Claims
- 1. An electronics assembly, comprising:a printed wiring board having a heat sink coupled thereto, said heat sink having a plurality of cooling fins and an electronic device support; an electronic device couplable to said electronic device support; and a device retention clip securing said electronic device to said electronic device support, said device retention clip, including: a resilient strip having an arcuate portion and first and second opposing surfaces extending from said arcuate portion, said first and second opposing surfaces encompassing an electronic device and an electronic device support adjacent said electronic device; and a retaining arm extending from said resilient strip and extending at least partially around said electronic device support thereby to partially retain said electronic device against said electronic device support.
- 2. The electronics assembly as recited in claim 1 wherein said retaining arm is a footed retaining arm.
- 3. The electronics assembly as recited in claim 2 wherein said footed retaining arm wraps around an opposing surface of said electronic device to prevent said device retention clip from accidentally retreating from said electrical device.
- 4. The electronics assembly as recited in claim 2 wherein said footed retaining arm wraps around an opposing surface of said heat sink to prevent said device retention clip from accidentally retreating from said electrical device or said heat sink.
- 5. The electronics assembly as recited in claim 1 wherein said resilient strip has at least one hole located therein dimensioned to receive an extensor portion of said heat sink.
- 6. The electronics assembly as recited in claim 1 wherein said resilient strip is dimensioned to encompass a plurality of electronic devices.
- 7. The electronics assembly as recited in claim 1 wherein said resilient strip is a metallic alloy.
- 8. The electronics assembly as recited in claim 1 wherein said heat sink comprises:a spine having a width and first and second opposing sides, said first and second opposing sides oriented to be abnormal to a substrate when said heat sink is mounted on said substrate; at least two electronic device supports extending generally transverse from said first side, each of said electronic device supports dimensioned to support a heat generating electrical component thereon; and a plurality of cooling fins extending from said spine, each of said plurality of cooling fins having a depth that is substantially less than said width of said spine.
- 9. The electronics assembly as recited in claim 1 wherein said electronic device support is an electronic device support leg.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation in part of U.S. patent application Ser. No. 09/259,772, allowed filed on Mar. 1, 1999, entitled “TRANSVERSE MOUNTABLE HEAT SINK FOR USE IN AN ELECTRONIC DEVICE” to John W. Ayres, et al., now U.S. Pat. No. 6,201,699 which is incorporated herein by reference
US Referenced Citations (23)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/259772 |
Mar 1999 |
US |
Child |
09/624102 |
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US |