Patent Application
20080026334
In order to attain the objectives of the present invention it is preferred to make use of a polymerizable additive which can be cross-linked by UV or EB curing, in order to avoid that the additive is extracted by cleaning with a screen cleaning solution, further showing no disadvantages such as a lowered abrasion resistance or increased appearance of scratches.
It has been found now that (meth)acrylates of a well-defined structure, i.e. curable (meth)acrylate type monomers with more than one (meth)acrylate group per monomer molecule and two or more ethyleneoxy groups per (meth)acrylate group in said monomers, when formulated as an additive for PMMA and coated as an outermost layer or topcoat onto a phosphor screen or scintillator panel, followed by UV or EB curing, result in a remarkable improvement with respect to resistance to cracks.
It is thought that a (meth)acrylate functionality of more than one in the monomers leads to a cross-linked structure, thereby enhancing the strength of the coating, and that presence of two or more ethyleneoxy group per (meth)acrylate group imparts flexibility by means of long flexible linking groups between the (meth)acrylate groups. Such an ethylene oxy group is known by anyone skilled in the art as having a structure in form of —CH2CH2O— units in the chain structure of the polymer.
A photo- or electron beam curable composition according to the present invention thus comprises a polymer or copolymer in combination with a (meth)acrylate type monomer with more than one (meth)acrylate group per monomer molecule and two or more ethyleneoxy groups per (meth)acrylate group in said monomer, wherein the polymer is polymethyl methacrylate or a copolymer thereof.
Said photo- or electron beam curable composition according to the present invention is advantageously applied from a solvent mixture having less than 20 wt % of water, as presence of water in excessive amounts in a coating solution is detrimental for use as a solvent when coming into contact with phosphors, coated in a phosphor layer. This is especially the case when said phosphors have an alkali metal halide based composition, known as being very sensitive to humidity or moisture.
In order to allow the photo-curable composition according to the present invention to be curable, e.g. with UV radiation, said composition essentially comprises a photoinitiating system, i.e. in form of a photo initiator.
For EB curing, no photoinitiating system is required.
According to the present invention the photo-curable composition is in form of a solution in order to provide a layer-forming formulation, providing ability to be coated. The screen or panel according to the present invention thus comprises a support and a phosphor or scintillator layer thereupon, wherein said phosphor or scintillator layer is covered with the layer-forming formulation disclosed hereinbefore, in form of a dried layer obtained after photo or electron beam curing.
According to the present invention, in favor of image sharpness, the said dried layer obtained after photo or electron beam curing has a thickness of at most 30 μm, preferably in the range from 1 μm to 15 μm, and even more preferably in the range from 2 μm to 6 μm.
According to the present invention, in said screen or panel, covered with the photo-cured or electron beam cured layer-forming formulation as set forth hereinbefore, said phosphor is a powder phosphor.
A phosphor screen or panel according to the present invention preferably has, as a phosphor composition a lanthanide activated alkaline earth metal fluorohalide type phosphor.
