1. Technical Field
The present invention relates to a three-dimensional shape measurement apparatus and a three-dimensional shape measurement method, and more specifically, to a three-dimensional shape measurement apparatus and a three-dimensional shape measurement method that measure a measurement object, such as solder, that is arranged on a substrate.
2. Related Art
In recent years, three-dimensional shape measurement apparatuses have come to be used in the inspection of the height of solder arranged on substrate. For this inspection, the height of the solder is calculated using a three-dimensional shape measurement apparatus, and if the calculated height satisfies a predetermined condition, the product is judged to be “good”. A conventional three-dimensional shape measurement apparatus that is used in such an inspection is disclosed for example in Japanese Patent No. 3868917 (Patent Document 1) and JP 2010-243508A (Patent Document 2).
According to Patent Document 1, a reference area is selected from within a predetermined region on the substrate. Then, a reference height is specified after forming a reference plane from the selected reference area, and the height of the solder is calculated based on this reference height. However, this reference height is based on a plane that is formed from a wiring pattern of the substrate, so that it is difficult to calculate the height of the solder accurately.
For example, in BGAs (Ball Grid Arrays) of substrates, the wiring is pulled to the inside of the substrate, so that the wiring pattern is positioned away from the lands.
Moreover, according to Patent Document 2, a reference height is set in a substrate in a state prior to the application of solder, and based on the reference height set in this manner, the height of the solder is calculated. However, the state of the substrate prior to the application of solder and the state of the substrate after the application of solder may differ, for example due to warping or flexing or the like.
It is an object of the invention to provide a three-dimensional shape measurement apparatus that can accurately calculate the height of solder.
It is another object of the invention to provide a three-dimensional shape measurement method that can accurately calculate the height of solder.
A three-dimensional shape measurement apparatus according to the present invention measures the three-dimensional shape of a member on a substrate by analyzing a light pattern projected onto the member on the substrate. The substrate includes at least one land, which is a region to which solder is applied. The three-dimensional shape measurement apparatus includes an image pickup unit for picking up an image of a member on the substrate onto which a light pattern is projected; a region height measurement unit for measuring a height of a predetermined region from a predetermined reference plane, by obtaining, with the image pickup unit, an image of the predetermined region, which is connected to a land, in the substrate prior to the application of solder; a distribution calculation unit for calculating a height distribution of the substrate in the predetermined region, based on the height of the predetermined region measured by the region height measurement unit; a land height measurement unit for measuring a height of a land from the predetermined reference plane, by obtaining, with the image pickup unit, an image of the land within the predetermined region, in the substrate prior to the application of solder; and a distance calculation unit for calculating a distance between the height distribution of the substrate in the predetermined region calculated by the distribution calculation unit and the height of the land measured by the land height measurement unit.
Thus, based on the height of the predetermined region, the three-dimensional shape measurement apparatus calculates a height distribution of the substrate at the predetermined region, and calculates the distance between the calculate height distribution of the substrate and the height of the land. In this case, the height distribution of the substrate at the predetermined region reflects changes due to warping or flexing, even when the substrate is subject to warping or flexing, for example. As a result, the calculated distance is calculated while suppressing the influence due to distortions of the substrate. Moreover, to calculate the height of the solder, it is possible to use a distance in which the influence of distortions is suppressed, even if the substrate is subject to such distortions after solder has been applied to the substrate, for example, so that it is possible to accurately calculate the height of the solder.
It is preferable that the height distribution of the substrate calculated by the distribution calculation unit is a height from a predetermined reference plane in said predetermined region, said height from the predetermined reference plane being expressed by a curved approximation surface.
Even more preferably, the three-dimensional shape measurement apparatus further includes a solder height calculation unit for calculating the height of solder applied on the land of the substrate using the distance calculated by the distance calculation unit. Thus, the height of the solder can be calculated using a distance that is unaffected by distortions. Consequently, the height of the solder can be calculated more accurately.
Even more preferably, the predetermined region is a wiring pattern that is arranged around the land and that includes a conductive line connected to the land. Thus, the distance can be calculated using a wiring pattern that is close to the land, so that the height of the solder can be calculated more accurately.
