the microwave connection 1055 may be coupled to a coaxial connector.
The test arrangement 1000 comprises the first coaxial cable 1053a coupled or coupleable to the coaxial connector of (or associated with) the first antenna or antenna structure 1050. The test arrangement 1000 further comprises the second coaxial cable 1053b coupled or coupleable to the microwave connection 1055 of (or associated with) the second antenna or antenna structure 1052. Alternatively, the test arrangement 1000 may comprise a different device for signal transmission or any other number of coaxial cables.
In the example shown in
At least one of the first and second coaxial cable 1053a, b may be arranged movable inside (e.g. entirely removable from) the respective board openings 1013a, 1013b, 1073, e.g., by virtue of a diameter of the respective opening being large enough to allow for movement of the respective first or second coaxial cable 1053a, b. Alternatively, at least one of the first and second coaxial cable 1053a, b may be fixedly held by the respective board openings 1013a, 1013b, 1073 (e.g., by frictional engagement).
Alternatively, the carrier structure 1010 may have no board opening for the first and/or second coaxial cable 1053a, b, wherein the first and/or second coaxial cable 1053a, b are entirely arranged on the same side of the carrier structure 1010 as the device-under-test socket 1040 (e.g., above the carrier structure 1010 shown in
The daughter board 1070 may be any daughter board as described herein (e.g., daughter board 970). In the example shown in
The device-under-test socket 1030 comprises socket pogo pins 1078. The socket pogo pins 1078 may be configured to establish an electrical connection between the device-under-test socket 1030 and an inner surface of the device under test 1140.
The socket pogo pins 1078 may be retractable into the device-under-test socket 1030 and/or into the daughter board 1070.
The device-under-test sockets 1130a-d are arranged to position respective angled devices under test 1140a-d such that respective first outer surfaces (in
The test arrangement 1100 comprises four first antennas or antenna structures 1150a, b, c, d (which may be any first antenna or antenna structure described herein) (e.g., side measurement antennas). However, the test arrangement 1100 may comprise any other number of first antennas or antenna structures 1150a-d, e.g., the same number as device-under-test sockets 1130a-d. In the example shown in
An aperture of at least one of the first antennas or antenna structures 1150a-d may be arranged at a distance from the respective ones of the first outer surface of the angled devices under test 1140a-d, such that a surface normal of the first outer surface of the respective angled device under test 1140a-d extends through the aperture of the respective one of the first antennas or antenna structures 1150a-d.
In the example shown in
The carrier structure 1110 may define a board limit 1113 (e.g., a handler docking plate limit), which defines a region (e.g., a rectangular frame) that encloses a region that supports mounting device-under-test sockets 1130a-d.
At least two device-under-test sockets 1230 are arranged (e.g. back-to-back) to position respective angled devices under test 1240 such that respective first outer surfaces 1244aa of the respective angled devices under test are aligned in opposite (averted) directions. For the sake of visibility, in
The test arrangement 1200 comprises two rows (e.g. parallel rows) 1215a, b of device-under-test sockets 1230a, 1230b and associated first antennas 1250a, 1250b, wherein the device-under-test sockets 1230 are configured to carry respective angled devices under test 1240a, 1240b, wherein the at least two rows 1215a, b of device-under-test sockets 1240 are arranged (e.g. back-to-back; e.g. with sides of the device-under-test sockets 1230 where the first outer surfaces 1244a of the devices under test 1240 are located, averted with respect to each other) to position respective angled devices under test 1240a, 1240b such that respective first outer surfaces 1244aa, 1244ab of the respective angled devices under test 1240a, 1240b are aligned in opposite (averted) directions. Such an arrangement improves a compromise between reduction of crosstalk and increase of packing density.
While this invention has been described in terms of several embodiments, there are alterations, permutations, and equivalents which fall within the scope of this invention. It should also be noted that there are many alternative ways of implementing the methods and compositions of the present invention. It is therefore intended that the following appended claims be interpreted as including all such alterations, permutations and equivalents as fall within the true spirit and scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 22 187 978.6 | Jul 2022 | EP | regional |
This application is a continuation of copending International Application No. PCT/EP2023/059652, filed Apr. 13, 2023, which is incorporated herein by reference in its entirety, and additionally claims priority from European Application No. 22187978.6, filed Jul. 29, 2022, which is also incorporated herein by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/EP2023/059652 | Apr 2023 | WO |
| Child | 19038974 | US |