As a photostimulable or storage phosphor present in a screen or panel in form of a powder preferably has a BaFBr:Eu-type phosphor composition. In a particular embodiment thereof said phosphor is a Ba(Sr)FBr:Eu-type phosphor. In another embodiment a photostimulable storage phosphor screen or panel has as a storage phosphor in form of a powder a (Ba,Sr)F1+xX1−x phosphor, wherein 0<x<0.1 and wherein X is one of Br or I or a combination thereof. Such a storage phosphor is advantageously prepared by a method comprising multiple firing steps and multiple milling steps, each firing step being followed by a milling step, and wherein each of said milling steps are performed in a continuous milling procedure, characterized in that at least said last milling procedure is performed at a milling rate higher than the former milling procedures. As a final step after a last thermal treatment step a last milling step is advantageously performed at a milling rate of not less than 8000 rpm further according to the method of the present invention said last milling step is performed by air-jet milling, i.e., preferably performed in an air-jet mill. Examples of the shape of powdery grains may include a rectangular parallelopipedon, a regular hexahedron, a regular octahedron, a tetradecahedron or a polyhedron as a general shape. In the steps before starting firing procedures, it is not excluded to make use of precipitation techniques as known from U.S. Pat. Nos. 6,531,073 and 6,638,447; from published US-Application 2006/108565 or from PCT-Application WO 2006/54532. It is moreover general knowledge that sharper images with less noise are obtained with phosphor particles of smaller mean or average particle size, but otherwise, it is well-known that light emission efficiency declines with decreasing particle size. Thus, the optimum mean or average particle size for a given application is a compromise between imaging speed and image sharpness desired. Until now preferred average grain sizes of the phosphor particles are in the range of 2 to 30 μm and more preferably in the range of 2 to 20 μm in particular for BaFBr:Eu type phosphors. As in U.S. Pat. No. 6,383,412 such a phosphor may have a grain size median diameter (Dm) in the range from 1 to 10 μm, a standard deviation on the average grain size of 50% or less for grains having a grain aspect ratio within the range of from 1.0 to 2.0. In dedicated applications like mammography, it is however recommended, in favor of screen-structure noise reduction in the plate to have a d99g—expressing a grain size limit above which not more than 1% by weight of phosphor powder particles is present as derived from a phosphor weight distribution—smaller than 15 μm and, even more preferable, smaller than 10 μm as has been disclosed in EP-A 1 770 718. The stimulable phosphor layer may be formed on a support by a known method. First, a stimulable phosphor and a binder are added into a solvent, and these substances are well mixed to thereby prepare a coating liquid having the stimulable phosphor uniformly dispersed in the binder solution. Although the ratio between binder and stimulable phosphor may vary depending on the desired characteristics of the radiographic image storage panel, the type of stimulable phosphor, and other factors, the weight ratio of binder to stimulable phosphor is generally selected from a range of from 1:1 to 1:100 and more preferably from a range of from 1:8 to 1:40. The coating liquid containing the stimulable phosphor and the binder, is then coated uniformly on the surface of a support to thereby form a coating film. This coating operation may be performed by using a conventional coating means such as a doctor blade, a roll coater and a knife coater, without however being limited thereto.
In another embodiment, in said screen or panel, covered with the photo-cured or electron beam cured layer-forming formulation, said phosphor is a needle-shaped phosphor. In a more particular embodiment, when said phosphor has been vapor deposited onto a support in a vapor depositing system by heating or by electron beam vaporization, said phosphor is a binderless phosphor.
In that case a radiation image phosphor or scintillator panel advantageously has a phosphor layer which comprises vapor deposited needle-shaped phosphor crystals composed of a matrix component and an activator. Said matrix compound is most generally represented by the formula (I)
M1X.aM2X′2.bM3X″3 (I)
Raw materials suitable for use as matrix components preferably are alkali halide salt matrix component(s) and more preferably said alkali halide salt is CsX, wherein X represents Cl, Br, I or a combination thereof.
Activator components preferably are components having as activator element, an element selected from the group consisting of Eu, Tb, Bi, In, Ga, Cs, Ce, Tm, Dy, Pr, Ho, Nd, Yb, Er, Gd, Lu, Sm, Y, Tl, Na, Ag, Cu and Mg.
In a more particular embodiment thereof said vapor deposited needle-shaped phosphor is a photostimulable CsBr:Eu phosphor, as e.g. described in U.S. Pat. No. 6,802,991.