In one particular embodiment, the solder height calculation unit includes a wiring height measurement unit for measuring a height of the wiring pattern by obtaining with the image pickup unit an image of the wiring pattern of the substrate in a state after the solder has been applied; a curved approximation surface calculation unit for calculating a curved approximation surface of the substrate at the wiring pattern, based on the height of the wiring pattern measured with the wiring height measurement unit; a solder land height measurement unit for measuring a height of the land including the solder by obtaining, with the image pickup unit, an image of the solder applied on the land of the substrate, the substrate being in a state after the solder has been applied; wherein the height of the solder is measured using a distance, calculated by the distance calculation unit, between a curved approximation surface of the substrate at the wiring pattern calculated by the curved approximation surface calculation unit and the height of the land including the solder measured with the solder land height measurement unit. Thus, the curved approximation surface is calculated for the wiring pattern in the substrate after the solder application, and the height of the solder is measured. Consequently, even if there is a change between the state of the substrate prior to the solder application and the state of the substrate after the solder application, the height of the solder can be calculated accurately.
Another aspect of the invention relates to a three-dimensional shape measurement method for measuring the three-dimensional shape of a member on a substrate. The substrate includes at least one land, which is a region to which solder is applied. The three-dimensional shape measurement method includes a step of storing a distance between a height distribution of a substrate in a predetermined region, which is based on a height from a predetermined reference plane at the predetermined region, which is connected to the land, in the substrate prior to the application of solder, and a height from the predetermined reference plane at the land within the predetermined region, in the substrate prior to the application of solder, and a step of calculating a height of the solder applied on the land of the substrate, using the stored distance.
Thus, a distance between the height of a land and a height distribution of a substrate in a predetermined region, which is based on the height of the predetermined region, is stored. In this case, the height distribution of the substrate at the predetermined region reflects changes due to warping or flexing, even when the substrate is subject to warping or flexing, for example. As a result, the stored distance is stored while suppressing the influence due to distortions of the substrate. Moreover, to calculate the height of the solder, it is possible to use a distance in which the influence of distortions is suppressed, even if the substrate is subject to such distortions after solder has been applied to the substrate, for example, so that it is possible to accurately calculate the height of the solder.
With the present invention, a three-dimensional shape measurement apparatus calculates a height distribution of a substrate in a predetermined region, which is based on the height of the predetermined region. and the distance between this calculated height distribution of the substrate and the height of the lands is calculated. In this case, the height distribution of the substrate at the predetermined region reflects changes due to warping or flexing, even when the substrate is subject to warping or flexing, for example. As a result, the calculated distance is stored while suppressing the influence due to distortions of the substrate. Moreover, to calculate the height of the solder, it is possible to use a distance in which the influence of distortions is suppressed, even if the substrate is subject to such distortions after solder has been applied to the substrate, for example, so that it is possible to accurately calculate the height of the solder.
a) is a diagram showing a substrate prior to the application of solder and
Referring to the drawings, the following is an explanation of a three-dimensional shape measurement apparatus according to an embodiment of the present invention.
The light-projecting unit 11 projects a light pattern onto the surface of the measurement object 15. The light-projecting unit 11 includes a light source 22 that emits light, a projection lens 24, a pattern generation element 26 for shaping the light emitted from the light source 22 into a pattern, and a beam divider unit 27 for making the border between a region 16 irradiated by the light pattern and region 17 not irradiated by the light pattern clear by letting the light beam pass or blocking it. Note that in this embodiment, the projected light pattern that is used is shaped like a sine wave. Moreover, the light-projecting unit 11 is arranged such that its optical axis defines a predetermined angle with the optical axis of the image pickup unit 12. Thus, the height of the measurement object 15 can be calculated based on shifts in the light pattern that is projected onto the measurement object 15.
The image pickup unit 12 picks up an image of the measurement object 15 on which the light pattern is projected, obtaining an image thereof. The image pickup unit 12 includes a line sensor 40 and an image pickup lens 41.
