Claims
- 1. A thermally imageable element comprising, in order:a) a substrate, the substrate having a hydrophilic surface; b) an underlayer over the hydrophilic surface, the underlayer comprising a first polymeric material; and c) a top layer over the underlayer, the top layer comprising a second polymeric material; in which: the top layer is ink receptive; the top layer is insoluble in aqueous alkaline developer; the top layer comprises at least one solubility-suppressing component; the underlayer comprises a photothermal conversion material; the underlayer is soluble in aqueous alkaline developer; the second polymeric material is soluble in aqueous alkaline developer, and the second polymeric material comprises phenolic hydroxyl groups.
- 2. The thermally imageable element of claim 1 in which the second polymeric material is soluble in at least one organic solvent in which the first polymeric material is insoluble.
- 3. The thermally imageable element of claim 1 in which the photothermal conversion material is an absorber that is soluble in the aqueous alkaline developer.
- 4. The thermally imageable element of claim 3 in which the first polymeric material contains at least one functional group selected from the group consisting of carboxylic acid, N-substituted cyclic imide, and amide.
- 5. The thermally imageable element of claim 4 in which the first polymeric material is a copolymer that contains carboxylic acid, N-substituted cyclic imide, and amide functional groups.
- 6. The thermally imageable element of claim 5 in which the first polymeric material comprises about 25 to about 75 mol % of N-phenylmaleimide; about 10 to about 50 mol % of methacrylamide; and about 5 to about 30 mol % of methacrylic acid.
- 7. The thermally imageable element of claim 6 in which the first polymeric material comprises about 35 to about 60 mol % of N-phenylmaleimide; about 1.5 to about 40 mol % of methacrylamide; and about 10 to about 30 mol % of methacrylic acid.
- 8. The thermally imageable element of claim 3 in which first polymeric material is a copolymer that contains a pendent urea group.
- 9. The thermally imageable element of claim 8 in which the first polymeric material comprises about 20 to 80 wt % of one or more monomers represented by the general formula:CH2=(CR)—CO2—X—NH—CO—NH—Y—Z, in which R is —H or —CH3; X is a bivalent linking group; Y is a substituted or unsubstituted bivalent aromatic group; and Z is —OH, —COOH, or SO2NH2.
- 10. The thermally imageable element of claim 9 in which R is —CH3; X is —(CH2CH2)—; Y is unsubstituted 1,4-phenylene; and Z is —OH.
- 11. The thermally imageable element of claim 3 in which the first polymeric material is a copolymer that contains a pendent sulfonamide group.
- 12. The thermally imageable element of claim 11 in which the first polymeric material contains about 10 to 90 mol % of a sulfonamide monomer unit; acrylonitrile or methacrylonitrile; and methyl methacrylate or methyl acrylate.
- 13. The thermally imageable element of claim 1 in which the underlayer absorbs radiation in the range of about 800 nm to about 1200 nm and the top layer does not absorb significantly in the range of about 800 nm to about 1200 nm.
- 14. The thermally imageable element of claim 13 in which the photothermal conversion material is an absorber that is soluble in the aqueous alkaline developer.
- 15. The thermally imageable element of claim 13 in which the second polymeric material comprises a novolac resin functionalized with polar groups.
- 16. The thermally imageable element of claim 13 in which the solubility-suppressing component is a dissolution inhibitor compound.
- 17. The thermally imageable element of claim 16 in which the dissolution inhibitor compound is selected from the group consisting of compounds that contain the o-diazonaphthoquinone moiety, ammonium compounds, triarylmethane dyes, and sulfonate esters.
- 18. The thermally imageable element of claim 17 in which the second polymeric material is a novolac resin, a novolac resin functionalized with polar groups, or a mixture thereof.
- 19. The thermally imageable element of claim 17 in which the solubility-suppressing component is a triarylmethane dye.
- 20. The thermally imageable element of claim 1 in which the solubility-suppressing component is a triarylmethane dye.
- 21. The thermally imageable element of claim 1 in which the underlayer absorbs radiation in the range of about 800 nm to about 1200 nm.
- 22. The thermally imageable element of claim 21 in which the underlayer comprises an absorber that is soluble in the aqueous alkaline developer.
- 23. The thermally imageable element of claim 22 in which the first polymeric material contains at least one functional group selected from the group consisting of carboxylic acid, N-substituted cyclic imide, and amide.