Such a needle-shaped phosphor, arranged in a binderless layer, is manufactured by a vapor deposition method. As examples of vapor deposition methods, a physical vapor deposition method (PVD), a sputtering method, a chemical vapor deposition method (CVD), and vaporization techniques like ion plating method and atomization techniques like electron beam evaporation are well-known. In a method of preparing a radiation image storage panel said phosphor layer is coated onto a support by a technique selected from the group consisting of physical vapor deposition, chemical vapor deposition and an atomization technique. As an atomization technique, electron beam vaporization can be used, as has e.g. been described in U.S. Pat. Nos. 6,740,897 and 6,875,990 and in US-Applications 2002/050570, 2004/075062 and 2004/149931. In the electron beam evaporation technique, an electron beam generated by an electron gun is applied onto the evaporation source and an accelerating voltage of electron beam preferably is in the range of 1.5 kV to 5.0 kV. By applying the electron beam technique, the evaporation source of matrix component and activator element is heated, vaporized, and deposited on the substrate. Physical vapor deposition techniques are particularly suitable for use in the deposition of binderless needle-shaped crystals in the phosphor layer of the present invention, such as resistive heating, sputtering and RF induction techniques. Resistive heating vacuum deposition, may advantageously be applied as has been described e.g. in U.S. Pat. Nos. 6,720,026; 6,730,243 and 6,802,991 and in US-Application 2001/007352. This technique is recommended as a method in order to vapor deposit the needle-shaped binderless storage phosphors for a panel according to the present invention. In the resistance heating evaporation, the evaporation sources are heated by supplying electrical energy to the resistance heating means: crucible or boat configurations—preferably composed of refractory materials—in a vapor deposition apparatus, in order to practically realize a homogeneous deposit of vapor deposited phosphor material may be applied as has e.g. been disclosed in US-Applications 2005/000411, 2005/000447 and 2005/217567.
Vapor deposition of a phosphor layer at high temperatures is performed as a process providing high phosphor packing densities, preferably in the range from 60% to 90%. Said vapor deposition process is advantageously performed in a vapor deposition chamber under low pressure by heating selected raw materials. As described in U.S. Pat. No. 6,802,991 depositing of the europium doped cesium halide phosphor on a substrate has been performed by a method selected from the group consisting of physical vapor deposition, chemical vapor deposition or an atomization technique, like e.g. electron-beam deposition or plasma chemical vapor deposition. Besides controlling vapor pressure (e.g. under medium vacuum in the range from 0.05 to 10 Pa as in US-A 2005/0077478 or at a pressure in the range of 0.3 to 3 Pa in the presence of an inert gas as e.g. argon or nitrogen as in US-A 2004/149929 or even to a pressure of less than 0.01 Pa as in U.S. Pat. No. 6,802,991) and substrate temperature as in that U.S. Pat. No. 6,802,991; and also as has been set forth in U.S. Pat. No. 6,720,026 wherein the support has been cooled before the vapor stream causes deposition of vaporized phosphor onto the support, it is recommended that the evaporation source has a water content of not more than 0.5 wt %, as has been set forth in US-A 2003/113,580. Vapor deposition in a vacuum deposition apparatus as in the present invention thus requires adjustment of a predetermined degree of vacuum. For a binderless needle-shaped storage phosphor layer in a panel according to the present invention, formation of said phosphor under a high vacuum is desirable: the degree of vacuum of 1×10−5 to 5 Pa, and, more specifically, from 1×10−2 to 2 Pa is desired, wherein an inert gas, such as an Ar or Ne noble gas, or alternatively, an inert gas as nitrogen gas, may be introduced into the vacuum deposition apparatus. Evacuation in order to give an even lower inner pressure of 1×10−5 to 1×10−2 Pa is more preferred for electron beam evaporation. Introduction of oxygen or hydrogen gas may be advantageously performed, more particularly in order to enhance reactivity and/or e.g. in an annealing step. Introduction of an inert gas can moreover be performed in favor of cooling the vapor stream before deposition onto the titanium (alloy) substrate and/or the substrate, whereupon phosphor vapor raw materials should be deposited as disclosed in U.S. Pat. No. 6,720,026. Alternatively one side of the support may be heated while the other side may be cooled while performing vapor deposition as disclosed in U.S. Pat. No. 7,029,836.