The image analysis/driver control unit 13 analyzes, by fringe analysis, the light pattern included in the image that has been picked up by the image pickup unit 12, calculates the three-dimensional shape of the measurement object 15, and gives various sorts of instructions with the controller 42. Moreover, the image analysis/driver control unit 13 includes a capture board 43 for reading in the image from the image pickup unit 12 as digital data, a CPU (central processing unit) 44 that performs various kinds of controls, and a RAM (random access memory) 45 storing various kinds of information.
The conveyor unit 14 horizontally conveys the measurement object 15 in a main scanning direction (longitudinal direction) of the line sensor 40, and a direction perpendicular to the main scanning direction (referred to in the following as “secondary scanning direction”). The conveyor unit 14 includes a conveyor stage 46 on which the measurement object 15 can be placed, and a servo motor 47 that drives the conveyor stage 46. The three-dimensional shape measurement apparatus 10 is capable of measuring the three-dimensional shape of the entire measurement object 15 by successively picking up images thereof with the line sensor 40 while moving the measurement object 15 in the secondary scanning direction (the arrow direction in
Here, the main scanning direction axis of the line sensor 40 of the image pickup unit 12 is arranged to be parallel to the measurement surface of the conveyor stage 46 and perpendicular to the conveying direction. Thus, the upper surface of the measurement object 15 can be imaged at a uniform magnification by arranging the optical axis of the line sensor 40 parallel to the measurement surface of the conveyor stage 46. Moreover, since the optical axis of the line sensor 40 is perpendicular to the conveying direction, orthogonal portions are picked up as orthogonal portions in the two-dimensional images made up of a plurality of line images picked up while conveying the measurement object.
The following is an explanation of the operation of the three-dimensional shape measurement apparatus 10. First, by giving a command from the image analysis/driver control unit 13 through the controller 42, the servo motor 47 of the conveyor unit 14 sets the conveyor stage 46 to its initialization position. This initialization position determines the image pickup start position in the secondary scanning direction when the image pickup unit 12 picks up images of the measurement object 15. It is preferable that the image pickup region of the image pickup unit 12 is a position that reaches to the edge in the secondary scanning direction of the measurement object 15 placed on the conveyor stage 46 of the conveyor unit 14.
Then, the light-projecting unit 11 projects the light pattern onto the measurement object 15. The image pickup unit 12 scans the measurement object 15 onto which the light pattern is projected, and obtains images of the measurement object 15. The images obtained with the image pickup unit 12 are sent to the image analysis/driver control unit 13, and converted into digital data by the capture board 43. Then, the CPU 44 analyses the light pattern, calculating height information on the measurement object 15. To analyze the light pattern in the images, it is also possible to use spatial fringe analysis.
It should be noted that a method for calculating the detailed height information of the measurement object 15 is known. For example, the methods described in JP 2009-31105A and JP 2007-114071A can be used.
Next, a case is explained, in which an inspection of solder application is carried out by measuring the height of solder applied to a substrate using this three-dimensional shape measurement apparatus 10. First of all, the substrate is explained.
The lands 30 and the wiring pattern 31 are connected by a conductive line or the like inside the substrate 25, and their respective heights (indicated by the lines L and R in
Next, the state of the three-dimensional shape measurement apparatus 10 when inspecting the solder application is explained.
Here, a case is explained, in which the height of the solder 29 applied to the substrate 25 is measured to inspect the height of the solder 29.
First, as shown in
Then, after the teaching step has been finished, solder 29 is applied. After this, a substrate 25 to which solder has been applied, as shown in
Next, the teaching step in S13 is explained with reference to
Then, an approximation surface of the wiring pattern is prepared for the inspection block 35 (S22). This approximation surface is a plane or a second order surface (referred to as “curved surface” below).
Here, the approximation surface Sr of the wiring pattern is expressed by the following equation. Note that “a” to “f” are coefficients.
z=ax
2
+by
2
+cxy+dx+ey+f (1)
The specifics of the process of preparing the approximation surface Sr of the wiring pattern are explained further below.
Also an approximation surface of the lands is prepared (S23) for the inspection block 35. Here, the approximation surface Sl of the lands is expressed by the following equation. Note that “a” to “e” and “g” are coefficients, and “a” to “e” are the same coefficients as for the approximation surface Sr of the wiring pattern.
z==ax
2
+by
2
+cxy+dx+ey+g (2)
The approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands are regarded as parallel. The specifics of the process of preparing the approximation surface of the lands are explained further below.
