Claims
- 1. A thermosetting resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a cresol novolac resin of which phenolic hydroxyl groups are allyl-etherified, and an epoxy resin, the quantitative ratio of the double bonds of the allyl-etherified cresol novolac resin and of the polymaleimide compound is in the range of 0.3 to 3.0, and said epoxy resin is used in an amount of 5 to 200 parts per 100 parts by weight of the allyletherified cresol novolac resin.
- 2. A thermosetting resin composition according to claim 1, wherein said polymaleimide compound is a compound having two or more maleimide groups represented by the following general formula (I) in one molecule: ##STR2## wherein R represents hydrogen atom or lower alkyl group having 1 to 5 carbon atoms.
- 3. A thermosetting resin composition according to claim 1, wherein said polymaleimide compound is N,N'-diphenylmethane bismaleimide or N,N'-diphenyl ether bismaleimide.
- 4. A thermosetting resin composition according to claim 1, wherein said epoxy resin is an epoxy resin obtained from epichlorohydrin and Bisphenol A, tetrabromoBisphenol A, Bisphenol F, Bisphenol S, phenol novolac, cresol novolac, resorcin, hydroquinone, 4,4'-diaminodiphenylmethane, aminophenol, aminocresol, polypropylene glycol or pentaerythritol.
Priority Claims (4)
Number |
Date |
Country |
Kind |
60-265613 |
Nov 1985 |
JPX |
|
61-125382 |
May 1986 |
JPX |
|
61-145565 |
Jun 1986 |
JPX |
|
61-152579 |
Jun 1986 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 933,893, filed Nov. 24, 1986, now abandoned.
US Referenced Citations (4)
Foreign Referenced Citations (7)
Number |
Date |
Country |
0225174 |
Jun 1987 |
EPX |
134099 |
Nov 1978 |
JPX |
36121 |
Feb 1984 |
JPX |
53526 |
Mar 1985 |
JPX |
60-60123 |
Apr 1985 |
JPX |
60-106824 |
Jun 1985 |
JPX |
219756 |
Nov 1985 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
933893 |
Nov 1986 |
|