The process of vacuum vapor deposition, may comprise the steps of heating to vaporize an evaporation source comprising a phosphor or its starting raw materials by means of a resistance heater or an electron beam, and depositing and accumulating the vapor on a substrate such as a metal sheet to form a layer of the phosphor in the form of columnar crystals in one binderless layer. As described in US-A 2004/0149929 or in US-A 2006/0054862 multiple prismatic stimulable phosphor crystal layers standing at the phosphor matrix compound layer or an amorphous crystal layer standing upon and having the same composition as the stimulable phosphor may be deposited. Multivapor deposition may be preferred because the vaporization rate of each source can be independently controlled in that case, in order to incorporate the activator uniformly in the matrix, even if the compounds have very different melting points or vapor pressures. According to the composition of the desired phosphor, each evaporation source may contain the matrix compound or the activator compound only or a mixture thereof, optionally in the presence of additives if required. Three or more sources may even be used. For example, in addition to the above-mentioned sources, an evaporation source containing optional additives may be used. In the case wherein a phosphor layer is formed by multi-vapor deposition or co-deposition, at least two evaporation sources are used: one of the sources contains a matrix compound of the phosphor, while the other contains an activator compound. The multi-vapor deposition is preferred in cases wherein the vaporization rate of each source should be independently controlled in order to incorporate the activator in a more uniform way in the matrix as is the case when said compounds have very different melting points or vapor pressures. According to the composition of the desired phosphor, each evaporation source may consist of the matrix compound or the activator compound only or otherwise may be a mixture thereof with additives. Three or even more sources may thus be used. The matrix compound of the phosphor may be either the matrix compound itself or a mixture of two or more substances that react with each other to produce the matrix compound. The activator compound generally is a compound containing an activating element, and hence is, for example, a halide or oxide of the activating element as e.g. described in US-A 2005/0133731. The temperature of the substrate generally is kept in the range of from 20° C. to 350° C., preferably in the range of 100° C. to 300° C. and even more preferred between 150° C. and 250° C. The deposition rate, which means how fast the formed phosphor is deposited and accumulated on the substrate, can be controlled by adjusting the electric currents supplied to the crucible heaters in the vapor depositing apparatus. The deposition rate generally is in the range of 0.1 to 1,000 μm/min, preferably in the range of 1 to 100 μm/min. It is not excluded to perform a pretreatment to the support, coated with the sublayer as in the present invention: in favor of an enforced drying step, the layer arrangement before phosphor deposition may be held at a high temperature during a defined time. It is even not excluded to increase the percentage of relative humidity until the surface of the sublayer starts hydrating, in order to get a smooth base for the phosphor layer. Efficient deposition of the storage phosphor layer onto the substrate however, requires temperatures for the substrate in the range from 50° C. to 250° C. as disclosed in US-Application 2004/081750. Heating or cooling the substrate during the deposition process may thus be steered and controlled as required.
After the deposition procedure is complete, the deposited layer is preferably subjected to heat treatment or annealing procedure, which is carried out generally at a temperature of 100 to 300° C. for 0.5 to 3 hours, preferably at a temperature of 150 to 250° C. for 0.5 to 2 hours, under inert gas atmosphere which may contain a small amount of oxygen gas or hydrogen gas. Annealing procedures may be applied as described in U.S. Pat. Nos. 6,730,243; 6,815,692 and 6,852,357 or US-Appl. 2004/0131767, 2004/0188634, 2005/0040340 and 2005/0077477.
In the screen or panel according to the present invention said phosphor is a photostimulable phosphor as applied in CR technology. The photostimulable screen or panel is coated onto a so-called “powder image phosphor” or “PIP” screen (preferably coated with europium doped barium fluorobromide phosphor particles) or onto a “needle image phosphor” plate also called “NIP” screen (preferably coated by vapor deposition with CsBr:Eu needle-shaped crystals). Said needle-shaped crystals present in a binderless layer may be scraped off from the support whereupon vapor deposition has been applied, optionally milled in order to reduce the length of the needles (normally in the range from 100 up to 1000 μm), and coated after having been dispersed in a binder and forming a pseudo-PIP screen.
In the method of curing a layer-forming formulation according to the present invention, curing proceeds by ultra-violet radiation or by electron beam curing.