- 24. The thermally imageable element of claim 23 in which the first polymeric material is a copolymer that contains carboxylic acid, N-substituted cyclic imide, and amide functional groups.
- 25. The thermally imageable element of claim 24 in which the first polymeric material comprises about 25 to about 75 mol % of N-phenylmaleimide; about 10 to about 50 mol % of methacrylamide; and about 5 to about 30 mol % of methacrylic acid.
- 26. The thermally imageable element of claim 25 in which the first polymeric material comprises about 35 to about 60 mol % of N-phenylmaleimide; about 15 to about 40 mol % of methacrylamide; and about 10 to about 30 mol % of methacrylic acid.
- 27. The thermally imageable element of claim 22 in which first polymeric material is a copolymer that contains a pendent urea group.
- 28. The thermally imageable element of claim 27 in which the first polymeric material comprises about 20 to 80 wt % of one or more monomers represented by the general formula:CH2=(CR)—CO2—X—NH—CO—NH—Y—Z, in which R is —H or —CH3; X is a bivalent linking group; Y is a substituted or unsubstituted bivalent aromatic group; and Z is —OH, —COOH, or SO2NH2.
- 29. The thermally imageable element of claim 28 in which R is —CH3; X is —(CH2CH2)—; Y is unsubstituted 1,4-phenylene; and Z is —OH.
- 30. The thermally imageable element of claim 22 in which the first polymeric material is a copolymer that contains a pendent sulfonamide group.
- 31. The thermally imageable element of claim 30 in which the first polymeric material contains about 10 to 90 mol % of a sulfonamide monomer unit; acrylonitrile or methacrylonitrile; and methyl methacrylate or methyl acrylate.
- 32. The thermally imageable element of claim 21 in which the underlayer comprises a negative-working, base soluble photosensitive composition.
- 33. The thermally imageable element of claim 32 in which the negative-working, base soluble photosensitive composition is a photopolymerizable composition.
- 34. A thermally imageable element comprising, in order:a) a substrate, the substrate having a hydrophilic surface; b) an underlayer over the hydrophilic surface, the underlayer comprising a first polymeric material; and c) a top layer over the underlayer, the top layer comprising a second polymeric material; in which: the element comprises a photothermal conversion material; the top layer is ink receptive; the top layer is insoluble in aqueous alkaline developer; the top layer comprises at least one solubility-suppressing component; the underlayer comprises a negative-working, base soluble photosensitive composition; and the second polymeric material is soluble in aqueous alkaline developer.
- 35. The thermally imageable element of claim 34 in which the negative-working, base soluble photosensitive composition is a photopolymerizable composition.
- 36. The thermally imageable element of claim 35 in which the second polymeric material comprises phenolic hydroxyl groups, the underlayer absorbs radiation in the range of about 800 nm to about 1200 nm, and the thermal conversion material is soluble in aqueous alkaline developer.
- 37. The thermally imageable element of claim 35 in which the second polymeric material contains phenolic hydroxyl groups, and the solubility-suppressing component is a dissolution inhibitor compound selected from the group consisting of triarylmethane dyes, ammonium compounds, sulfonate ester, and compounds that contain the o-diazonaphthoquinone moiety.
- 38. The thermally imageable element of claim 37 in which the dissolution inhibitor compound is a triarylmethane dye.
- 39. A method for forming an image, the method comprising:(1) thermally imaging an imageable element to form an imaged element, the imageable element comprising: a) a substrate, the substrate having a hydrophilic surface; b) an underlayer over the hydrophilic surface, the underlayer comprising a first polymeric material; and c) a top layer over the underlayer, the top layer comprising a second polymeric material; in which: the top layer is ink receptive; the top layer is insoluble in aqueous alkaline developer; the top layer comprises at least one solubility-suppressing component; the underlayer comprises a photothermal conversion material; the underlayer is soluble in aqueous alkaline developer; the second polymeric material is soluble in aqueous alkaline developer; and the second polymeric material comprises phenolic hydroxyl groups; and (2) developing the imaged element with an aqueous alkaline developer to form an imaged and developed element, the imaged and developed element comprising the image.
- 40. The method of claim 39 in which the underlayer absorbs radiation in the range of about 800 nm to about 1200 nm and the thermal conversion material is soluble in aqueous alkaline developer.