Then, based on the approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands that have been prepared, the offset is calculated (S24). This offset is a value that is used when measuring the height of the solder 29. Then, the calculated offset is stored in the RAM 45 (S25). The specifics of the process of calculating the offset are explained further below. The processing of these Steps S22 to S25 is repeated for each of the plurality of inspection blocks.
Next, referring to
Then, using the positions of the selected regions 35b for offset calculation, that is, the coordinates (x, y, z) indicating the x-position, the y-position and the z-position, the coefficients (a to f) of the approximation surface Sr of the wiring pattern are calculated (S35). Here, the coordinates (x, y) are the values on the image when picked up with the image pickup unit 12, and the coordinate (z) is the value measured in S34. Thus, the approximation surface Sr of the wiring pattern is prepared. That is to say, the approximation surface Sr of the wiring pattern expresses a height distribution of the wiring pattern. Here, the CPU 44 serves as an approximation surface calculation function 56, that is, as a distribution calculation unit.
If the condition is not satisfied in S33 (NO in S33), then the region of the image obtained in S31 is enlarged, and the processing from S32 on is carried out again (S36). Here, the CPU 44 serves as an image enlargement judgment function 52.
Next, the processing for preparing the approximation surface of the lands in S23 is explained with reference to
Then, the coefficients (a to e), which are the same as the coefficients (a to f) of the approximation surface Sr of the wiring pattern, are read out (S44), and using the position of the extracted land regions 35c, that is, the coordinates (x, y, z) indicating the x-position, the y-position and the z-position, the coefficient (g) of the approximation surface Sl of the lands is calculated (S45). The coordinates (x, y) are the values on the image when picked up with the image pickup unit 12, and the coordinate (z) is the value measured in S43. Thus, the approximation surface Sl of the lands is prepared. Here, the coefficients other than the coefficient (f) indicating the height direction of the approximation surface Sr of the wiring pattern are the same for the approximation surface Sl of the lands, and the approximation surface Sr of the wiring pattern is parallel to the approximation surface Sl of the lands.
Referring to
Referring to
Moreover, a solder region is extracted from the inspection block (S63), and the offset (OffL) that was stored in the RAM 45 in S54 is read out (S64). Here, the CPU 44 serves as a solder extraction function 55 and as a land offset read-in function 62. Moreover, the height of the solder 29 in the extracted solder region is calculated (S65). Here, the CPU 44 serves as a height measurement function 57 and a land offset subtracting function 59, that is, as a solder height calculation unit. Based on the calculated result, it is inspected whether the solder quality is good or poor. Here, the CPU 44 serves as an inspection function 60.
The following is a detailed explanation of a method for calculating the height of the solder 29 in S65. Here, the method for calculating the height of the solder 29 at the measurement point P is explained, under the premise that the measurement point P is included in the extracted solder region in S63.
First, the length of AC is calculated. Here, the point A is a point on the approximation surface SR of the wiring pattern, so that (Xp, Yp) is inserted into (x, y), and the length of AC is calculated by the following equation.
Za=aXp
2
+bYp
2
+cXpYp+dXp+eYp+f (3)
Here, Za is the length of AC.
Then, the length of PC is calculated. That is to say, the height of the measurement point P is measured. The measurement point P is a point on the solder 29, and this solder 29 is applied on the land 35c. Consequently, the height of the measurement point P is the height of the land 35c, which includes the solder 29. Here, the CPU 44 serves as a solder land height measurement unit.
Then, the angle θ defined by the x-axis and the tangent La at the point A on the approximation surface SR of the wiring pattern is calculated.
When (Xp, Yp) is inserted into (x, y) in this equation, then the following equation is obtained and the angle θ can be calculated.
tan θ=2aXp+cYp+d (5)
∴θ=arctan(2aXpcYp+d) (6)
Moreover, Lp is the line through the measurement point P and parallel to the tangents La and Lb, and Lt is the line through the point A and perpendicular to La, Lb and Lp. M is the point of intersection between Lp and Lt, and N is the point of intersection between Lb and Lt.