Moreover in the method according to the present invention, curing proceeds by ultra-violet radiation or by electron beam curing. More in particular curing proceeds after coating said layer-forming formulation as a protective coating upon a phosphor layer or scintillator layer present on a support, followed by drying.
In the method according to the present invention, said coating is performed by doctor blade coating or by bar coating.
Embodiments for the layer arrangement of the phosphor or scintillator screen, plate or panel are selected from following.
The layer arrangement of the screen or panel is normally so that, coated upon a support layer, there is an intermediate layer between support and phosphor layer (such as parylene as disclosed in US-A 2004/0051441 and US-A 2004/0051438 or another, e.g. dye-containing layer as in U.S. Pat. No. 6,927,404) wherein such a parylene layer may also be present between phosphor layer and outermost protective layer or topcoat as in U.S. Pat. No. 6,710,356 or as described in U.S. Pat. No. 6,822,243. A good adhesion between the two protective layers is advantageously provided when use is made of a phosphoric acid ester compound as disclosed in US-A 2005/0067584. The parylene layers mentioned above are particularly recommended to be applied as layers protecting the phosphor or scintillator from moisture, as is appreciated well when use is made of alkali metal halide scintillators or phosphors, known as being very sensitive to humidity of the environment.
The support can be any support known in the art: any solid of an organic or inorganic nature, which can assume any geometrical shape, such as foils, fibers (e.g. carbon fiber reinforced resin sheets and more particularly sheets, each of which includes carbon fibers arranged in a direction and impregnated with a heat resistant resin such that directions of the carbon fibers in the carbon fiber reinforced resin sheets are different from each other), and particles can be used. As an inorganic non-metallic support chemically reinforced glass or crystallized glass can be used. Inorganic metallic supports, suitable for use are, e.g. metal substrates such as those of aluminum, titanium, lead, iron, copper, steel, molybdenum, beryllium; supports of metallic and non-metallic oxides such as those of aluminum, titanium, lead, copper, beryllium, manganese, tungsten, vanadium, and silicon oxides.
As an organic support a polyimide sheet, epoxy compounds and thermoplastic and thermosetting compounds of different compositions, polyether, polyester and polycarbonate compositions may be used, without however being limited thereto. It is recommended to subject the support to cleaning procedures as to washing and degreasing before applying a protective layer unit or arrangement as set forth above.
According to the present invention a panel is preferred, wherein the phosphor layer is a photostimulable phosphor layer, also called “storage phosphor layer”. This does not mean that the conventionally known prompt emitting phosphor layers in intensifying screens as well as scintillators in scintillator panels may not take profit form the topcoat according to the present invention, as those panels are also sensitive to mechanical damage and to organic cleaning solutions.
When a storage phosphor screen with a topcoat layer has protruding beads it is important that the beads do not touch mechanical parts of the scanner and that this is true even when the storage panel shows some wobble during transport in the scanner. Therefore beads when used as spacing particles in a storage phosphor screen of the present invention preferably have a median volume diameter, dv50, so that 0.5 μm≦dv50≦25 μm and a median numeric diameter, dn50, so that 0.1≦dv50/dn50≦1.20. Further the beads are preferably adapted to the thickness, t, of the layer B on the storage panel of the present invention so that said polymeric beads have a median volume diameter, dv50, wherein 0.25≦dv50/t≦4.0.
A phosphor panel of the present invention can be a self-supporting panel as well as a panel comprising a support. This support can be any support known in the art, but in view of the desired high humidity resistance of the screens, a support with very low water vapor permeability is preferably used. A preferred support is a support of anodized aluminium and the supports as disclosed in U.S. Pat. No. 6,815,095 and US-Application 2003/0134087.