- 41. The method of claim 40 in which the second polymeric material is a novolac resin, a novolac resin functionalized with polar groups, or a mixture thereof.
- 42. The method of claim 40 in which the solubility-suppressing component is a dissolution inhibitor compound selected from the group consisting of triarylmethane dyes, ammonium compounds, sulfonate ester, and compounds that contain the o-diazonaphthoquinone moiety.
- 43. The method of claim 42 in which the dissolution inhibitor compound is a triarylmethane dye.
- 44. The method of claim 39 in which the underlayer comprises a negative-working, base soluble photosensitive composition, additionally comprising the step of:(3) exposing the imaged and developed element with actinic radiation after step (2).
- 45. The method of claim 44 in which the second polymeric material is a novolac resin, a novolac resin functionalized with polar groups, or a mixture thereof.
- 46. The method of claim 45 in which the negative-working, base soluble photosensitive composition is a photopolymerizable composition.
- 47. An imaged and developed element, the element made by the method comprising:(1) thermally imaging an imageable element to form an imaged element, the imageable element comprising: a) a substrate, the substrate having a hydrophilic surface; b) an underlayer over the hydrophilic surface, the underlayer comprising a first polymeric material; and c) a top layer over the underlayer, the top layer comprising a second polymeric material; in which: the top layer is ink receptive; the top layer is insoluble in aqueous alkaline developer; the top layer comprises at least one solubility-suppressing component; the underlayer comprises a photothermal conversion material; the underlayer is soluble in aqueous alkaline developer; the second polymeric material is soluble in aqueous alkaline developer; the top layer is ink receptive; and the second polymeric material comprises phenolic hydroxyl groups; and (2) developing the imaged element with an aqueous alkaline developer to form an imaged and developed element, the imaged and developed element comprising an image.
- 48. The imaged and developed element of claim 47 in which the underlayer comprises a negative-working, base soluble photosensitive composition, and the method the additionally comprises the step of:(3) exposing the imaged and developed element with actinic radiation after step (2).
- 49. The imaged and developed element of claim 47 in which the solubility-suppressing component is a dissolution inhibitor compound selected from the group consisting of triarylmethane dyes, ammonium compounds, sulfonate ester, and compounds that contain the o-diazonaphthoquinone moiety.
- 50. The imaged and developed element of claim 49 in which the dissolution inhibitor compound is a triarylmethane dye.
- 51. A thermally imageable element comprising, in order:a) a substrate, the substrate having a hydrophilic surface; b) an underlayer over the hydrophilic surface, the underlayer comprising a first polymeric material; and c) a top layer over the underlayer, the top layer comprising a second polymeric material; in which: the top layer is ink receptive; the top layer is insoluble in aqueous alkaline developer; the top layer comprises at least one solubility-suppressing component; the underlayer comprises a photothermal conversion material; the underlayer is soluble in aqueous alkaline developer; and the second polymeric material is insoluble in water and soluble in aqueous alkaline developer.
- 52. The thermally imageable element of claim 51 in which the absorbs radiation in the range of about 800 nm to about 1200 nm and the top layer does not absorb significantly in range of about 800 nm to about 1200 nm.
- 53. The thermally imageable element of claim 51 in which the solubility-suppressing component is dissolution inhibitor compound selected from the group consisting of compounds that contain the o-diazonaphthoquinone moiety, ammonium compounds, triarylmethane dyes, and sulfonate esters.
- 54. The thermally imageable element of claim 51 in which the photothermal conversion material is an absorber that is soluble in the aqueous alkaline developer.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. appln. Ser. No. 09/469,489, filed Dec. 22, 1999, incorporated herein by reference, now U.S. Pat. No. 6,358,669, issued Mar. 19, 2002, which is a continuation-in-part of U.S. Appln. Ser. No. 09/301,866, incorporated herein by reference, filed Apr. 29, 1999, now U.S. Pat. No. 6,352,812, issued Mar. 5, 2002, which claims priority from U.S. Provisional Application Ser. No. 60/090,300, filed Jun. 23, 1998, now abandoned, and a continuation-in-part of U.S. appln. Ser. No. 09/301,866, now U.S. Pat. No. 6,352,812, issued Mar. 5, 2002, incorporated herein by reference, filed Apr. 29, 1999, which claims priority from U.S. Provisional Application Ser. No. 60/090,300, filed Jun. 23, 1998, now abandoned.
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