The application claims the benefit of Taiwan Patent Application No. 099120876, filed on Jun. 25, 2010, in the Taiwan Intellectual Property Office, the disclosures of which are incorporated herein in their entirety by reference.
The present invention relates to a transfer print structure and the manufacturing method thereof, and more particularly to a transfer print structure and the manufacturing method thereof for use in the color display device.
Recently, the developments of the flat-panel display have matured. Under the promotion of the market, many companies and research units engage in the developments of the display device of the electronic paper. The display device of the electronic paper has the advantages of low power cost, portable convenience, being rolled up and no limitation of the visual angle. The material used for the display device of the electronic paper can be divided into the electrophoretic display material, the electrochromic display material and the twist ball display material. The electrophoresis is formed by charged particles spreading in the suspension solution, and the motion of charged particles can be controlled by applying the electric field to display desired images. Since the particles would influence the reflection of light, the conventional electrophoretic display device only can provide single color display, but not full color display.
New types of electrophoretic display devices provide a color ink layer to solve the problem of not being displayed in full color. According to U.S. Pat. No. 6,228,543 B1, a color photo resist layer can be transferred to an electrophoretic layer through thermal transfer.
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Although the color ink layer 106 would adhere to the acceptor substrate 118 after thermal transfer, it will be easy to peel due to a poor adhesive force.
In accordance with an aspect of the present invention, a transfer print structure is provided. The transfer print structure comprises a substrate, a color ink layer and an adhesive device. The color ink layer includes a functional region, and an adhesive device combines the functional region with the substrate.
In accordance with another aspect of the present invention, a method for manufacturing a transfer print structure is provided. The method comprises the following steps: (a) adhering a first substrate to a second substrate; (b) providing a color ink layer including a functional region and a nonfunctional region; and (c) adhering the functional region to the second substrate.
In accordance with a further aspect of the present invention, a method for manufacturing a transfer print structure is provided. The method comprises the following steps: (a) providing a first substrate; (b) providing a color ink layer including a functional region; and (c) adhering the functional region to the first substrate.
When there is no adhesive device between the color ink layer and the acceptor substrate, there has formed an adhesive force therebetween. Through the implementation of the present invention, the adhesive force between the color ink layer and the acceptor substrate indeed can be enhanced. The adhesive device can make the functional region of the color ink layer uneasy to peel from the acceptor substrate.
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed descriptions and accompanying drawings, in which:
a) shows the conventional thermal transfer structure;
b) shows that the conventional thermal transfer structure is irradiated;
c) shows the conventional thermal transfer structure after transferred;
a) shows a transfer print structure according to a preferred embodiment of the present invention;
b) shows another transfer print structure according to a preferred embodiment of the present invention;
a)˜5(d) show a method for manufacturing a transfer print structure according to another preferred embodiment of the present invention; and
a)˜6(d) show a method for manufacturing a transfer print structure according to a further preferred embodiment of the present invention.
The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for the purposes of illustration and description only; it is not intended to be exhaustive or to be limited to the precise form disclosed.
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Then a second substrate 3 is formed, and the second substrate 3 can adhere to the first substrate 2 via an adhesive layer 35. The second substrate 3 comprises a second substrate base 31, a common electrode 32 and an electrophoretic layer 33. The common electrode 32 is formed on the second substrate base 31, and the electrophoretic layer 33 is formed on the common electrode 32. For instance, the electrophoretic layer 33 comprises a plurality of electrophoretic balls 34. In each of the electrophoretic balls 34, there are a plurality of first electrophoretic particles 34b and second electrophoretic particles 34c, the color of the first electrophoretic particles 34b is different from that of the second electrophoretic particles 34c, and all of them are spread in an electrophoretic media 34a. In
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From another preferred embodiment of the present invention, it is known that the method for manufacturing the transfer print structure 6 comprises the following steps: (a) adhering the first substrate 2 to the second substrate 3; (b) providing a color ink layer 53 including a functional region 50 and a nonfunctional region 55; and (c) adhering the functional region 50 to the second substrate 3.
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From a further preferred embodiment of the present invention, it is known that the method for manufacturing the transfer print structure 6 comprises the following steps: (a) providing the second substrate 3; (b) providing the color ink layer 53 including a functional region 50; and (c) adhering the functional region 50 to the second substrate 3.
In accordance with a first embodiment of the present invention, a transfer print structure is provided. The transfer print structure comprises a substrate; a color ink layer including a functional region; and an adhesive device combining the functional region with the substrate.
Preferably, the adhesive device is an adhesive layer disposed between the functional region and the substrate, and is an adhesive material formed in one piece with the functional region to adhere to the substrate.
Preferably, the adhesive device comprises a material being one selected from a group consisting of an epoxy, a poly-urethane, a cyanamide acrylic and a silicon resin.
Preferably, the color ink layer further comprises a nonfunctional region.
Preferably, the color ink layer is a color photo resist layer.
Preferably, the transfer print structure further comprises a heat conversion layer, wherein the color ink layer is disposed between the heat conversion layer and the adhesive device.
Preferably, the adhesive device has a thickness in a range between 0.8˜2.5 μm.
Preferably, the substrate comprises a plurality of electrophoretic balls and a thin film transistor.
Preferably, the thin film transistor comprises a material being one of a silicon semiconductor and an oxide semiconductor.
Preferably, the oxide semiconductor is InGaZnO.
Preferably, the functional region is selectively irradiated to make the functional region be transfer-printed onto the substrate.
Preferably, the transfer print structure further has an adhesive force formed between the functional region and the substrate, and the adhesive force is enhanced by the adhesive device.
Preferably, the transfer print structure further comprises a color filter, a black matrix and a spacer.
In accordance with a second embodiment of the present invention, a method for manufacturing a transfer print structure is provided. The method comprises steps of (a) adhering a first substrate to a second substrate; (b) providing a color ink layer including a functional region and a nonfunctional region; and (c) adhering the functional region to the second substrate.
Preferably, the method further comprises following steps after the step (c): (d) separating the nonfunctional region from the second substrate; and (e) adhering a protecting film to the functional region.
Preferably, the method further comprises a step of selectively irradiating the functional region to make the functional region be transfer-printed onto the second substrate.
Preferably, the transfer print structure has an adhesive force formed between the functional region and the second substrate, and the adhesive force is enhanced by the step (c).
Preferably, the transfer print structure further comprises a heat conversion layer, the color ink layer is a color photo resist layer and disposed between the heat conversion layer and the second substrate, the second substrate comprises a plurality of electrophoretic balls, and the first substrate comprises a thin film transistor.
In accordance with a third embodiment of the present invention, a method for manufacturing a transfer print structure is provided. The method comprises steps of (a) providing a first substrate; (b) providing a color ink layer including a functional region; and (c) adhering the functional region to the first substrate.
Preferably, the method further comprises steps of (d) providing a second substrate including a pixel electrode; and (e) adhering the first substrate to the second substrate by aligning the pixel electrode with the functional region.
Based on the above, the present invention effectively solves the problems and drawbacks in the prior art, and thus it fits the demand of the industry and is industrially valuable.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
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