In a particular embodiment of the present invention the surface of the phosphor layer is smaller than the surface of the support so that the phosphor layer does not reach the edges of the support. Thus a panel with a support having a surface larger than the main surface of the phosphor layer, so that the phosphor layer leaves a portion of the support free, and wherein the protective layer comprising layer A and topcoat layer B covers at least in part the portion of the support left free by the phosphor layer represents a particular embodiment of the present invention as already disclosed hereinbefore. An advantage of such a construction resides in the fact that the edges of the phosphor layer do not touch mechanical parts of the apparatus and are thus less easily damaged during use of the panel, more particularly e.g. during transport in the scanner. Another advantage of this construction is that no special edge reinforcement is necessary (although, if desired, further edge reinforcement can be applied). Although a construction of a phosphor panel wherein the surface of the phosphor layer is smaller than the surface of the support, so that the phosphor layer does not reach the edges of the support, represents a specific embodiment of the present invention, such a construction can be beneficial for the manufacture of any phosphor panel covered with any protective layer known in the art.
In the case wherein between the support material and the phosphor layer a parylene layer is present, the surface roughness of the covered support shows a better smoothness as surface roughness decreases (preferably 0.5 or less and even more preferably 0.1 or less), as described in US-A 2004/0051438 which may be in favor of depositing columnar crystals or needles having smaller diameters, thereby leading to an improved packing density of the said needles per square unit of the surface area of the vapor deposited photostimulable phosphor layer and improved sharpness or image definition. More details about dimensions of such columnar, needle-shaped or cylindrical phosphors have been disclosed in U.S. Pat. No. 6,967,339.
An advantage of this invention relative to using UV/EB curable monomers or mixtures of monomers which do not contain a polymer such as PMMA, is that the coated material is not fluid or sticky after drying, meaning that the phosphor coating can be rolled up for transportation before the UV/EB curing step.
As a advantageous effect of the present invention the physical stability of the phosphor or scintillator imaging plates has been proved to satisfy the most stringent requirements, in that the image quality is not changed over a long period of frequent use and re-use.
While the present invention will hereinafter be described in connection with preferred embodiments thereof, it will be understood that it is not intended to limit-the invention to those embodiments.
Products used in experiments were:
(1) Elvacite 2041=High molecular weight polymethylmethacrylate, commercially available from Lucite International
(2) (A1) CN435. Ethoxylated(15) trimethylolpropane triacrylate, commercially available from Sartomer
(3) (A2) SR344. Polyethyleneglycol(400) diacrylate, commercially available from Sartomer
(4) (A3) SR610. Polyethyleneglycol(600) diacrylate, commercially available from Sartomer
(5) (A4) SR454. Ethoxylated(3) trimethylolpropane triacrylate commercially available from Sartomer
(6)(A5) SR256. 2(2-ethoxyethoxy)ethyl acrylate, commercially available from Sartomer.
(7) (A6) SR508. Dipropyleneglycol diacrylate, commercially available from Sartomer
(8) (A7) SR349. Ethoxylated(3) bisphenol A diacrylate, commercially available from Sartomer.
(9) (A8) SR238. Hexanediol diacrylate, commercially available from Sartomer
(10) (A9) Pentaerythritol triacrylate, commercially available from Aldrich
Procedure for Forming Coating Formulations and for the Coating Thereof
The formulations were made by adding together the components shown in the Table 1 and stirring until the solid components were dissolved in the solvent mixture.
The solutions were coated with a doctor blade at a wet thickness of 150 microns onto a powder phosphor screen. The coatings were then dried in a ventilated oven at 70° C. for 30 minutes, allowed to cool to room temperature and then passed three times under a Technigraf UL00855 UV lamp with a belt at a speed of 3 m/min.
The coatings were then treated with ethanol by rubbing the coatings 3× with a cotton pad soaked in ethanol.
After allowing to dry and leaving overnight, the phosphor screens were bent round a metal cylinder with a diameter of 20 mm, and then checked with a 20× magnifying glass for cracks.
The powder phosphor screen was prepared as follows, before being coated with the covering protective layers as described above.
Preparation of the Phosphor and the Phosphor Layer
Preparation of the photostimulable phosphor was performed as follows.
Ba0.859Sr0.14Eu0.01F2 was prepared by adiabatic reaction of the appropriate amounts of BaCO3, SrCO3 and Eu2O3 in an aqueous dispersion with HF.
