Number | Date | Country | Kind |
---|---|---|---|
9-201654 | Jul 1997 | JP |
Number | Name | Date | Kind |
---|---|---|---|
5094769 | Anderson, Jr. et al. | Mar 1992 | |
5180761 | Shiao | Jan 1993 | |
5252655 | Parker | Oct 1993 | |
5391604 | Dietz et al. | Feb 1995 | |
5530047 | Watanabe | Jun 1996 | |
5552210 | Horn | Sep 1996 |
Number | Date | Country |
---|---|---|
61-036961 | Feb 1986 | JP |
61-029162 | Feb 1986 | JP |
6095557 | Nov 1994 | JP |
Entry |
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Lacombe, R. H. And H. Lee, “Flexible Heat-Conducting Sheet Material for Semiconductor Packages,” IBM Technical Disclosure Bulletin, vol. 25, No. 11A, Apr. 1983; pp. 5740-5743. |