Moreover, when D is the height of the solder 29, then D can be calculated as D=AN−AM. That is to say, in this case, the reference for measuring the height D of the solder 29 is the height of the land calculated from the offset. Here, the length of AN is the value of OffL that has been read out in S64, the length of AM is AP cos θ, and the length of AP can be calculated as AC−PC. As a result, D can be calculated with the following equation.
D=OffL−(AC−PC)cos θ (7)
The processing of these Steps S62 to S65 is repeated for each of the plurality of inspection blocks.
Thus, the three-dimensional shape measurement apparatus 10 according to this invention calculates the height distribution in a predetermined region based on the height of a predetermined region, here, the height of the wiring pattern, and calculates the distance (offset) between this calculated height distribution and the height of the lands. In this case, even when the substrate 25 is subject to warping or flexing, the height distribution in the predetermined region reflects the change due to this warping or flexing. As a result, the influence of distortions of the substrate 25 on the calculated distance is suppressed. Moreover, even when the substrate 25 is subject to distortions, for example after applying the solder 29 to the substrate 25, to calculate the height of the solder 29, a distance is used in which the influence of such distortions is suppressed, so that the height of the solder 29 can be calculated accurately.
Moreover, in this case, the offset is a value that is calculated in consideration of both the wiring pattern and the lands, so that it is not calculated only from the wiring pattern, as conventionally, and the height of the solder 29 can be calculated more accurately.
Also, in this case, the offset is calculated for the substrate 25 prior to the application of solder, and the approximation surface of the substrate 25 is calculated again for the wiring pattern with the substrate 25 after the application of solder, and then the height of the solder 29 is measured. Consequently, even when there is a change between the state of the substrate 25 prior to the application of solder and the state of the substrate 25 after the application of solder, the height of the solder 29 can be calculated accurately.
Moreover, in this case, it is possible to calculate the height of only the solder 29, the quantitative solder amount determined in accordance with an industrial standard or the like can be employed for an inspection, and the inspection can be carried out properly.
Moreover, ordinarily the warping or flexing of the substrate 25 differs among different substrates 25. However, in this case, it is possible to calculate the height of the solder 29 by calculating the offset for each substrate 25 individually, so that the height of the solder 29 can be calculated accurately for each substrate 25 individually.
It should be noted that the above-described embodiment was explained for an example with a second-order surface, but there is no limitation to this, and it is also possible to employ a plane or a surface of another shape. In this case, the approximation surface Sr of the wiring pattern in S22 given by Equation (1) and the approximation surface Sl of the lands in S23 given by Equation (2) can be given by the following equations:
z=f(x,y,OffL) (8)
Moreover, when (Xp, Yp) is inserted into (x, y) when calculating the length of AC, it can be given by the following equation.
Za=f(Xp,Yp,OffL) (9)
Moreover, the equation for calculating the angle θ defined by the x-axis and the tangent La at the point A on the approximation surface SR of the wiring pattern as shown in Equations (5) and (6) can be given by the following equation:
∴θ=arctan θ (11)
In the above-described embodiment, an example has been described, in which the wiring pattern is employed as a predetermined region, however there is no limitation to this, and it is also possible to use a region of resist near a land, or any other region.
Furthermore, in the above-described embodiment, an example was explained in which an offset was calculated by picking up an image with the image pickup unit 12 to measure the height of the wiring pattern and the height of the lands, and this calculated offset was used to calculate the height of the solder, but there is no limitation to this, and it is also possible to calculate the height of the solder by letting a user set an offset value in advance, and using the offset value set in this manner, for example.
In the foregoing, embodiments of the invention have been explained with reference to the accompanying drawings, however the present invention is not limited to the illustrated embodiments. Various modifications and adaptations of the illustrated embodiments are possible within a scope that is identical or equivalent to the present invention.
The present invention can be used advantageously whenever it is necessary to measure the height of solder.
Number | Date | Country | Kind |
---|---|---|---|
2011-040511 | Feb 2011 | JP | national |