A raw mix was made by thoroughly mixing the following ingredients in the following proportions:
The phosphor was made in 3 firing steps:
First firing step:
Three crucibles, each containing 165 g of raw mix were placed in a quartz tube, which was sealed with a flange having a gas inlet and a gas outlet with water lock. After flushing with N2 for 15 minutes, the quartz tube was placed in a box furnace at 850° C. Dwell time in the furnace was 2 hours and the tube was flushed with N2 at 1.5 l/min.
After that firing the tube was taken out of the furnace and left to cool for 30 minutes while being flushed with N2. Next, the crucibles were taken out of the tube and the powder was deagglomerated with mortar and pestle.
The deagglomerated powder was milled on an Alpine AFG-100 air mill with three 3 mm nozzles, a milling chamber pressure of 3 bar and a wheel rotation rate of 3,500 r.p.m.
Second firing step:
Three crucibles containing 230 g of first fired material each, were placed in a quartz tube, which was sealed with a flange having a gas inlet and a gas outlet with water lock. The quartz tube was immediately placed in a box furnace at 725° C. Dwell time in the furnace was 5.5 hours and the tube was flushed with N2 at 1.5 l/min.
After that firing the tube was allowed to cool in the furnace to 450° C. while being flushed with N2. Next, the tube was opened, taken out of the furnace and allowed to cool further for 30′. The crucibles were taken out of the tube and the powder was deagglomerated with mortar and pestle.
The deagglomerated powder was milled again on an Alpine AFG-100 air mill with three 3 mm nozzles, a milling chamber pressure of 3 bar and a wheel rotation rate of 3,500 r.p.m.
Phosphors prepared in the above described way were used as starting material in order to prepare fine phosphor samples.
The fine phosphors were made by remilling (3rd milling), refiring in the same way as in the second firing and remilling (4th milling) on the Alpine AFG-100 air-jet mill. 3rd and 4th milling rates were 9.000 rpm.
The final fine particle size powder phosphor was seperately dispersed in a binder solution (see phosphor layer composition hereinafter).
Preparation of the Phosphor Layer:
STANN JF95B and KRATON FG19101X were dissolved while stirring in the prescribed amounts in 41.65 g of a solvent mixture from methylcyclohexane, toluene and butyl acetate in ratios by volume of 50:35:15. The phosphors were added thereafter and stirring was further proceeded for another 10 minutes at a rate of 1700 r.p.m. Then the phosphor lacquer was given a ball-mill treatment during 1 min at 1700 r.p.m.
The composition was doctor blade coated at a coating rate of 2.5 m per minute and a thickness of 600 μm onto a subbed 175 μm thick polyethylene terephthalate support and dried at room temperature during 30 minutes. In order to remove volatile solvents as much as possible the coated phosphor plate was dried at 60° C. in a drying furnace.
Results
Results with respect to cracks in the topcoat layer are shown in Table 2.
As is clear from the data given in Table 2, coatings applied according to the present invention show the ability to be frequently cleaned, without being damaged by ethanol treatment and without showing cracks after bending. Moreover it has been established that a satisfactory scratch resistance was present.
It can be seen from these results that only with cured topcoats from formulations having a (meth)acrylate type monomer with more than one (meth)acrylate group per monomer molecule and two or more ethyleneoxy groups per (meth)acrylate group in said monomer, the objectives of the present invention were attained.
Having described in detail preferred embodiments of the current invention, it will now be apparent to those skilled in the art that numerous modifications can be made therein without departing from the scope of the invention as defined in the appending claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 06118158.2 | Jul 2006 | EP | regional |
This application claims the benefit of U.S. Provisional Application No. 60/837,666 filed Aug. 15, 2006, which is incorporated by reference. In addition, this application claims the benefit of European Application No. 06118158.2 filed Jul. 31, 2006, which is also incorporated by reference.
| Number | Date | Country | |
|---|---|---|---|
| 60837666 | Aug 2006 | US |
